Industrial Policy & Trade Monitor· 2665 actions· ✨ 90 recent

On December 15, 2023, BIS published a procedural notice (88 FR 86821) extending the public comment deadline for two major October 25, 2023 interim final rules: the Semiconductor Manufacturing Items IFR (88 FR 73424) and the Advanced Computing / Supercomputer Semiconductor End-Use IFR (88 FR 73458). The original comment deadline of December 18, 2023 was extended by 30 days to January 17, 2024, to allow stakeholders additional time to review the complex regulatory changes and submit substantive input. The document contains no amendments to the Export Administration Regulations (EAR) and no changes to export-control parameters.

The Bureau of Industry and Security amended the Export Administration Regulations by adding four entities under nine entries to the Entity List, effective November 21, 2023 (FR Doc. 2023-25684). Three entities — Aerofalcon S.L. (Spain), Novax Group S.A. (Costa Rica, Ecuador, Panama, Russia, Venezuela), and Zero Waste Global SA (Panama, Venezuela) — were listed for circumventing US sanctions by supplying Nicolás Maduro's government with US-origin aircraft parts using fraudulent export documentation. A fourth entity, Si2 Microsystems Private Limited (India), was listed for supplying Russian defense-sector consignees with US-origin integrated circuits in violation of Section 746.5(a)(1)(ii) Russia/Belarus export restrictions. All entities are subject to a license requirement for all EAR items with a presumption of denial.

The US Bureau of Industry and Security published a correction on 8 November 2023 to a rule it had issued on 17 October 2023 revising the Validated End-User (VEU) authorisations for Samsung China Semiconductor Co. Ltd. and SK hynix Semiconductor (China) Ltd. in the People's Republic of China. The correction fixes two omissions from the October rule: a missing word in the description of eligible items for SK hynix Semiconductor (China) Ltd., and a failure to remove the standalone VEU entry for SK hynix Semiconductor (Wuxi) following its merger into SK hynix Semiconductor (China) Ltd. No substantive policy change is introduced; this is a technical and clerical correction only.

Ireland's Screening of Third Country Transactions Act 2023 (Act No. 28 of 2023), signed into law on 31 October 2023 and commenced on 6 January 2025 via S.I. No. 651 of 2024, establishes Ireland's first-ever mandatory inbound FDI screening regime. The Act empowers the Minister for Enterprise, Tourism and Employment to assess, condition, or prohibit transactions by third-country investors (non-EU/EEA/Switzerland) exceeding a EUR 2 million cumulative threshold in targets operating across critical infrastructure, critical technologies, dual-use items, supply of critical inputs, sensitive personal data, and media freedom. A 90-day standstill period applies during Ministerial determination, with criminal sanctions and transaction-voiding powers available for non-compliance.

On 25 October 2023 the Bureau of Industry and Security published an interim final rule (88 FR 73424; FR Doc 2023-23055) making substantive revisions to the October 7 2022 advanced-computing IFR, incorporating 43 public comments covering 78 topics. The rule replaced the prior TOPS-based performance metric with a new "Total Processing Performance" (TPP) / performance-density dual-threshold structure for ECCN 3A090, splitting the control into tiers 3A090.a (full licence requirement for highest-capability datacenter AI chips) and 3A090.b (new License Exception NAC with 25-day prior notification for the intermediate tier). Geographic scope was expanded from China-and-Macau to Country Groups D:1/D:4/D:5 to block diversion via third-country intermediaries and offshore datacenters.

The US Bureau of Industry and Security issued an interim final rule on 17 October 2023 that substantially expanded the advanced-computing and semiconductor manufacturing controls first imposed in October 2022. The rule closed the performance-threshold workaround that NVIDIA had used to ship China-specific A800/H800 GPUs, replacing it with a "performance density" metric and adding a new "Notified Advanced Computing" licence category. It expanded controls on chipmaking equipment (additional ECCNs covering deposition, etch, metrology), pulled 21 additional countries (mostly Middle East / Central Asia) into a regional licensing scheme to prevent transshipment, and added 13 Chinese entities to the Entity List including AI-chip designers.

