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Structured register of government actions in the geoeconomic space — export controls, tariffs, sanctions, FDI screening, subsidies, industrial-policy laws — cross-referenced into the country, minerals, and ETF surface. Charter: docs/IPTM_CHARTER.md.
Severity 1-5 is the qualitative impact rating (1=minor, 5=structural). The bilateral-trade-grounded quant scorer is the next IPTM milestone. RBI (Register Breadth Index) is a complementary structural-breadth indicator from scripts/py/iptm/breadth.py; divergence between RBI and severity is itself informative (high-sev / low-RBI = strategic chokepoint; low-sev / high-RBI = broad but shallow). Every action has at least one primary source URL. Verify-or-don't-file. See also themes, timeline, graph, sankey, map, country exposure, sector exposure, material exposure (+ graph), weekly briefs, portfolio scan, escalation monitor, trans-shipment hubs. Internal triage tools (RSS-poller candidate feed, source-feed health) live under /admin/candidates + /admin/sources. Subscribe via Atom feed (accepts ?country=CN, ?material=lithium, ?issuer=BIS, ?type=export_control, ?etf=SOXX, ?company=NVDA, ?minSeverity=4, ?year=2026, ?q=…) or pull /api/iptm/actions.
On 19 March 2026 the German Federal Ministry for Economic Affairs and Energy (BMWE) announced the selection of 38 German projects across 12 federal Länder for the IPCEI Advanced Semiconductor Technologies (IPCEI AST) — the next Important Project of Common European Interest on semiconductors under EU State Aid Article 107(3)(b) TFEU. The federal commitment is EUR 3 billion drawn from the Sondervermögen Infrastruktur und Klimaneutralität (SVIK), the EUR 100 bn special-purpose vehicle enacted via SVIKG in September 2025. The 38 selected projects span AI chips and chiplets, photonic integrated circuits, advanced manufacturing equipment, sensor technologies, and power electronics, with approximately one-third being startups and SMEs. The measure operationalises Germany's Microelectronics Strategy (October 2025) at the project-funding layer and is the first major SVIK semiconductor-tranche deployment.
On 6 February 2026, Texas Governor Greg Abbott announced a USD 14,076,031 grant from the Texas Semiconductor Innovation Fund (TSIF) to Coherent Corp. to accelerate scaled production of 6-inch Indium Phosphide (InP) wafers at its Sherman, Texas facility. The grant supports a broader USD 154 million capital-investment project that will establish what the announcement describes as the world's first 6-inch InP wafer fabrication plant, consolidating Coherent's North American semiconductor operations. InP wafers underpin photonics components used in data-center interconnects, telecommunications, AI compute networking, advanced sensing, and 6G wireless/satellite links. TSIF was established under the Texas CHIPS Act signed by Abbott in 2023.
The US Department of War awarded 5N Plus Inc. (Montreal-headquartered, TSX: VNP) an USD 18.1 million Defense Production Act (DPA) Title III grant to expand germanium recovery and refining capacity at its St. George, Utah facility. The award, announced 30 January 2026 under the "Immediate Measures to Increase American Mineral Production" executive order, funds a roughly sevenfold expansion of zone-refining capacity to more than 20 metric tons of high-purity germanium per year over 48 months, sourced from industrial residues and mining by-products. The germanium feeds optical and solar-cell germanium crystal supply chains used in defense applications.
The US Department of War announced an USD 18.5 million Defense Production Act (DPA) Title III investment in Lattice Materials (Bozeman, Montana) to expand its capacity to produce optical-grade germanium and silicon crystals and to establish a new capability to recover germanium metal from recycled scrap. The award, funded from the Additional Ukraine Supplemental Appropriations Act of 2022, was approved on 26 September 2025 but public announcement was delayed to 22 December 2025 by the federal government shutdown. Lattice is a leading US manufacturer of germanium and silicon infrared optical lenses, windows and mirrors used in defense surveillance, reconnaissance and targeting systems.
On 17 September 2025 the General Office of the Shanghai Municipal People's Government issued Hufubangui [2025] No. 8, a five-year (26 September 2025 - 25 September 2030) state-aid framework to accelerate frontier-technology innovation and cultivate "future industries" across six domains — future manufacturing, future information, future materials, future energy, future space and future health. Targeted technology areas include cell and gene therapy, brain-computer interfaces, biomanufacturing, embodied intelligence (humanoid robotics/AI hardware), fourth-generation semiconductors, silicon photonics, 6G, neuromorphic computing, quantum technology, controlled nuclear fusion and regenerative medicine. Support is disbursed as tiered direct subsidies rather than tax relief, with named ceilings up to CNY 30 million per proof-of-concept/R&D platform and CNY 20 million per high-quality incubator or first-product/batch innovation award.
The European Commission approved a EUR 41.5 million Italian direct-grant state aid measure to Ephos Srl, an Italian photonics SME, to help finance "Fab-2," a new manufacturing facility for glass-based photonic integrated circuits used in AI datacentres, high-performance computing and quantum computing. The aid was cleared under the European Chips Act state aid framework (Commission case SA.117987, decision of 25 July 2025) and forms part of a EUR 104.9 million total project investment. Ephos already operates a first facility (Fab-1) in Milan; Fab-2 is intended to be the first EU facility of its kind processing this glass-substrate photonic chip technology at scale.
The Chips Joint Undertaking, via Horizon Europe grant agreement 101213727 signed 19 June 2025, is co-funding "PIXEurope" (Advanced Photonic Integrated Circuits Pilot Line for Europe), the fifth EU Chips Act pilot line. Fundació Institut de Ciències Fotòniques (ICFO, Spain), the project coordinator, receives EUR 10,112,253.51 in net EU contribution — the coordinator's own tranche of the wider 19-entity, multi-country consortium's EUR 176.05m total project cost (EUR 88.03m in EU/Chips JU contribution), running 1 June 2025 to 31 May 2030. This is a distinct beneficiary filing alongside the parallel TNO (Netherlands) tranche of the same grant agreement, which builds a 6-inch indium-phosphide pilot manufacturing line at High Tech Campus Eindhoven.
The Chips Joint Undertaking, via Horizon Europe grant agreement 101213727 signed 19 June 2025, is co-funding "PIXEurope" (Advanced Photonic Integrated Circuits Pilot Line for Europe), the fifth EU Chips Act pilot line, coordinated by Fundació Institut de Ciències Fotòniques (ICFO, Spain) with a 19-entity, multi-country consortium. Total project cost is EUR 176.05m against EUR 88.03m in EU/Chips JU contribution, running 1 June 2025 to 31 May 2030. TNO (Netherlands) is a lead participant, receiving EUR 13.47m in net EU contribution (EUR 26.94m total eligible cost) to build a 6-inch indium-phosphide photonic-chip pilot manufacturing line at High Tech Campus Eindhoven — part of a wider EUR 193m Dutch national co-investment (Ministry of Economic Affairs, Ministry of Defence, Chips JU, TNO, TU Eindhoven, University of Twente) targeting technological independence in photonic chips for telecom/6G, AI, quantum, defence and medical-diagnostics applications. Global Trade Alert logs a EUR 10.1m figure for the TNO tranche as a "red" state-act intervention (financial grant) on competitive-distortion grounds; this filing anchors on the CORDIS-published grant-agreement figures as the authoritative primary-source numbers.