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World's largest SiC manufacturer + GaN power/RF devices. Gallium-exposed: GaN-on-SiC requires gallium metal under MOFCOM Dec-2024 export controls. Filed Ch.11 2025; reorganising under CHIPS Act fab support.
🇺🇸 US accounts for 30% of severity-weighted pressure. Regulatory focus shifted from 🇺🇸 US to 🇨🇳 CN in 2026Q3.