Industrial Policy & Trade Monitor· 2669 actions· ✨ 89 recent

On 26 December 2025, Japan's Cabinet under Prime Minister Sanae Takaichi approved the FY2026 (Reiwa 8) national budget, which allocates JPY 150 billion (~USD 1bn) to the "Investment Project for Mass Production of Next-Generation Semiconductors" -- a state equity-investment line administered by the Information-technology Promotion Agency (IPA) that funds Rapidus Corporation's 2nm-class logic fab in Chitose, Hokkaido. The FY2026 allocation is 50% larger than the JPY 100 billion IPA equity tranche budgeted for FY2025, taking cumulative government equity in Rapidus to roughly JPY 250 billion. The line sits inside METI's wider AI/semiconductor budget of JPY 1.239 trillion for FY2026 (up roughly 4x year-on-year) under the "AI/Semiconductor Industry Base Strengthening Frame," part of the government's pledge of over JPY 10 trillion in public support for AI and chips through FY2030. The budget takes effect with Japan's fiscal year on 1 April 2026, subject to ordinary Diet passage in early 2026.

The US Department of War announced an USD 18.5 million Defense Production Act (DPA) Title III investment in Lattice Materials (Bozeman, Montana) to expand its capacity to produce optical-grade germanium and silicon crystals and to establish a new capability to recover germanium metal from recycled scrap. The award, funded from the Additional Ukraine Supplemental Appropriations Act of 2022, was approved on 26 September 2025 but public announcement was delayed to 22 December 2025 by the federal government shutdown. Lattice is a leading US manufacturer of germanium and silicon infrared optical lenses, windows and mirrors used in defense surveillance, reconnaissance and targeting systems.

On 19 December 2025 the Shenzhen Municipal People's Government issued Notice 深府规〔2025〕10号, "Implementation Measures for Further Attracting and Utilizing Foreign Investment" (effective 1 January 2026 - 31 December 2028, superseding 深府规〔2024〕6号). The measures combine market-access steps (advanced-manufacturing FDI access, foreign biomedicine clinical trials, cross-border data-flow pilots) with tiered cash rewards for foreign direct investment: up to RMB 50 million/year (cumulative cap RMB 150 million) for large manufacturing FDI, RMB 5-8 million one-time awards for multinational regional/global headquarters, and up to RMB 6 million one-time awards for foreign-invested R&D centers. Global Trade Alert logged the same state act as two separate interventions split by sector tag.

The US Department of Commerce awarded Crucible Metals, LLC — a subsidiary of South Korea's Korea Zinc — USD 210 million in direct CHIPS Incentives Program funding to build a smelter and critical-minerals processing facility in Clarksville, Tennessee. The facility, styled "Project Crucible," is an advanced replica of Korea Zinc's Onsan complex and is expected to cost roughly USD 6.6 billion in capital expenditure (USD 7.4 billion in total project financing), targeting first production in 2029. At full scale it is designed to produce 13 critical and strategic minerals — including gallium, germanium, antimony, indium, bismuth, tellurium, cadmium and palladium alongside roughly 300,000 tons/year of zinc, 200,000 tons/year of lead and 35,000+ tons/year of copper. As a condition of the award, Korea Zinc committed to give the US government and US customers priority access to its existing Korean-refined output of 10 critical minerals beginning in 2026, and the project separately secured conditional Department of War (Office of Strategic Capital) loan support and FAST-41 covered-project permitting status.

The European Commission approved German State aid of approximately €495 million to GlobalFoundries (Nasdaq: GFS) to support a €1.1 billion expansion of its Dresden 300mm fab (the "SPRINT" project), funding roughly 45% of eligible project costs. The decision was issued alongside a companion approval of ~€128 million for X-FAB's Erfurt MEMS-sensor expansion, together totalling €623 million in German semiconductor state aid under the EU Chips Act's "first-of-a-kind facility" framework. Conditions attached include prioritising EU customer orders during a supply crisis and funding skills/training programmes for engineers.

The Government of Ontario's Invest Ontario Fund agreed to provide Marvell Technology with a grant of up to CAD 17 million to support the company's planned CAD 238 million, five-year expansion of its Ontario R&D workforce. The expansion is aimed at developing next-generation semiconductor solutions for AI data-centre infrastructure, including an 8,000-square-foot optical lab, and is expected to create up to 350 high-value technology jobs at a new office near the University of Toronto plus expanded operations in York Region and Ottawa. Support is subject to Invest Ontario and Marvell reaching a definitive funding agreement.

