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Structured register of government actions in the geoeconomic space — export controls, tariffs, sanctions, FDI screening, subsidies, industrial-policy laws — cross-referenced into the country, minerals, and ETF surface. Charter: docs/IPTM_CHARTER.md.
Severity 1-5 is the qualitative impact rating (1=minor, 5=structural). The bilateral-trade-grounded quant scorer is the next IPTM milestone. RBI (Register Breadth Index) is a complementary structural-breadth indicator from scripts/py/iptm/breadth.py; divergence between RBI and severity is itself informative (high-sev / low-RBI = strategic chokepoint; low-sev / high-RBI = broad but shallow). Every action has at least one primary source URL. Verify-or-don't-file. See also themes, timeline, graph, sankey, map, country exposure, sector exposure, material exposure (+ graph), weekly briefs, portfolio scan, escalation monitor, trans-shipment hubs. Internal triage tools (RSS-poller candidate feed, source-feed health) live under /admin/candidates + /admin/sources. Subscribe via Atom feed (accepts ?country=CN, ?material=lithium, ?issuer=BIS, ?type=export_control, ?etf=SOXX, ?company=NVDA, ?minSeverity=4, ?year=2026, ?q=…) or pull /api/iptm/actions.
Malaysia replaced its four-decade-old Promotion of Investments Act (PIA) 1986 manufacturing-incentive regime with the New Incentive Framework (NIF), effective 1 March 2026. Applications under PIA 1986 closed at 15:00 MYT on 28 February 2026; post-March applications are evaluated under the outcome-based National Investment Aspirations (NIA) Scorecard across six economic-outcome pillars. Companies choose between two mutually exclusive incentive options — a special corporate tax rate or an investment tax allowance — aligned with the Global Minimum Tax environment. A services-sector phase is scheduled for Q2 2026.
Prime Minister Anwar Ibrahim launched Malaysia's National Semiconductor Strategy (NSS) on 28 May 2024 in his keynote at SEMICON Southeast Asia, with implementation led by MITI. The NSS commits at least RM25 billion (~USD 5.3 billion) in fiscal support over a ten-year horizon and structures the chip industrial policy in three sequential phases: (1) shoring up Malaysia's existing strength in outsourced semiconductor assembly and test (OSAT) and back-end packaging, (2) moving domestic firms into integrated-circuit (IC) design, advanced packaging and advanced manufacturing equipment, and (3) developing Malaysian-owned global champions across the chip value chain under a "Made by Malaysia" framing. Headline targets include developing 10 local design and advanced- packaging companies with revenues between RM1 billion and RM4.7 billion, 100 broader semiconductor-related companies near the RM1 billion revenue mark, and training 60,000 high- skilled engineers. The RM25 billion envelope decomposes into RM5 billion in tax forgone over five years, RM2 billion for existing capital grants, RM1.25 billion for an HRD Fund semiconductor allocation, RM2 billion for a Semiconductor Industrial Park, RM1.59 billion for an Advanced Packaging Centre, plus RM2 billion each for the National Energy Transition Facility and Green Tech Financing Scheme. By June 2025, the government reported RM70.7 billion in announced investments attracted under the NSS umbrella.
Malaysia's New Industrial Master Plan 2030 (NIMP 2030) is the fourth-edition national industrial master plan launched on 1 September 2023 by Prime Minister Anwar Ibrahim under the Ministry of Investment, Trade and Industry (MITI). Spanning seven years to 2030, NIMP 2030 adopts a mission-based approach with 4 missions, 21 strategies and 62 action plans, mobilising an RM95bn investment envelope (predominantly private-sector capital channelled through private equity and the capital markets). The plan targets a step-change in manufacturing-sector economic complexity, deeper local-industry linkages and expanded participation in global supply chains, with explicit numerical targets for the manufacturing sector's GDP contribution and annual growth by 2030.