Industrial Policy & Trade Monitor· 2667 actions· ✨ 89 recent

On 3 June 2026 the European Commission adopted a legislative proposal to amend and substantially expand the EU Chips Act (Regulation (EU) 2023/1781), as part of the European Technological Sovereignty Package. The proposal raises the mobilisation target from €43bn to €120bn, introduces new demand-side "Demand Accelerators" to aggregate public procurement, expands "Grand Challenges" to cover AI-optimised chips, caps permitting at 12 months, and widens the Strategic Partnerships on Semiconductors framework. As a Commission legislative proposal it now enters co-decision (European Parliament + Council) before becoming law; the 2023 regulation remains in force during this process.

The US Bureau of Industry and Security issued a final rule (RIN 0694-AK74, 91 FR 17851, FR doc 2026-06851, signed 7 April 2026, published 9 April 2026, effective 7 April 2026) extending two compliance dates in the January 2025 Foundry Due Diligence (FDD) interim final rule that introduced the "Authorized IC Designer" / "Approved IC Designer" framework for advanced-computing integrated circuits controlled under ECCN 3A090.a. The prior 13 April 2026 cutoff for Authorized IC Designer status — the self-certification pathway available to designers headquartered in Country Group A:1 / A:5 / Taiwan and not parented in Macau or D:5 — is moved to 31 December 2026, and the application window to become an Approved IC Designer is extended to the same date with a subsequent 180-day authorization runway. The rule is a procedural deadline-extension only; it does not change the substantive scope, eligibility criteria, ECCN classifications, or end-use / end-user restrictions of the FDD IFR.

On 12 February 2026, Ambassador Jamieson Greer of the Office of the United States Trade Representative oversaw the signing of the US-Taiwan Agreement on Reciprocal Trade (ART) in Washington, DC. The instrument was signed under the auspices of the American Institute in Taiwan (AIT) and the Taipei Economic and Cultural Representative Office in the United States (TECRO). Headline terms: (i) US IEEPA reciprocal-tariff rate on Taiwan reduced from 20% to 15% and Section 232 auto-parts/timber/lumber rate cut from 25% to 15%; (ii) Taiwan eliminates or reduces 99% of its tariff barriers on US goods, most immediately and the remainder phased over three years; (iii) Taiwan side commits ~USD 85bn in directed purchases through 2029 (USD 44.4bn LNG/crude, USD 15.2bn civil aircraft and engines, USD 25.2bn power equipment); (iv) sectoral chapters covering tariffs, non-tariff barriers, digital trade, economic security, and high-tech supply-chain resilience. Operationally linked to the 15 January 2026 AIT-TECRO Memorandum of Understanding on investment, under which Taiwan pledges USD 250bn in direct Taiwanese-enterprise investment in the US plus USD 250bn in Taiwan-government credit guarantees (USD 500bn total) to fund US-side industrial parks/clusters in advanced semiconductors, energy, and AI manufacturing. Entry into force is conditional on Taiwan's Legislative Yuan completing its review.