The US Bureau of Industry and Security revised the Validated End-User (VEU) authorizations for Samsung China Semiconductor Co. Ltd. (Xi'an NAND fab) and SK Hynix Semiconductor (China) Ltd. (Wuxi DRAM fab) on 17 October 2023, expanding each from its previous restricted eligible-items list to cover "all items subject to the Export Administration Regulations." Both authorizations exclude EUV equipment and related components: Samsung China is barred from EUV items for NAND production; SK Hynix is barred from EUV items for DRAM production. The revision was published simultaneously with the broader October 2023 advanced- computing chip controls (FR Doc 2023-22560), giving the two South Korean memory fabs a calibrated safe harbour under the newly tightened regime.

The Bureau of Industry and Security (BIS) added 49 entities under 52 entries to the Entity List, effective October 11, 2023. The bulk of additions — 42 of 49 — are Chinese entities determined to be acting contrary to US national security or foreign policy interests, predominantly for supplying US-origin integrated circuits to Russian defense-sector consignees after March 1, 2023 in violation of export controls. Remaining entities span Estonia, Finland, Germany, India, Turkey, UAE, and the United Kingdom and were designated on similar Russia-diversion or end-use violation grounds. All listed parties face a license requirement for all EAR-subject items, reviewed under a presumption of denial.

Regulation (EU) 2023/1781, published in the Official Journal on 18 September 2023 and in force from 8 October 2023, establishes the EU Chips Act: a three-pillar framework targeting 20% of global semiconductor production by 2030 (up from approximately 9% in 2022) by mobilising EUR 43bn in public and private investment. Pillar 1 (Chips for Europe Initiative, EUR 3.3bn committed from EU budget) funds R&D, pilot production lines, and design infrastructure. Pillar 2 creates a fast-track permitting regime for "Integrated Production Facilities" (IPFs) and "Open EU Foundries" (OEFs) that qualify as being in the Union's interest. Pillar 3 establishes a supply-chain monitoring mechanism and grants the Commission power to mandate priority orders from designated facilities during a declared semiconductor crisis.

Decree-Law No. 104 of 10 August 2023 ("Decreto Asset" / Omnibus Decree, GU n.186 of 10 Aug 2023, in force 11 Aug 2023) was converted with amendments into Law No. 136 of 9 October 2023 (GU n.236 of 9 Oct 2023). The conversion law materially expanded Italy's "Golden Power" foreign-direct-investment screening regime (DL 21/2012). Two key extensions: (i) intra-group transactions involving entities outside the EU are no longer exempt from the exercise of special powers — only the prior notification carve-out was preserved; (ii) acts, resolutions and operations concerning intellectual-property rights in artificial intelligence, semiconductor production, cybersecurity, aerospace, energy storage, quantum and nuclear technologies, and food production technologies fall within scope when one or more counter-parties sit outside the EU. The Prime Minister also obtained an explicit veto power over transactions creating "exceptional situations" not already covered by sectoral or EU prudential / merger rules, including those touching qualifying holdings in the financial sector.

On 9 August 2023 the German Federal Cabinet adopted the government draft Wirtschaftsplan 2024 of the Climate and Transformation Fund (Klima- und Transformationsfonds, KTF) and the accompanying 2024–2027 financial plan. The plan envisaged ca. EUR 211.8 bn of programme spending across 2024–2027 (EUR 57.6 bn in 2024 alone), funded by national and European emissions-trading revenues plus federal grants, with major lines for semiconductor production (~EUR 4.0 bn in 2024), hydrogen industry build-out (~EUR 3.8 bn), building renovation (~EUR 18.9 bn), EEG renewables support (~EUR 12.6 bn) and electric mobility. The KTF is the principal German federal vehicle for co-financing the EU Chips Act state-aid envelope, IPCEI Hydrogen, decarbonisation contracts (Klimaschutzverträge) and other net-zero-aligned industrial-policy subsidies.

President Biden signed Executive Order 14105 on 9 August 2023, "Addressing United States Investments in Certain National Security Technologies and Products in Countries of Concern", establishing the first dedicated US outbound-investment screening regime. The EO directs Treasury to prohibit or require notification of US investments in Chinese (and Hong Kong, Macau) entities engaged in three categories of technology: (1) semiconductors and microelectronics, (2) quantum information technologies, (3) artificial intelligence systems. After a public-comment process, Treasury issued the final rule (31 CFR Part 850) on 28 October 2024, effective 2 January 2025.

