Industrial Policy & Trade Monitor· 2667 actions· ✨ 89 recent

The US Bureau of Industry and Security issued its largest single export-control package targeting China's semiconductor industry on 2 December 2024, with three layered measures (final rules published in the Federal Register 5 December 2024). First, controls on high-bandwidth memory (HBM) above set performance thresholds — blocking the memory architecture that is foundational to AI training. Second, additions of 24 semiconductor manufacturing equipment item types to the Commerce Control List, covering deposition, etch, ion- implant, advanced packaging, and metrology categories. Third, Entity List designations for 140+ entities, the bulk Chinese semiconductor companies + equipment makers + investment vehicles, including major Chinese fab tooling firms. The package triggered MOFCOM's same-day-following retaliation (filed: 2024-12-03-china-mofcom-ge-ga-sb-export-ban-us).

South Korea's Ministry of Trade, Industry and Energy (MOTIE), in coordination with the Ministry of Strategy and Finance, announced on 15 November 2024 amendments to the Foreign Exchange Transactions Act and the Industrial Technology Protection Act introducing a notification + review regime for outbound investments by Korean firms in advanced semiconductor manufacturing or critical-component production in "strategic concern" jurisdictions, principally China. The regulation, effective 1 April 2025, requires Korean firms whose technology is designated as a "national core technology" (NCT) to obtain MOTIE approval before establishing or expanding overseas manufacturing facilities using that technology. The list includes Samsung's HBM, SK Hynix's DRAM/NAND advanced-node processes, and certain silicon-wafer technologies.

China registered the National Integrated Circuit Industry Investment Fund III Co., Ltd. ("Big Fund III") in Beijing on 24 May 2024 with RMB 344 billion (~USD 47.5 billion) of registered capital — the largest single capital raise of the three Big Fund phases (Phase I 2014: RMB 138.7bn; Phase II 2019: RMB 204bn). Nineteen state-owned investors contribute, led by the Ministry of Finance (17% / RMB 60bn) and the six largest state-owned commercial banks (ICBC, ABC, BoC, CCB ~6.25% each at RMB 21.5bn; BoCom RMB 20bn; PSBC RMB 8bn). Duration 15 years (24 May 2024 → 23 May 2039). The fund explicitly targets the chokepoints exposed by US BIS October 2022/2023/2024 controls — semiconductor manufacturing equipment, advanced memory (HBM/DRAM), AI accelerators, and third-generation compound semiconductors (SiC, GaN).

Ministerial order signed by the French Minister of Economy on 2 February 2024 and published in JORF n°0034 of 10 February 2024 establishing France's first national export-control list under Article 9 of EU Regulation 2021/821 on dual-use goods. The arrêté requires prior authorisation for exports to non-EU third countries of (i) quantum computers and their enabling technologies (qubit devices, control systems, measurement equipment) and (ii) equipment for the design, development, production, test and inspection of advanced electronic components, plus associated software and technology. The annex was substantively replaced by the Arrêté du 27 mars 2025 (explicit technical thresholds including ≥34-qubit systems with C-NOT error ≤10⁻⁴, HBM 6000+ processing performance, cryogenic cooling, dry-etch and EUV-mask tooling, and Si-28/Si-30/Ge isotopically-controlled materials) and is repealed by the Arrêté du 10 mars 2026 with entry into force 11 May 2026.