Industrial Policy & Trade Monitor· 2667 actions· ✨ 89 recent

On 7 January 2026 the National Semiconductor and Advanced Electronics Industry Policy Committee (the "Semiconductor Board"), chaired by Deputy Prime Minister and Minister of Finance Ekniti Nitithanprapas, endorsed the Draft National Strategy for the Development of the Semiconductor and Advanced Electronics Industry, prepared by the Board of Investment (BOI) with Roland Berger after a public hearing in October 2025. The 25-year roadmap (2026-2050) targets more than THB 2.5 trillion (~USD 79.6 billion) in investment, training of more than 230,000 highly-skilled engineers, and construction of a complete upstream-to- downstream semiconductor ecosystem with phased milestones for 2030, 2040 and 2050. The strategy prioritises five product groups where Thailand has competitive potential — Power chips, Sensors, Photonics, Analog and Discrete chips — and explicitly aims to move the country beyond OSAT (Outsourced Semiconductor Assembly and Test) into IC design and upstream wafer fabrication ("Made-in-Thailand chips"). Implementation runs through a five-pillar BOI support mechanism: long-term low-interest financing and grants, human-capital development, technology upgrade of the Microelectronics Technology Centre (TMEC), specialised industrial clusters with guaranteed renewable-energy and water security, and streamlined regulatory approvals including a new BOI "FastPass" fast-track facility (16 pilot projects worth THB 170 billion already processed).

On 15 October 2025 the German Federal Cabinet adopted the Microelectronics Strategy of the Federal Government, jointly presented by the Federal Ministry for Research, Technology and Space (BMFTR) and the Federal Ministry for Economic Affairs and Energy (BMWE). The strategy is the first comprehensive cabinet-adopted German microelectronics policy framework in over a decade and operationalises Germany's contribution to the European Chips Act envelope. It is organised around three pillars — Research, Skilled Labour and Production — and creates a "Chips Office" to coordinate stakeholder interaction and implementation. It establishes a competence centre for chip design and a flagship "supercomputer in the car" project, and is framed as a key implementation instrument under the High-Tech Agenda Germany (HTAD) and as Germany's contribution to the September 29 2025 Semicon Declaration signed by all 27 EU member states calling for a revised EU Chips Act II.

The Defense Production Act of 1950 (Pub. L. 81-774, 64 Stat. 798, codified at 50 U.S.C. §§4501–4568) is the foundational US statute governing wartime and emergency industrial mobilization. Signed by President Truman on 8 September 1950 during the Korean War, the Act empowers the President to compel industrial priority-rated ordering (Title I / DPAS), authorize direct investment in domestic production capacity for critical industries (Title III), and conduct investment security review (Title VII, precursor to CFIUS). Reauthorized approximately 50 times, most recently extended through September 2025 by Pub. L. 115-263 (2018) and further extended under NDAA FY2026; it has been invoked by every Administration since 1950 and has accelerated dramatically since 2020 to target critical-minerals processing, semiconductor manufacturing, battery supply chains, biopharmaceuticals, and energy infrastructure.