Industrial Policy & Trade Monitor· 2665 actions· ✨ 90 recent

On June 8, 2026, the US Department of Defense published its annual update to the Section 1260H Chinese Military Companies (CMIC) list, adding 65 entities (17 new parent companies and 48 subsidiaries), bringing the total to approximately 188–200 designated entities. Major additions span EV and battery manufacturing (BYD, NIO, CATL), consumer internet (Alibaba, Baidu, Tencent), semiconductors (SMIC, YMTC, CXMT), solar (JA Solar, Trina Solar), biotech (BGI Genomics, WuXi AppTec), drones/robotics (DJI, Unitree, RoboSense), and telecoms (TP-Link). Effective June 30, 2026, DoD is prohibited from procuring goods, services, or technology directly from listed entities; effective June 30, 2027, the ban extends to indirect supply-chain procurement through prime contractors and all sub-tiers.

On 3 June 2026 the European Commission adopted a legislative proposal to amend and substantially expand the EU Chips Act (Regulation (EU) 2023/1781), as part of the European Technological Sovereignty Package. The proposal raises the mobilisation target from €43bn to €120bn, introduces new demand-side "Demand Accelerators" to aggregate public procurement, expands "Grand Challenges" to cover AI-optimised chips, caps permitting at 12 months, and widens the Strategic Partnerships on Semiconductors framework. As a Commission legislative proposal it now enters co-decision (European Parliament + Council) before becoming law; the 2023 regulation remains in force during this process.

The European Commission (DG COMP) approved on 20 May 2026 two German State aid measures under the European Chips Act first-pillar 'first-of-a-kind' framework and Article 107(3)(c) TFEU, totalling €288 million. A €222 million grant supports Carl Zeiss SMT GmbH's HNA@SCALE project in Oberkochen (Baden-Württemberg) to industrialise the next generation of High-NA EUV optical columns — the lithography-optic sub-systems integrated by ASML into its High-NA EUV scanners and critical to 2nm-and-below node manufacturing globally. A separate €66 million grant supports Zadient Materials Europe GmbH's SiC-Pro project in Bitterfeld (Saxony-Anhalt) to construct a first-of-a-kind ultra-pure silicon carbide (SiC) source-material manufacturing facility, addressing upstream SiC supply-chain dependence on China (which produces ~80% of global SiC). Both facilities carry cross-border spillover commitments under Chips Act pillar 1.

On 15 April 2026 Japan's Ministry of Economy, Trade and Industry (METI) published the interim summary "Manufacturing Base Strengthening Report" from the Study Group on Strengthening Manufacturing Base in Light of Geopolitical Risks. The report frames Japan's manufacturing base as the source of national power and proposes shifting economic-security support for "autonomy assurance" from "point" measures to "area"-wide measures — expanding the scope of Specified Critical Materials under the 2022 Economic Security Promotion Act (ESPA) beyond narrowly defined inputs to cover foundational petrochemicals (ethylene, propylene, methanol, synthetic rubber) and process-industry technologies (casting, forging), plus components for emerging technologies (humanoid-robot actuators and sensors, lasers for quantum computing). It is the cornerstone framework document operationalising METI's FY2026 strategic-budget package (~¥3.07 trillion overall envelope; ~¥1.23 trillion specifically for semiconductors and AI, including ¥150bn for Rapidus and ¥387.3bn for AI development) as Japan's coordinated response to deepening Chinese export-control pressure on dual-use items, gallium/germanium, graphite, antimony and heavy rare earths.

The Department of Commerce's International Trade Administration published a Federal Register notice on 10 April 2026 (91 FR 18412, doc 2026-06952) opening the inaugural Call for Proposals for the American AI Exports Program established under Executive Order 14320. Proposals are accepted from 1 April 2026 through 5:00 pm EDT on 30 June 2026 from US industry-led "pre-set" consortia offering full-stack American AI export packages — AI-optimised hardware, data pipelines, AI models and systems, security and cybersecurity measures, and sector-specific applications — for presentation by the US government to foreign public- and private-sector buyers. Designated consortia receive priority US-government advocacy, priority consideration for export-control licence engagement, interagency coordination, and federal-financing referrals (EXIM, DFC), with a 14-business-day completeness review and 60-calendar-day designation decision once a proposal is deemed complete.