The Canadian federal government announced a Strategic Response Fund contribution of up to CAD 210 million (~USD 151 million) toward a CAD 662 million project to expand semiconductor advanced-packaging and R&D commercialisation capacity at IBM Canada's Bromont, Quebec facility and the MiQro Innovation Collaborative Centre (C2MI). The federal contribution covers roughly one-third of total project cost. Ministers Mélanie Joly (Industry) and Evan Solomon (AI and Digital Innovation) announced the investment on 2025-11-28, framing it around domestic supply-chain resilience for AI/HPC, aerospace and defence, telecommunications, and automotive end-markets. The project is projected to create 75 new highly-skilled jobs and sustain over 1,000 existing jobs in the Bromont region.

The European Commission approved, under EU State aid rules (Article 107(3)(c) TFEU and the 2022 Chips Act framework), a Czech direct grant of approximately €450 million to Onsemi to support a €1.64 billion investment establishing the EU's first 8-inch, fully vertically-integrated silicon-carbide (SiC) power-semiconductor manufacturing facility in Rožnov pod Radhoštěm. The plant will span SiC crystal growth, 8-inch wafer processing, and power-device fabrication, with commercial output targeted for 2027. The decision is the largest Chips-Act-era state-aid approval for an Eastern European Member State and a cornerstone implementing instrument of the Czech Semiconductor Cluster industrial-policy programme launched in 2024.

On 21 November 2025, METI Minister Yoji Akazawa designated Rapidus Corporation as the official next-generation semiconductor manufacturer under Japan's Act on Facilitation of Information Processing (情報処理の促進に関する法律, as amended by the Cabinet-approved partial-amendment bill of 7 February 2025), following a public solicitation run 3 September – 2 October 2025. The designation makes Rapidus eligible for a multi-year METI funding envelope reported at roughly JPY 1tn (~USD 6.4bn), with an initial JPY 100bn equity investment by the Information-technology Promotion Agency (IPA) planned for FY2025; the funds support Rapidus' Hokkaido (Chitose) IIM-1 fab targeting 2nm GAA mass production from April 2027 and successor 1.4nm / 1nm nodes. The action is the first standalone Rapidus entry in the IPTM register and operationalises the supply-chain pillar of the 2022 Economic Security Promotion Act for advanced logic.

SETT, the operational vehicle of Spain's PERTE Chip programme, announced a EUR 9.5 million public investment in Ideaded, a Viladecans (Barcelona) company developing microchips on alternative substrates to silicon. The funding is earmarked to complete Spain's first pilot plant for silicon-alternative microchips, financed under the Plan de Recuperacion, Transformacion y Resiliencia (NextGenerationEU). Target output is 50 wafers/month (first wafer expected 2026) plus up to 300 million RFID antennas/year, aimed at advanced-computing, AI and defence applications.

On 21 October 2025, the Queensland Government announced an AUD 30 million investment via the Queensland Investment Corporation (QIC) into Silica Resources Australia (SRA), backing the Mourilyan Silica Sands Project roughly 30km south of Innisfail in Far North Queensland, near the Port of Mourilyan. The funding supports plant, equipment and land acquisition for a project producing high-purity silica sand and silica flour used in glass (including display/TFT glass), solar-panel manufacturing, semiconductors, fibreglass composites and foundry applications. Production is targeted to reach 360,000+ tonnes per year within 12 months and 750,000+ tonnes within 5 years, with Japan, South Korea and the US identified as target export markets.

The National Reconstruction Fund Corporation (NRFC), Australia's AUD 15 billion sovereign industrial-financing vehicle, took a AUD 35 million (~USD 23.1 million) equity stake in Morse Micro, announced 23 September 2025. Morse Micro — described by NRFC as Australia's largest semiconductor manufacturer — designs Wi-Fi HaLow chips for long-range, low-power IoT connectivity, with a design and production hub in Picton, regional New South Wales. The investment forms part of Morse Micro's broader AUD 88 million Series C round, led by Japanese semiconductor designer MegaChips and joined by existing investors Blackbird, Main Sequence, and superannuation funds Hostplus, NGS and UniSuper. NRFC frames the deal as strengthening sovereign semiconductor manufacturing capability and supporting skilled jobs in regional NSW.

