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Structured register of government actions in the geoeconomic space — export controls, tariffs, sanctions, FDI screening, subsidies, industrial-policy laws — cross-referenced into the country, minerals, and ETF surface. Charter: docs/IPTM_CHARTER.md.
Severity 1-5 is the qualitative impact rating (1=minor, 5=structural). The bilateral-trade-grounded quant scorer is the next IPTM milestone. RBI (Register Breadth Index) is a complementary structural-breadth indicator from scripts/py/iptm/breadth.py; divergence between RBI and severity is itself informative (high-sev / low-RBI = strategic chokepoint; low-sev / high-RBI = broad but shallow). Every action has at least one primary source URL. Verify-or-don't-file. See also themes, timeline, graph, sankey, map, country exposure, sector exposure, material exposure (+ graph), weekly briefs, portfolio scan, escalation monitor, trans-shipment hubs. Internal triage tools (RSS-poller candidate feed, source-feed health) live under /admin/candidates + /admin/sources. Subscribe via Atom feed (accepts ?country=CN, ?material=lithium, ?issuer=BIS, ?type=export_control, ?etf=SOXX, ?company=NVDA, ?minSeverity=4, ?year=2026, ?q=…) or pull /api/iptm/actions.
The US Bureau of Industry and Security published a correction on 8 November 2023 to a rule it had issued on 17 October 2023 revising the Validated End-User (VEU) authorisations for Samsung China Semiconductor Co. Ltd. and SK hynix Semiconductor (China) Ltd. in the People's Republic of China. The correction fixes two omissions from the October rule: a missing word in the description of eligible items for SK hynix Semiconductor (China) Ltd., and a failure to remove the standalone VEU entry for SK hynix Semiconductor (Wuxi) following its merger into SK hynix Semiconductor (China) Ltd. No substantive policy change is introduced; this is a technical and clerical correction only.
The US Bureau of Industry and Security issued an interim final rule on 17 October 2023 that substantially expanded the advanced-computing and semiconductor manufacturing controls first imposed in October 2022. The rule closed the performance-threshold workaround that NVIDIA had used to ship China-specific A800/H800 GPUs, replacing it with a "performance density" metric and adding a new "Notified Advanced Computing" licence category. It expanded controls on chipmaking equipment (additional ECCNs covering deposition, etch, metrology), pulled 21 additional countries (mostly Middle East / Central Asia) into a regional licensing scheme to prevent transshipment, and added 13 Chinese entities to the Entity List including AI-chip designers.
The US Bureau of Industry and Security revised the Validated End-User (VEU) authorizations for Samsung China Semiconductor Co. Ltd. (Xi'an NAND fab) and SK Hynix Semiconductor (China) Ltd. (Wuxi DRAM fab) on 17 October 2023, expanding each from its previous restricted eligible-items list to cover "all items subject to the Export Administration Regulations." Both authorizations exclude EUV equipment and related components: Samsung China is barred from EUV items for NAND production; SK Hynix is barred from EUV items for DRAM production. The revision was published simultaneously with the broader October 2023 advanced- computing chip controls (FR Doc 2023-22560), giving the two South Korean memory fabs a calibrated safe harbour under the newly tightened regime.
China's Ministry of Commerce and General Administration of Customs jointly announced an export licensing regime covering eight gallium-related items (including gallium metal, gallium arsenide, gallium nitride wafers and ingots) and six germanium- related items (including germanium metal, germanium oxide, germanium tetrachloride). Effective 1 August 2023, exporters must obtain a dual-use-item licence from MOFCOM citing the end-user and end-use, with licences granted at MOFCOM's discretion. The measure was framed as protecting national security and interests, though the timing immediately followed the Dutch ASML DUV controls and US chip-equipment escalations.