Industrial Policy & Trade Monitor· 2667 actions· ✨ 89 recent

On 26 December 2025, Japan's Cabinet under Prime Minister Sanae Takaichi approved the FY2026 (Reiwa 8) national budget, which allocates JPY 150 billion (~USD 1bn) to the "Investment Project for Mass Production of Next-Generation Semiconductors" -- a state equity-investment line administered by the Information-technology Promotion Agency (IPA) that funds Rapidus Corporation's 2nm-class logic fab in Chitose, Hokkaido. The FY2026 allocation is 50% larger than the JPY 100 billion IPA equity tranche budgeted for FY2025, taking cumulative government equity in Rapidus to roughly JPY 250 billion. The line sits inside METI's wider AI/semiconductor budget of JPY 1.239 trillion for FY2026 (up roughly 4x year-on-year) under the "AI/Semiconductor Industry Base Strengthening Frame," part of the government's pledge of over JPY 10 trillion in public support for AI and chips through FY2030. The budget takes effect with Japan's fiscal year on 1 April 2026, subject to ordinary Diet passage in early 2026.

On 21 November 2025, METI Minister Yoji Akazawa designated Rapidus Corporation as the official next-generation semiconductor manufacturer under Japan's Act on Facilitation of Information Processing (情報処理の促進に関する法律, as amended by the Cabinet-approved partial-amendment bill of 7 February 2025), following a public solicitation run 3 September – 2 October 2025. The designation makes Rapidus eligible for a multi-year METI funding envelope reported at roughly JPY 1tn (~USD 6.4bn), with an initial JPY 100bn equity investment by the Information-technology Promotion Agency (IPA) planned for FY2025; the funds support Rapidus' Hokkaido (Chitose) IIM-1 fab targeting 2nm GAA mass production from April 2027 and successor 1.4nm / 1nm nodes. The action is the first standalone Rapidus entry in the IPTM register and operationalises the supply-chain pillar of the 2022 Economic Security Promotion Act for advanced logic.

METI committed up to 732 billion yen (~US$4.86 billion) in direct subsidies for Japan Advanced Semiconductor Manufacturing K.K. (JASM) to build a second wafer fab adjacent to the first JASM facility in Kikuyo, Kumamoto Prefecture. Confirmed by METI Minister Ken Saito at the Fab 1 opening ceremony on 24 February 2024, two weeks after TSMC, Sony Semiconductor Solutions, Denso, and Toyota jointly announced the Fab 2 expansion (6 February 2024). Fab 2 will produce 6/7nm and 40nm logic for automotive, industrial, consumer, and HPC end-markets, with combined Fab 1 + Fab 2 capacity exceeding 100,000 12-inch wafers per month. Construction targets year-end 2024; operations target year-end 2027. Combined with the 476 billion yen Fab 1 grant, total JASM subsidies reach ~1.208 trillion yen, the largest single direct manufacturing subsidy in Japanese history. METI conditions require >=10 years of post-startup production and >=50% Japanese-domestic procurement of silicon wafers, materials, and components.

Regulation (EU) 2023/1542 establishes a comprehensive EU statutory framework for all battery categories (portable, SLI, LMT, EV, industrial), imposing supply-chain due-diligence obligations for cobalt, lithium, nickel, and natural graphite; mandatory recycled-content thresholds; carbon-footprint declarations; a digital battery passport; and ambitious collection and recycling-efficiency targets, with rolling application dates running from February 2024 through August 2036. It repeals Battery Directive 2006/66/EC and applies to every economic operator placing batteries on the EU market, binding every EV, consumer-electronics, and stationary-storage supply chain that relies on DRC cobalt, Australian/Chilean lithium, Indonesian/Philippine nickel, and Chinese/Mozambican graphite.

METI committed 476 billion yen (~$3.3bn) in direct subsidies covering approximately half the construction cost of Japan Advanced Semiconductor Manufacturing K.K. (JASM), a purpose-built joint venture fab at Kikuyo Town, Kumamoto Prefecture. JASM shareholders are TSMC (86.5%), Sony Semiconductor Solutions (6%), Denso (6%), and Toyota Motor (1.5 %). The fab manufactures 12nm, 16nm, 22nm, and 28nm mature-node chips targeting automotive-grade, industrial, and IoT applications. A groundbreaking ceremony was held on 13 April 2022; the facility officially opened on 24 February 2024 and reached commercial production in December 2024. JASM represents Japan's first new leading-edge wafer fab in decades and the largest single foreign direct investment in Japanese manufacturing history.

Russian Government Resolution No. 506 of 29 March 2022, signed by Prime Minister Mikhail Mishustin and effective 30 March 2022, authorises the Ministry of Industry and Trade (Minpromtorg) to designate categories of goods exempt from articles 1252(4), 1359(6) and 1487 of the Russian Civil Code on national/regional exhaustion of trademark and other intellectual- property rights. Followed by Minpromtorg Order No. 1532 of 19 April 2022 publishing an initial list of 55 goods categories and named brands — including pharmaceuticals, electronics, automotive parts, mineral fuels, industrial chemicals, paper, textiles, base metals, and consumer goods — for which parallel (grey-market) imports without IP-holder consent are legalised. Designed as a sanctions-circumvention and supply-substitution instrument after the Western corporate exodus of March 2022; extended annually and most recently re-authorised through 31 December 2026.