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Structured register of government actions in the geoeconomic space — export controls, tariffs, sanctions, FDI screening, subsidies, industrial-policy laws — cross-referenced into the country, minerals, and ETF surface. Charter: docs/IPTM_CHARTER.md.
Severity 1-5 is the qualitative impact rating (1=minor, 5=structural). The bilateral-trade-grounded quant scorer is the next IPTM milestone. RBI (Register Breadth Index) is a complementary structural-breadth indicator from scripts/py/iptm/breadth.py; divergence between RBI and severity is itself informative (high-sev / low-RBI = strategic chokepoint; low-sev / high-RBI = broad but shallow). Every action has at least one primary source URL. Verify-or-don't-file. See also themes, timeline, graph, sankey, map, country exposure, sector exposure, material exposure (+ graph), weekly briefs, portfolio scan, escalation monitor, trans-shipment hubs. Internal triage tools (RSS-poller candidate feed, source-feed health) live under /admin/candidates + /admin/sources. Subscribe via Atom feed (accepts ?country=CN, ?material=lithium, ?issuer=BIS, ?type=export_control, ?etf=SOXX, ?company=NVDA, ?minSeverity=4, ?year=2026, ?q=…) or pull /api/iptm/actions.
On 19 March 2026 the German Federal Ministry for Economic Affairs and Energy (BMWE) announced the selection of 38 German projects across 12 federal Länder for the IPCEI Advanced Semiconductor Technologies (IPCEI AST) — the next Important Project of Common European Interest on semiconductors under EU State Aid Article 107(3)(b) TFEU. The federal commitment is EUR 3 billion drawn from the Sondervermögen Infrastruktur und Klimaneutralität (SVIK), the EUR 100 bn special-purpose vehicle enacted via SVIKG in September 2025. The 38 selected projects span AI chips and chiplets, photonic integrated circuits, advanced manufacturing equipment, sensor technologies, and power electronics, with approximately one-third being startups and SMEs. The measure operationalises Germany's Microelectronics Strategy (October 2025) at the project-funding layer and is the first major SVIK semiconductor-tranche deployment.
The Canadian federal government announced a Strategic Response Fund contribution of up to CAD 210 million (~USD 151 million) toward a CAD 662 million project to expand semiconductor advanced-packaging and R&D commercialisation capacity at IBM Canada's Bromont, Quebec facility and the MiQro Innovation Collaborative Centre (C2MI). The federal contribution covers roughly one-third of total project cost. Ministers Mélanie Joly (Industry) and Evan Solomon (AI and Digital Innovation) announced the investment on 2025-11-28, framing it around domestic supply-chain resilience for AI/HPC, aerospace and defence, telecommunications, and automotive end-markets. The project is projected to create 75 new highly-skilled jobs and sustain over 1,000 existing jobs in the Bromont region.
The Union Cabinet chaired by Prime Minister Narendra Modi approved on 12 August 2025 four new semiconductor manufacturing units under the India Semiconductor Mission (ISM) Phase 1: SiCSem Private Limited (Silicon Carbide compound-semiconductor fab, Odisha, with UK partner Clas-SiC Wafer Fab Ltd.), 3D Glass Solutions Inc. (advanced glass-substrate packaging, Odisha), Continental Device India Private Limited / CDIL (discrete power-semiconductor expansion, Punjab), and Advanced System in Package Technologies / ASIP (OSAT unit with South Korea's APACT Co. Ltd, Andhra Pradesh). Cumulative investment INR 4,600 crore (~USD 525mn); 2,034 skilled jobs at full ramp. This brought total approved ISM Phase 1 projects to 10 across 6 states, with cumulative committed investment of approximately INR 1.60 lakh crore (~USD 18bn).
METI certified a Supply Security Plan (供給確保計画) filed by Nitto Boseki Co., Ltd. under Japan's Economic Security Promotion Act, designating low-thermal-expansion glass cloth for cutting-edge logic IC packaging substrates as a "specified critical good" material input. The certification (plan no. 2025-semicon-3-1, approved 7 August 2025) qualifies Nitto Boseki for a grant of up to JPY 2.4 billion (~USD 16 million) toward a JPY 7.2 billion new production line at its Fukushima No. 2 plant, targeting a roughly 200% increase in domestic capacity for this glass-cloth grade with supply starting July 2027 and a committed 10-year production run.
METI certified a Supply Security Plan (供給確保計画) filed by DIC Corporation under Japan's Economic Security Promotion Act, designating epoxy resin used in semiconductor packaging/encapsulation as a "specified critical good" material input. The certification (plan no. 2025-semicon-2-1, approved 31 July 2025) qualifies DIC for a grant of up to JPY 3 billion (~USD 20.1 million) toward a new epoxy-resin plant at its Chiba (Ichihara) factory, targeting roughly a 59% increase in domestic production capacity for semiconductor-grade epoxy resin, with supply starting July 2029.