The Knesset enacted the Law for Encouragement of Knowledge-Intensive Industry (Temporary Order), 5783-2023 on 25 July 2023; it took effect on publication in Reshumot on 31 July 2023 and is scheduled to remain in force through 31 December 2026. The law — informally the "Angels Law" — packages four tax incentives aimed at sustaining Israel's high-tech sector: a capital-gains-rate-equivalent tax credit for individuals investing in Israeli R&D start-ups, capital-gains deferral on reinvestment of proceeds from Israeli tech-company share sales, five-year amortisation of net acquisition costs when Israeli technological companies acquire other (Israeli or foreign) hi-tech companies, and a withholding-tax exemption on interest paid by Israeli high-tech companies to foreign financial institutions. Beneficiaries are limited to companies with Preferred Technological Enterprise (PTE) status or R&D Company designation under the Israeli Encouragement of Capital Investments Law.

Luxembourg's Chambre des Députés adopted the first-ever national FDI-screening statute on 14 July 2023 (promulgated by the Grand Duke and published in Mémorial A n° 411 on 18 July 2023), entering into force 1 September 2023. The law requires non-EU investors to notify the Ministre de l'Économie before completing direct or indirect acquisitions of ≥25% voting rights / equity in Luxembourg entities engaged in "critical activities" across twelve sectors. The Minister can approve, conditionally approve, or prohibit transactions within a two-month initial screening window, with a further 60-day deep-review phase available; an inter-ministerial Comité de filtrage (Economy + Foreign Affairs + Finance + SREL intelligence service) advises on security and public-order grounds consistent with EU Regulation 2019/452.

China's Ministry of Commerce and General Administration of Customs jointly announced an export licensing regime covering eight gallium-related items (including gallium metal, gallium arsenide, gallium nitride wafers and ingots) and six germanium- related items (including germanium metal, germanium oxide, germanium tetrachloride). Effective 1 August 2023, exporters must obtain a dual-use-item licence from MOFCOM citing the end-user and end-use, with licences granted at MOFCOM's discretion. The measure was framed as protecting national security and interests, though the timing immediately followed the Dutch ASML DUV controls and US chip-equipment escalations.

The Dutch government announced on 30 June 2023 a new national export-licensing requirement covering specific advanced semiconductor manufacturing equipment, most prominently ASML's TWINSCAN NXT:2000i and subsequent DUV immersion lithography systems used at ≤14/16nm logic, advanced DRAM, and advanced 3D NAND production. Effective from 1 September 2023 via the national Strategic Goods Decree, the rule completes the trilateral US-Japan-Netherlands chip-equipment perimeter initiated by the January 2023 trilateral agreement. Although nominally country-neutral, the BIS Foreign Direct Product Rule means licences for shipments to "countries of concern" — read: China — face a presumption of denial. Subsequent guidance in 2024 expanded coverage to additional TWINSCAN NXT:1970Ci and 1980Di system variants.

The UK government published its National Semiconductor Strategy on 19 May 2023, under Secretary of State Michelle Donelan at the newly established Department for Science, Innovation and Technology (DSIT). The strategy commits GBP 1 billion in long-run support to the UK semiconductor sector, explicitly focusing on the UK's identified strengths: chip design (Arm, Imagination Technologies, Dialog), compound and wide-bandgap semiconductors (III-V, SiC, GaN -- centred on the Cardiff/Newport cluster and IQE plc), and upstream academic R&D. Unlike the US CHIPS Act or EU Chips Act, the strategy explicitly declined to fund advanced silicon wafer fabrication at scale, acknowledging the prohibitive capital cost and the UK's lack of existing fab infrastructure at leading nodes. A UK Semiconductor Advisory Panel was established to guide delivery and assess emerging requirements. The strategy is enabled by the UK Subsidy Control Act 2022 (in force January 2023), which freed UK public authorities to grant large technology subsidies without prior EU Commission approval.