On 19 September 2025, the European Investment Fund (EIF), part of the European Investment Bank Group, signed a EUR 260 million (USD ~305 million) anchor-investor commitment into Jolt Capital V, a growth-stage deep-technology venture capital fund targeting a EUR 1 billion final close. The commitment is funded largely through the European Tech Champions Initiative (ETCI), an EU-backed programme that has committed over EUR 2.5 billion across 11 scale-up technology funds and aims to mobilise EUR 10 billion in total resources for late-stage European tech companies. Jolt Capital V will invest in growth-stage B2B companies across semiconductors, cybersecurity, AI, industry 4.0, new materials and mobility, sectors the EIB Group frames explicitly around European strategic autonomy and competitiveness.

On 18 September 2025 the Bundestag adopted the Gesetz zur Errichtung eines Sondervermögens "Infrastruktur und Klimaneutralität" (SVIKG), authorising up to EUR 500 bn of additional federal borrowing over a twelve-year horizon outside the constitutional debt brake, on the basis of the new Article 143h Grundgesetz inserted by the March 2025 constitutional amendment. The envelope splits into up to EUR 100 bn for Länder and municipal infrastructure (channelled via the companion Länder- und Kommunal-Infrastrukturfinanzierungsgesetz, LuKIFG, passed 9 October 2025), EUR 100 bn transferred to the Klima- und Trans- formationsfonds (KTF) in annual instalments through 2034, and up to EUR 300 bn for additional federal investments in transport, energy/ heat, hospital, education, digitalisation, civil protection and R&D infrastructure. Investments are eligible retroactively from 1 January 2025 and may be approved through 31 December 2036; loan repayment begins no later than 1 January 2044. SVIKG is the largest single industrial-finance instrument launched by an EU member state in the post-2022 industrial-policy cycle.

On 17 September 2025 the General Office of the Shanghai Municipal People's Government issued Hufubangui [2025] No. 8, a five-year (26 September 2025 - 25 September 2030) state-aid framework to accelerate frontier-technology innovation and cultivate "future industries" across six domains — future manufacturing, future information, future materials, future energy, future space and future health. Targeted technology areas include cell and gene therapy, brain-computer interfaces, biomanufacturing, embodied intelligence (humanoid robotics/AI hardware), fourth-generation semiconductors, silicon photonics, 6G, neuromorphic computing, quantum technology, controlled nuclear fusion and regenerative medicine. Support is disbursed as tiered direct subsidies rather than tax relief, with named ceilings up to CNY 30 million per proof-of-concept/R&D platform and CNY 20 million per high-quality incubator or first-product/batch innovation award.

On 2025-09-12, Shanghai STAR Market-listed chip-equipment maker Piotech Inc. (拓荆科技, 688072.SH) disclosed a CNY 450 million (~USD 63 million) capital increase into its controlling subsidiary Piotech Jianke (Haining) Semiconductor Equipment Co., Ltd. (拓荆键科(海宁)半导体设备有限公司), which develops 3D-integration/hybrid-bonding equipment. Guotou Jixin (国投集新), a vehicle wholly owned (99.9%) by the National Integrated Circuit Industry Investment Fund Phase III ("Big Fund III"), took a 12.71% stake for roughly CNY 192 million, becoming Piotech Jianke's second-largest shareholder; Piotech's own stake fell to approximately 53.57% post-round. The round valued Piotech Jianke's pre-money equity at CNY 2.5 billion — a roughly 44x premium to its RMB 55.2 million book net-asset value as of 2024-12-31 — reflecting Big Fund III's first disclosed equity deployment since its 2024-05-24 establishment.

The European Investment Bank (EIB) signed a EUR 150 million loan agreement with Soitec SA on 10 September 2025 to finance research, development and innovation (RDI) activities and associated capital expenditure for the next generation of engineered substrates (silicon-on-insulator, SOI) used in the semiconductor industry. The financing covers a first industrial deployment line for the new substrate technology plus a related water-treatment facility, against a total project cost of approximately EUR 358 million. The loan was approved by the EIB Board on 16 July 2025 and carries a two-and-a-half-year grace period followed by a ten-year amortization schedule.

