Industrial Policy & Trade Monitor· 2665 actions· ✨ 90 recent

On 30 December 2025 the General Office of the Shanghai Municipal People's Government issued Hufubangui [2025] No. 20, a three-year action plan (1 January 2026 - 31 December 2028) to support the transformation and upgrading of advanced manufacturing. The plan sets quantitative targets — 100 new manufacturing enterprises with annual output above CNY 1 billion by 2028 (cumulative 600+), 500 new above-designated-size supply-chain enterprises, 100+ new national-level green factories, a robot density of 600 units per 10,000 workers, and 70%+ digital-equipment penetration — across next-generation electronics, intelligent connected new-energy vehicles, high-end equipment, advanced materials, green low-carbon and fashion consumer-goods industries, plus emerging bets on the low-altitude economy, commercial aerospace, embodied intelligence (robotics) and biomanufacturing. It is funded through tiered direct subsidies rather than tax relief: one-off R&D subsidies up to CNY 10 million, equipment/new-materials cost-share up to 30% of contract value (capped at CNY 20 million), technical- transformation loan/leasing interest support up to CNY 20 million cumulative, and 0.8-1.3% interest subsidies on component/material backup-inventory financing.

On 17 September 2025 the General Office of the Shanghai Municipal People's Government issued Hufubangui [2025] No. 8, a five-year (26 September 2025 - 25 September 2030) state-aid framework to accelerate frontier-technology innovation and cultivate "future industries" across six domains — future manufacturing, future information, future materials, future energy, future space and future health. Targeted technology areas include cell and gene therapy, brain-computer interfaces, biomanufacturing, embodied intelligence (humanoid robotics/AI hardware), fourth-generation semiconductors, silicon photonics, 6G, neuromorphic computing, quantum technology, controlled nuclear fusion and regenerative medicine. Support is disbursed as tiered direct subsidies rather than tax relief, with named ceilings up to CNY 30 million per proof-of-concept/R&D platform and CNY 20 million per high-quality incubator or first-product/batch innovation award.

On 28 July 2025 the General Office of the Shanghai Municipal People's Government issued Hufubangui [2025] No. 6, the "Shanghai Embodied Intelligence Industry Development Implementation Plan" (上海市具身智能产业发展实施方案), a dedicated municipal state-aid package to build Shanghai into a global innovation hub for embodied intelligence (humanoid robotics / physical AI). The plan targets an industry scale of CNY 500 billion by 2027, alongside at least 20 core algorithm/technology breakthroughs, four or more high-quality incubators, and "100-100-100" targets for leading enterprises, applications and products. Support is disbursed as tiered direct subsidies capped at CNY 50 million (30% of project cost) for core-technology R&D, CNY 40 million per company per year for computing-power credits, CNY 20 million (50% of cost) for public-platform construction, CNY 10 million (20% of cost) for application-demonstration projects, CNY 5 million per company per year for language-corpus services, CNY 5 million (5% of contract value) for robot sales/rental incentives, CNY 5 million per open-source project, and CNY 1 million per leading enterprise for standards development. Target application sectors are logistics, industrial manufacturing, retail, healthcare/eldercare and domestic services.

The Legislative Yuan of Taiwan (ROC) passed amendments to Articles 10-2 and 72 of the Statute for Industrial Innovation ("產業創新條例") on third reading on 7 January 2023. The amendment, internationally termed the "Taiwan Chips Act," is implemented from 1 January 2023 to 31 December 2029. Article 10-2 grants Taiwan-registered companies that occupy key positions in international supply chains a 25% investment tax credit on qualifying forward-looking innovative R&D expenditure (capped at 30% of the year's profit-seeking enterprise income tax payable), plus a 5% credit on the purchase of brand-new machinery or equipment used in own-account advanced manufacturing processes (also capped at 30%). Eligibility thresholds set by the Ministry of Finance require annual R&D spend of at least NT$6bn, R&D intensity (R&D / net operating revenue) of at least 6%, and an effective tax rate of at least 15% (12% for FY2023 only); the 5% equipment credit additionally requires equipment expenditure of at least NT$10bn. The measure is Taiwan's principal supply- side response to the US CHIPS Act, the EU Chips Act, the K-Chips Act, and Japan's METI subsidy programme, and is designed to retain TSMC, MediaTek, and other leading-edge silicon investment onshore as overseas subsidies pull capacity to Arizona, Kumamoto, Dresden, and elsewhere.