Loi n° 2023-973 du 23 octobre 2023 relative à l'industrie verte (the Green Industry Law) is France's first comprehensive industrial-policy framework since France 2030 (2021). Published in the Journal officiel on 24 October 2023, it pursues three objectives: (i) accelerate the siting of strategic industrial projects on French territory, (ii) channel public procurement toward "virtuous" companies, and (iii) mobilise private savings for green-industrial CapEx. Its centrepiece is the new "Projet d'intérêt national majeur" (PINM) status, an exceptional procedure that fast-tracks urban planning, environmental permitting, and grid connection for projects deemed strategic for ecological transition or national sovereignty (gigafactories, hydrogen electrolysers, advanced semiconductor fabs). The law also creates the Plan d'épargne avenir climat (PEAC), a long-duration retail savings product reserved for under-21s and earmarked for European green-industrial financing, and codifies a 2023-2030 national green-industry strategy.

The Bureau of Industry and Security (BIS) added 28 entities under 32 entries to the Entity List effective April 12, 2023, targeting front companies and logistics networks attempting to evade US export controls to acquire US-origin items in support of Russia's military and defense industrial base. Twelve of the entities are Chinese electronics and semiconductor distributors operating as procurement intermediaries; ten are Russian logistics and trading firms; six are spread across Armenia, Malta, Singapore, Spain, Syria, Turkey, UAE, and Uzbekistan as diversion facilitators. All listed entities are subject to a license review policy of denial for virtually all EAR-controlled items.

Japan's Ministry of Economy, Trade and Industry (METI) announced on 31 March 2023 amendments to the Foreign Exchange and Foreign Trade Act adding 23 categories of advanced semiconductor manufacturing equipment to the export-licensing list. The measure, effective from 23 July 2023, is the Japanese counterpart to the US October 2022 BIS rule (filed: 2022-10-07-us-bis-advanced-ai-chip-controls-china) and the Dutch DUV controls. Items covered span lithography (mostly ArF and KrF), deposition (CVD, ALD, sputtering), etch, and cleaning + advanced inspection — broadly the toolset used at ≤14/16nm logic, advanced DRAM, and advanced 3D NAND. The controls are formally non-discriminatory but in practice capture exports to China; non-China destinations get general licences.

The Korean National Assembly passed an amendment to the Restriction of Special Taxation Act (조세특례제한법, Act No. 19234) on 30 March 2023, promulgated 31 March 2023 and retroactive to 1 January 2023. The amendment enhanced the investment tax credit (ITC) for "national strategic technology" (국가전략기술) semiconductor facility investment: large companies receive a 15% ITC on qualifying capital expenditure (up from 8% in the December 2022 base version); small and medium enterprises receive 25%. An additional temporary 10% incremental credit applies for annual investment exceeding the prior 3-year average (effective 2023-2025). Internationally termed the "K-Chips Act," the measure directly mirrors the US CHIPS Act's 25% advanced- manufacturing investment tax credit. Principal beneficiaries are Samsung Electronics (Samsung Foundry plus DRAM/NAND capex of KRW 20-30 trillion per year) and SK Hynix (memory fabs at Icheon and Cheongju, HBM expansion). In the same session the National Assembly passed companion legislation on secondary-battery (EV) investment with equivalent credit rates. The Korean government projected annual tax savings for the semiconductor sector of approximately KRW 1-2 trillion.

The Bureau of Industry and Security (BIS) added 37 entities under 38 entries to the Entity List, effective March 2, 2023, spanning six destinations: China (28), Pakistan (4), Burma (3), Russia (1), Belarus (1), and Taiwan (1). The China tranche — the largest — targets entities supporting the People's Liberation Army's military modernization, including BGI Research and Forensic Genomics International (genomic surveillance/data risk), Inspur Group Co. Ltd. (cloud servers supplied to Chinese military), and Loongson Technology (domestic CPU developer). Three Burmese entities, including the Ministry of Transport and Communications, are designated for providing surveillance equipment enabling the military junta's tracking and targeting of civilians. Pakistani entities Abdul Razaq Asim, Add-On Technology, and Dynamic Engineers are added for contributing to Pakistan's ballistic missile programs; Russian DMT Electronics and Belarusian DMT Trading LLC for export-control evasion. All listed entities are subject to a license requirement for all items subject to the EAR, with the review policy being presumption of denial for the majority of Chinese entries.