On 3 September 2025 South Korea's Financial Services Commission announced an expanded KRW 1 trillion (approx. USD 720 million) Corporate Restructuring Fund No.6 (기업구조혁신펀드 6호), scaling up from the KRW 500 billion originally budgeted in the 2025 first supplementary budget. The fund targets marginal ("한계기업") companies in six export-oriented key industries — petrochemicals, steel, automotive, semiconductors, displays and secondary batteries — whose financial position is deteriorating due to recent US tariff actions. KAMCO ran a fund-manager recruitment call from 3-24 September 2025, selecting four operators to run blind funds, with formation targeted for October 2025. At least 60% of raised capital must be invested in the six target industries, and the subordinated (first-loss) capital contribution ratio was raised from 5% to 10% versus prior restructuring funds to attract private co-investment.

On 22 August 2025 South Korea's National R&D Program Evaluation Steering Committee, convened by MOTIE, finalized an exemption from the mandatory preliminary feasibility study (예비타당성조사 면제) for the "K-On-Device AI Semiconductor Technology Development" project, clearing the roughly KRW 689.15 billion (approx. USD 496 million) program to proceed toward FY2026 budget allocation without the standard multi-year vetting delay. The project funds full-stack development — custom AI chip design, software, and modules — across four demand-anchored industries: automotive (Hyundai Motor), IoT/home appliances (LG Electronics), machinery/robotics (Doosan Robotics, Daedong), and defense (Korea Aerospace Industries). MOTIE structured the program so end-user demand companies participated directly in project planning, pairing them with domestic fabless design and foundry manufacturing firms to build a domestic on-device AI semiconductor ecosystem, ahead of full budget confirmation and formal program launch.

On 22 August 2025 Intel and the Trump administration announced that the US government would acquire a 9.9% equity stake in Intel — 433.3 million common shares at $20.47/share, worth $8.9 billion — funded by converting $5.7 billion in remaining, undisbursed CHIPS and Science Act grants and $3.2 billion from the Department of War's Secure Enclave program into equity rather than paying them as grants. Combined with $2.2 billion already disbursed under Intel's CHIPS award, total federal support reaches $11.1 billion. 274.6 million shares transferred to Commerce at closing on 27 August 2025; the remaining 158.7 million sit in escrow pending Secure Enclave disbursement milestones. The government also received a five-year warrant for an additional 5% of Intel shares at $20/share, exercisable only if Intel's ownership of its foundry business falls below 51%.

The Union Cabinet chaired by Prime Minister Narendra Modi approved on 12 August 2025 four new semiconductor manufacturing units under the India Semiconductor Mission (ISM) Phase 1: SiCSem Private Limited (Silicon Carbide compound-semiconductor fab, Odisha, with UK partner Clas-SiC Wafer Fab Ltd.), 3D Glass Solutions Inc. (advanced glass-substrate packaging, Odisha), Continental Device India Private Limited / CDIL (discrete power-semiconductor expansion, Punjab), and Advanced System in Package Technologies / ASIP (OSAT unit with South Korea's APACT Co. Ltd, Andhra Pradesh). Cumulative investment INR 4,600 crore (~USD 525mn); 2,034 skilled jobs at full ramp. This brought total approved ISM Phase 1 projects to 10 across 6 states, with cumulative committed investment of approximately INR 1.60 lakh crore (~USD 18bn).

The European Commission approved a EUR 41.5 million Italian direct-grant state aid measure to Ephos Srl, an Italian photonics SME, to help finance "Fab-2," a new manufacturing facility for glass-based photonic integrated circuits used in AI datacentres, high-performance computing and quantum computing. The aid was cleared under the European Chips Act state aid framework (Commission case SA.117987, decision of 25 July 2025) and forms part of a EUR 104.9 million total project investment. Ephos already operates a first facility (Fab-1) in Milan; Fab-2 is intended to be the first EU facility of its kind processing this glass-substrate photonic chip technology at scale.

On 23 July 2025 the General Office of the Shanghai Municipal People's Government issued Hufu Bangui [2025] No. 5, "Several Measures to Support Enterprises in Strengthening Basic Research and Enhancing New Momentum for High-Quality Development," effective 1 August 2025 through 31 July 2030. The measure tiers one-time subsidies of CNY 2m-10m/year to enterprises based on basic-research investment (CNY 10m-50m, 50m-100m, and 100m+ investment bands), reimburses 50% of shared scientific- equipment usage fees (capped CNY 1m/year), and grants a 100% tax deduction for corporate donations to basic research at nonprofits and universities, with integrated circuits, biomedicine and artificial intelligence named as priority participating industries.