On 19 March 2026 the German Federal Ministry for Economic Affairs and Energy (BMWE) announced the selection of 38 German projects across 12 federal Länder for the IPCEI Advanced Semiconductor Technologies (IPCEI AST) — the next Important Project of Common European Interest on semiconductors under EU State Aid Article 107(3)(b) TFEU. The federal commitment is EUR 3 billion drawn from the Sondervermögen Infrastruktur und Klimaneutralität (SVIK), the EUR 100 bn special-purpose vehicle enacted via SVIKG in September 2025. The 38 selected projects span AI chips and chiplets, photonic integrated circuits, advanced manufacturing equipment, sensor technologies, and power electronics, with approximately one-third being startups and SMEs. The measure operationalises Germany's Microelectronics Strategy (October 2025) at the project-funding layer and is the first major SVIK semiconductor-tranche deployment.

The Federal Acquisition Regulatory Council (DOD, GSA, and NASA) published a Notice of Proposed Rulemaking on 17 February 2026 (FR Doc 2026-03065, 91 FR 7223) implementing Section 5949(a) of the NDAA FY2023 (Pub. L. 117-263), which bars executive agencies from acquiring electronic products or services containing semiconductor components designed, produced, or provided by SMIC, CXMT, YMTC, or their affiliates. A Part B prohibition extends the restriction to "critical systems" whose subsystems incorporate covered semiconductors regardless of COTS sourcing. The comment period closed 20 April 2026; proposed prohibitions take effect 23 December 2027.

On 12 February 2026, Ambassador Jamieson Greer of the Office of the United States Trade Representative oversaw the signing of the US-Taiwan Agreement on Reciprocal Trade (ART) in Washington, DC. The instrument was signed under the auspices of the American Institute in Taiwan (AIT) and the Taipei Economic and Cultural Representative Office in the United States (TECRO). Headline terms: (i) US IEEPA reciprocal-tariff rate on Taiwan reduced from 20% to 15% and Section 232 auto-parts/timber/lumber rate cut from 25% to 15%; (ii) Taiwan eliminates or reduces 99% of its tariff barriers on US goods, most immediately and the remainder phased over three years; (iii) Taiwan side commits ~USD 85bn in directed purchases through 2029 (USD 44.4bn LNG/crude, USD 15.2bn civil aircraft and engines, USD 25.2bn power equipment); (iv) sectoral chapters covering tariffs, non-tariff barriers, digital trade, economic security, and high-tech supply-chain resilience. Operationally linked to the 15 January 2026 AIT-TECRO Memorandum of Understanding on investment, under which Taiwan pledges USD 250bn in direct Taiwanese-enterprise investment in the US plus USD 250bn in Taiwan-government credit guarantees (USD 500bn total) to fund US-side industrial parks/clusters in advanced semiconductors, energy, and AI manufacturing. Entry into force is conditional on Taiwan's Legislative Yuan completing its review.

On 1 February 2026 Finance Minister Nirmala Sitharaman, presenting the Union Budget 2026-27, announced the launch of India Semiconductor Mission (ISM) 2.0 — the second-phase national semiconductor industrial-policy framework succeeding ISM 1.0 (2021, INR 76,000 crore). The Budget makes an initial INR 1,000 crore provision for ISM 2.0 in FY 2026-27 and raises the Electronics Components Manufacturing Scheme (ECMS) outlay from INR 22,919 crore to INR 40,000 crore. ISM 2.0's distinct architecture centres on four strategic priorities not in ISM 1.0: (i) indigenous semiconductor equipment, chemicals, gases and materials production, (ii) full-stack Indian semiconductor IP design, (iii) industry-led R&D and skills/training centres, and (iv) domestic and global supply-chain integration. Total mission outlay reported as approximately INR 1-1.2 lakh crore (~USD 12-14bn) is being finalised; Cabinet clearance and the formal scheme launch are expected by mid-2026.

