Industrial Policy & Trade Monitor· 2667 actions· ✨ 89 recent

The Government of Andhra Pradesh issued G.O.Ms.No.30 (ITE&C Promotion Wing, 1 August 2025) establishing the Electronics Components Manufacturing Policy 2025-30, a dedicated sub-national subsidy framework designed as a 100% matching top-up of the central MeitY Electronics Components Manufacturing Scheme (ECMS). The policy targets INR 4,600 crore (~USD 550 million) in state fiscal outlay against a USD 50 billion production target and USD 10 billion investment target, with a goal of 5 lakh (500,000) first-time jobs over the policy period. Priority components span 11 categories including displays, camera modules, multilayer PCBs, lithium-ion cells, magnetics, capacitors, and resistors, channelled into dedicated electronics zones at Sri City, Hindupur, Orvakal, and Kopparthy.

Gujarat Chief Minister Bhupendra Patel announced the Gujarat Electronics Component Manufacturing Policy 2025 (GECMP-2025) on 22 June 2025, making Gujarat the first Indian state with a dedicated sectoral stack-on-top instrument to the central Electronics Components Manufacturing Scheme (ECMS) notified by MeitY on 28 March 2025. Under GECMP-2025, any project approved by MeitY under ECMS and physically located in Gujarat is eligible for a state-matched fiscal incentive equal to the central incentive (PLI / capex subsidy) disbursed under ECMS, released by the state within 30 days of the central tranche. The policy targets INR 35,000 cr in new investment and covers multi-layer / HDI printed circuit boards, lithium-ion cells, SMD passive components, display modules, camera modules, sub-assemblies and the capital machinery required for their production. A separate R&D track provides up to INR 12.5 cr per Gujarat-based recognised institution to establish Centres of Excellence, Finishing Schools or Applied Research Laboratories. Initial applications closed 31 July 2025.

MOFCOM Announcement No. 25 of 2025 (18 May 2025) issued the final ruling in the anti-dumping investigation into copolyacetal (共聚聚甲醛, polyoxymethylene copolymer/POM copolymer, an engineering plastic used in automotive parts, electronics and precision components) imported from the United States, the EU, Taiwan and Japan, initiated 19 May 2024 (MOFCOM Announcement No. 18 of 2024). MOFCOM found dumping, material injury to the domestic industry and a causal link, and imposed anti-dumping duties effective 19 May 2025 for a five-year term under Article 38 of China's Anti-Dumping Regulations. Rates: 74.9% for US companies; 42.0% for EU companies; 3.8%-32.6% for Taiwan-region companies (named companies at the low end, "other Taiwan companies" at 32.6%); 33.9%-43.7% for Japanese companies (named companies at the low end, "other Japanese companies" at 35.5% per the 2026 succession notice). On 20 August 2026, MOFCOM Announcement No. 36 of 2026 ruled that Daicel Corporation succeeds to Polyplastics Co., Ltd.'s 35.5% rate and Daicel HPP Taiwan Co., Ltd. succeeds to Polyplastics Taiwan Co.'s 3.8% rate, both following corporate reorganizations, effective 21 August 2026 (filed below as an amendment).

The Union Cabinet, chaired by Prime Minister Narendra Modi, approved the establishment of a sixth semiconductor unit under the India Semiconductor Mission (ISM) on 14 May 2025. The unit is a joint venture between HCL and Foxconn (Hon Hai) and will build an Outsourced Semiconductor Assembly and Test (OSAT) plant near Jewar airport in the Yamuna Expressway Industrial Development Authority (YEIDA) area of Uttar Pradesh, manufacturing display driver chips for mobile phones, laptops, automobiles, PCs and other display-equipped devices. The approved investment is INR 3,700 crore (~USD 435 million), with designed capacity of 20,000 wafers per month and output of 36 million units per month.

Tamil Nadu Chief Minister M K Stalin launched the Tamil Nadu Electronics Components Manufacturing Scheme (TN-ECMS) on 30 April 2025, making Tamil Nadu the first Indian state to introduce a dedicated state-level electronics components manufacturing subsidy designed to stack on top of the central Electronics Components Manufacturing Scheme (ECMS, notified April 2025). The scheme targets ₹30,000 crore (~USD 3.6 bn) in investment and 60,000 jobs over three to five years, supporting 11 high-growth component categories including HDI/MSAP printed circuit boards, lithium-ion cells, display assemblies, camera modules, SMD passive components, multilayer ceramic capacitors, copper-clad laminates, and capital goods for electronics manufacturing. Investment thresholds are ₹50 crore for basic components and up to ₹250 crore for complex sub-assemblies; matching grants mirror the central ECMS subsidy structure with additional state concessions on stamp duty, land, and electricity costs plus workforce-development incentives.

The Union Cabinet approved the Electronics Components Manufacturing Scheme (ECMS) on 28 March 2025, notified by the Ministry of Electronics and Information Technology (MeitY) via Gazette Notification CG-DL-E-08042025-262341 on 8 April 2025. The scheme has an original outlay of Rs 22,919 crore (~USD 2.7bn) over six years (FY26-FY31, with an optional one-year gestation period), raised to Rs 40,000 crore in the Union Budget 2026-27. ECMS targets passive components, multi-layer PCBs, lithium-ion battery cells, camera modules, display assembly, electromechanicals, bare-component sub-assemblies and capital equipment for semiconductor and electronics manufacturing -- the ecosystem feeding the existing large-scale-electronics PLI and the India Semiconductor Mission. The scheme targets investment of Rs 59,350 crore, production of Rs 4,56,500 crore and 91,600 direct jobs.