The Beijing Economic-Technological Development Zone (BDA / Yizhuang) Management Committee issued Jingjiguanfa [2025] No. 15, "Several Measures on Promoting Quantum Technology and Industry Development in the Beijing Economic-Technological Development Zone," on 2025-07-14, effective immediately and in force through 2027-12-31. The package spans ten support lines covering the full quantum stack (computing hardware/software, communications, sensing): up to RMB 2,000,000 one-off support for disruptive early-stage R&D projects, R&D-investment matching at 20% of an enterprise's prior-year R&D spend capped at RMB 5,000,000, 1:1 matching up to RMB 30,000,000 for enterprises undertaking state/municipal quantum research tasks, RMB 500,000 per product for new-technology/product certifications, up to RMB 100,000 per flagship application-demonstration project, up to RMB 30,000,000/year (three years max) for quantum-computing cloud platforms and compute centers, up to RMB 5,000,000/year (three years max) for operating industry-ecosystem platforms, rent subsidies up to RMB 1.5/sqm/day (max 2,000 sqm, three years), and talent, financing ("patient capital"/future-industry guidance fund), and international- cooperation support. The zone targets an internationally influential quantum industry cluster by 2027.

Japan Bank for International Cooperation (JBIC) signed a loan agreement on 2025-07-11 for approximately USD 46 million with MGC Pure Chemicals America, Inc. (MPCA), the US subsidiary of Mitsubishi Gas Chemical Company. Co-financed alongside Bank of Yokohama, Hachijuni Bank, and Joyo Bank, the total co-financing package reaches USD 77 million. Proceeds fund expansion of MPCA's Arizona production capacity for ultra-pure hydrogen peroxide and ultra-pure ammonium hydroxide — semiconductor-grade chemicals used for silicon-wafer cleaning and etching — as JBIC states, to strengthen Japanese supply-chain resilience and support US semiconductor manufacturing demand. This is MPCA's second JBIC-backed expansion loan, following a USD 36 million (JBIC portion) facility signed in April 2024 for the same production line.

The Beijing Economic-Technological Development Zone (BDA / Yizhuang) Management Committee issued Jingjiguanfa [2025] No. 14, "Several Measures on Accelerating 6G Technology and Industrial Innovation Development in the Beijing Economic-Technological Development Zone," dated 2025-07-08 and effective 2025-07-09. The package funds the 6G stack end to end: up to RMB 5,000,000 start-up funding for provincial/municipal-level 6G laboratories, matching funds up to RMB 30,000,000 for enterprises undertaking national/municipal 6G research tasks, up to RMB 2,000,000 in rewards for accepted 3GPP standard proposals, up to RMB 1,000,000 for standard implementation, up to RMB 30,000,000/year (three-year cap) for test and verification platforms, up to RMB 5,000,000 for "first-order" product support, and testing vouchers of up to RMB 5,000,000 covering 50% of actual testing costs. The zone targets 50+ breakthrough 6G core technologies and standards, 20+ prototype devices, 10+ leading enterprises, 200+ national/municipal high-tech enterprises, and an RMB 50,000,000,000-scale industry cluster by 2030.

On 2025-06-25, Hong Kong's New Industrialisation Vetting Committee announced it had supported an application from J Cube Semiconductor (Hong Kong) Limited under the New Industrialisation Acceleration Scheme (NIAS) — the third project approved under the scheme. The project will establish production facilities for third-generation (silicon carbide, SiC) semiconductor wafers in Hong Kong, classed under the advanced-manufacturing-technology sector. Total project cost is estimated at over HKD 700 million, with expected NIAS government funding of up to HKD 200 million — the scheme's per-project cap. The same announcement introduced an enhancement measure for the related New Industrialisation Funding Scheme (NIFS).

The Chips Joint Undertaking, via Horizon Europe grant agreement 101213727 signed 19 June 2025, is co-funding "PIXEurope" (Advanced Photonic Integrated Circuits Pilot Line for Europe), the fifth EU Chips Act pilot line. Fundació Institut de Ciències Fotòniques (ICFO, Spain), the project coordinator, receives EUR 10,112,253.51 in net EU contribution — the coordinator's own tranche of the wider 19-entity, multi-country consortium's EUR 176.05m total project cost (EUR 88.03m in EU/Chips JU contribution), running 1 June 2025 to 31 May 2030. This is a distinct beneficiary filing alongside the parallel TNO (Netherlands) tranche of the same grant agreement, which builds a 6-inch indium-phosphide pilot manufacturing line at High Tech Campus Eindhoven.