The Bureau of Industry and Security (BIS) added 76 Russian entities to the Entity List effective February 24, 2023, spanning three rationale categories: (1) biometric surveillance technology enabling Russian filtration operations in occupied Ukraine; (2) illicit acquisition of U.S.-origin controlled items; and (3) the Russian military-industrial complex encompassing missiles, aviation, shipbuilding, semiconductors, telecom, and defense electronics. All 76 entities are subject to a license requirement for all EAR-subject items with a presumption of denial; 66 entities receive footnote-3 designation as Russian military end-users, subjecting them to the Russia/Belarus Military End-User Foreign Direct Product Rule under §734.9(g). Four existing Entity List entries were simultaneously revised with additional aliases and tightened to a policy of denial. Notable designations include KAMAZ, the Skolkovo Foundation, Skoltech, Ilyushin Aviation Complex, and the State Missile Center Named After Akademika V.P. Makeyev.

BIS amended the Commerce Control List (CCL) under the Export Administration Regulations (EAR) to implement decisions agreed at the December 2021 Wassenaar Arrangement Plenary meeting, revising 16 ECCNs across computing, electronics, lasers, sensors, and aerospace domains. The most operationally significant change raised the Adjusted Peak Performance (APP) threshold for digital computers under ECCN 4A003.b from 29 to 70 Weighted TeraFLOPS (WT), reducing the licensing burden for high-performance computing exports to Wassenaar partner countries while preserving controls to non-partners. Corresponding revisions to License Exception APP (15 CFR Part 740) and License Exception Strategic Trade Authorization (STA) align the broader EAR framework with the updated multilateral thresholds.

BIS published an interim final rule on January 18, 2023 (88 FR 2821, FR Doc 2023-00888) extending to Macau the same advanced computing and semiconductor manufacturing controls originally imposed on China by the October 7, 2022 rule. The extension closes a diversion loophole created by Macau's status as a Special Administrative Region of China, applying equivalent license requirements for advanced computing ICs, equipment used in ≤14 nm logic and advanced NAND/DRAM fabrication, and supercomputer end-use restrictions. The rule also includes entity list modifications and took effect one day before Federal Register publication (January 17, 2023).

Commission Delegated Regulation (EU) 2023/66, adopted 21 October 2022 and published in the Official Journal on 11 January 2023 (OJ L 9), replaces Annex I of Regulation (EU) 2021/821 (the EU Dual-Use Recast Regulation) with an updated control list implementing the 2022 multilateral decisions of the Wassenaar Arrangement, MTCR, Australia Group, NSG and the Chemical Weapons Convention. Per GTA's tracking of the CN-code-level change, the update removed 7 six-digit CN codes and added 8 new ones. It entered into force on 12 January 2023, the day after publication.

The Legislative Yuan of Taiwan (ROC) passed amendments to Articles 10-2 and 72 of the Statute for Industrial Innovation ("產業創新條例") on third reading on 7 January 2023. The amendment, internationally termed the "Taiwan Chips Act," is implemented from 1 January 2023 to 31 December 2029. Article 10-2 grants Taiwan-registered companies that occupy key positions in international supply chains a 25% investment tax credit on qualifying forward-looking innovative R&D expenditure (capped at 30% of the year's profit-seeking enterprise income tax payable), plus a 5% credit on the purchase of brand-new machinery or equipment used in own-account advanced manufacturing processes (also capped at 30%). Eligibility thresholds set by the Ministry of Finance require annual R&D spend of at least NT$6bn, R&D intensity (R&D / net operating revenue) of at least 6%, and an effective tax rate of at least 15% (12% for FY2023 only); the 5% equipment credit additionally requires equipment expenditure of at least NT$10bn. The measure is Taiwan's principal supply- side response to the US CHIPS Act, the EU Chips Act, the K-Chips Act, and Japan's METI subsidy programme, and is designed to retain TSMC, MediaTek, and other leading-edge silicon investment onshore as overseas subsidies pull capacity to Arizona, Kumamoto, Dresden, and elsewhere.