South Korea's National Assembly passed the "Special Act on Strengthening and Supporting the Competitiveness of the Semiconductor Industry" (반도체산업 경쟁력 강화 및 지원에 관한 특별법) on 29 January 2026 by 199 votes in favour out of 206 members present, after roughly 18 months of inter-party deadlock. The act establishes (i) a Presidential Commission for Enhancing Semiconductor Competitiveness as the central inter-ministerial coordination body, (ii) a statutory five-year master plan with annual implementation plans, (iii) a dedicated semiconductor industry special account ("반도체산업 특별회계") to ring-fence funding for fabs, materials, parts and equipment, and packaging across the full memory + system-LSI + design + manufacturing supply chain, and (iv) authority to designate semiconductor clusters outside the greater Seoul area with relocation incentives. Promulgation by the Cabinet is expected shortly after passage; effectiveness contingent on enforcement-ordinance finalisation, expected Q3 2026. The KRW 2tn anchor envelope of the special account does not begin disbursing until 2027 because companion amendments to the National Finance Act were not enacted in time.

On 14 January 2026 President Trump issued a Presidential Proclamation under Section 232 of the Trade Expansion Act of 1962 imposing a 25% ad valorem tariff on imports of certain advanced computing chips and their derivative products, effective 12:01 a.m. EST on 15 January 2026. The measure adopts findings of the Section 232 investigation initiated 1 April 2025 (Department of Commerce report transmitted 22 December 2025) into semiconductors, semiconductor manufacturing equipment, and derivative products. Coverage is narrowly drawn to high-performance AI accelerators meeting specified technical parameters (publicly characterised as covering devices in the NVIDIA H200 / AMD MI325X performance tier), with broad use-based exemptions for chips going into US data centres, US R&D, US repairs, and other uses deemed to strengthen domestic supply chains.

The US Bureau of Industry and Security issued a final rule (RIN 0694-AK43, 91 FR 1684, signed 13 January 2026, effective 15 January 2026) revising the EAR license-review policy for exports of certain advanced-computing integrated circuits to end-users in China and Macau from a presumption of denial to case-by-case review. Eligibility is limited to commodities controlled under ECCN 3A090.a and 3A090.b with a Total Processing Performance (TPP) below 21,000 and total DRAM bandwidth below 6,500 GB/s — the band that covers NVIDIA H200 and AMD MI325X-equivalents and below. To qualify, exporters must certify (i) sufficiency of US supply such that the export will not delay domestic orders or divert foundry capacity, (ii) that aggregate TPP of advanced-node ICs exported to China or Macau will not exceed 50% of domestic shipments, (iii) compliance with end-use and end-user prohibitions, and (iv) prior performance review by a qualified independent third-party testing lab headquartered in the United States. The rule is the first material rollback of the October 2022 / October 2023 / December 2024 advanced-computing export-control architecture and operationalises the Trump-administration policy of trading H200-class chip access against Chinese cooperation on critical minerals, fentanyl precursors and Taiwan-strait restraint.

On 7 January 2026 the National Semiconductor and Advanced Electronics Industry Policy Committee (the "Semiconductor Board"), chaired by Deputy Prime Minister and Minister of Finance Ekniti Nitithanprapas, endorsed the Draft National Strategy for the Development of the Semiconductor and Advanced Electronics Industry, prepared by the Board of Investment (BOI) with Roland Berger after a public hearing in October 2025. The 25-year roadmap (2026-2050) targets more than THB 2.5 trillion (~USD 79.6 billion) in investment, training of more than 230,000 highly-skilled engineers, and construction of a complete upstream-to- downstream semiconductor ecosystem with phased milestones for 2030, 2040 and 2050. The strategy prioritises five product groups where Thailand has competitive potential — Power chips, Sensors, Photonics, Analog and Discrete chips — and explicitly aims to move the country beyond OSAT (Outsourced Semiconductor Assembly and Test) into IC design and upstream wafer fabrication ("Made-in-Thailand chips"). Implementation runs through a five-pillar BOI support mechanism: long-term low-interest financing and grants, human-capital development, technology upgrade of the Microelectronics Technology Centre (TMEC), specialised industrial clusters with guaranteed renewable-energy and water security, and streamlined regulatory approvals including a new BOI "FastPass" fast-track facility (16 pilot projects worth THB 170 billion already processed).