The Chips Joint Undertaking, via Horizon Europe grant agreement 101213727 signed 19 June 2025, is co-funding "PIXEurope" (Advanced Photonic Integrated Circuits Pilot Line for Europe), the fifth EU Chips Act pilot line, coordinated by Fundació Institut de Ciències Fotòniques (ICFO, Spain) with a 19-entity, multi-country consortium. Total project cost is EUR 176.05m against EUR 88.03m in EU/Chips JU contribution, running 1 June 2025 to 31 May 2030. TNO (Netherlands) is a lead participant, receiving EUR 13.47m in net EU contribution (EUR 26.94m total eligible cost) to build a 6-inch indium-phosphide photonic-chip pilot manufacturing line at High Tech Campus Eindhoven — part of a wider EUR 193m Dutch national co-investment (Ministry of Economic Affairs, Ministry of Defence, Chips JU, TNO, TU Eindhoven, University of Twente) targeting technological independence in photonic chips for telecom/6G, AI, quantum, defence and medical-diagnostics applications. Global Trade Alert logs a EUR 10.1m figure for the TNO tranche as a "red" state-act intervention (financial grant) on competitive-distortion grounds; this filing anchors on the CORDIS-published grant-agreement figures as the authoritative primary-source numbers.

Wisconsin Governor Tony Evers and the Wisconsin Economic Development Corporation (WEDC) announced on 13 June 2025 a package of up to $18 million in performance-based Enterprise Zone state tax credits to support Yaskawa America Inc.'s $180 million relocation and expansion of its North American headquarters to Franklin, Wisconsin. The project consolidates Yaskawa's existing Illinois and Wisconsin operations into a single 800,000-square-foot campus housing headquarters, training, manufacturing, and robotics/semiconductor production functions, and is projected to create more than 700 new jobs. The actual credit amount is contingent on Yaskawa meeting job-creation and capital-investment performance milestones.

On 27 May 2025 the People's Government Office of Xiaoshan District, Hangzhou (Zhejiang Province) issued Xiao Zhengbanfa [2025] No. 22, "Several Policies to Promote the High-Quality Development of the Integrated Circuit Industry," published 30 May 2025. The notice establishes a district-level subsidy stack covering EDA design, IC design, manufacturing, packaging and testing, and equipment/materials firms operating in Xiaoshan District. Headline instruments include R&D subsidies for enterprises investing over CNY 50m (with a lower CNY 10m tier) in key IC materials and core equipment with realized sales, a wafer tape-out subsidy capped at CNY 20m per enterprise per year, public innovation-platform purchase subsidies of up to CNY 500k, "chip-mould linkage" support up to CNY 3m, and talent-support measures including housing subsidies for IC industry personnel.

The Union Cabinet, chaired by Prime Minister Narendra Modi, approved the establishment of a sixth semiconductor unit under the India Semiconductor Mission (ISM) on 14 May 2025. The unit is a joint venture between HCL and Foxconn (Hon Hai) and will build an Outsourced Semiconductor Assembly and Test (OSAT) plant near Jewar airport in the Yamuna Expressway Industrial Development Authority (YEIDA) area of Uttar Pradesh, manufacturing display driver chips for mobile phones, laptops, automobiles, PCs and other display-equipped devices. The approved investment is INR 3,700 crore (~USD 435 million), with designed capacity of 20,000 wafers per month and output of 36 million units per month.

On 21 January 2025, Mexico published the Decree granting tax incentives in support of the national strategy known as "Plan Mexico" in the Diario Oficial de la Federación (DOF). The decree provides MXN 30 billion (~USD 1.5 billion) in fiscal incentives through 2030 to attract nearshoring investment, with MXN 28.5 billion allocated to immediate deductions on new fixed asset investments and MXN 1.5 billion for workforce training and innovation. Deduction rates range from 35% to 91% depending on asset type and sector, with the automotive, aerospace, and semiconductor industries expected to benefit most. The measure aims to capitalize on US-China decoupling by positioning Mexico as an alternative manufacturing base for supply chains serving the North American market.