Industrial Policy & Trade Monitor· 2663 actions· ✨ 89 recent

The European Commission (DG COMP) approved on 20 May 2026 two German State aid measures under the European Chips Act first-pillar 'first-of-a-kind' framework and Article 107(3)(c) TFEU, totalling €288 million. A €222 million grant supports Carl Zeiss SMT GmbH's HNA@SCALE project in Oberkochen (Baden-Württemberg) to industrialise the next generation of High-NA EUV optical columns — the lithography-optic sub-systems integrated by ASML into its High-NA EUV scanners and critical to 2nm-and-below node manufacturing globally. A separate €66 million grant supports Zadient Materials Europe GmbH's SiC-Pro project in Bitterfeld (Saxony-Anhalt) to construct a first-of-a-kind ultra-pure silicon carbide (SiC) source-material manufacturing facility, addressing upstream SiC supply-chain dependence on China (which produces ~80% of global SiC). Both facilities carry cross-border spillover commitments under Chips Act pillar 1.

On 19 March 2026 the German Federal Ministry for Economic Affairs and Energy (BMWE) announced the selection of 38 German projects across 12 federal Länder for the IPCEI Advanced Semiconductor Technologies (IPCEI AST) — the next Important Project of Common European Interest on semiconductors under EU State Aid Article 107(3)(b) TFEU. The federal commitment is EUR 3 billion drawn from the Sondervermögen Infrastruktur und Klimaneutralität (SVIK), the EUR 100 bn special-purpose vehicle enacted via SVIKG in September 2025. The 38 selected projects span AI chips and chiplets, photonic integrated circuits, advanced manufacturing equipment, sensor technologies, and power electronics, with approximately one-third being startups and SMEs. The measure operationalises Germany's Microelectronics Strategy (October 2025) at the project-funding layer and is the first major SVIK semiconductor-tranche deployment.

On 26 December 2025, Japan's Cabinet approved the FY2026 (Reiwa 8) national budget, which the Global Trade Alert database logs as including a "Multi-modal Foundation Model Development Project with a Focus on AI Robots and Physical AI" financial-grant line administered by METI, effective with the fiscal year on 1 April 2026. NEDO -- METI's implementing R&D agency -- operationalised this line through a commissioned-project (100%-funded) solicitation opened 24 March 2026 and closed 22 April 2026, capping funding at up to JPY 383.4 billion (~USD 2.5bn) per adopted proposal for FY2026, with the programme running FY2026 through FY2030 (initial contract period FY2026-FY2027, annual stage-gate reviews thereafter). The goal is a domestically developed multimodal ("VLM/VLA") foundation model that keeps Japanese factory-floor and robotics data onshore while underpinning "physical AI" -- AI systems embedded in robots and industrial equipment -- to address labour shortages and lift manufacturing productivity. NEDO's call for proposals subsequently selected Noetra Inc. and the National Institute of Advanced Industrial Science and Technology (AIST/産総研) as awardees.

On 26 December 2025, Japan's Cabinet under Prime Minister Sanae Takaichi approved the FY2026 (Reiwa 8) national budget, which allocates JPY 150 billion (~USD 1bn) to the "Investment Project for Mass Production of Next-Generation Semiconductors" -- a state equity-investment line administered by the Information-technology Promotion Agency (IPA) that funds Rapidus Corporation's 2nm-class logic fab in Chitose, Hokkaido. The FY2026 allocation is 50% larger than the JPY 100 billion IPA equity tranche budgeted for FY2025, taking cumulative government equity in Rapidus to roughly JPY 250 billion. The line sits inside METI's wider AI/semiconductor budget of JPY 1.239 trillion for FY2026 (up roughly 4x year-on-year) under the "AI/Semiconductor Industry Base Strengthening Frame," part of the government's pledge of over JPY 10 trillion in public support for AI and chips through FY2030. The budget takes effect with Japan's fiscal year on 1 April 2026, subject to ordinary Diet passage in early 2026.

On 21 November 2025, METI Minister Yoji Akazawa designated Rapidus Corporation as the official next-generation semiconductor manufacturer under Japan's Act on Facilitation of Information Processing (情報処理の促進に関する法律, as amended by the Cabinet-approved partial-amendment bill of 7 February 2025), following a public solicitation run 3 September – 2 October 2025. The designation makes Rapidus eligible for a multi-year METI funding envelope reported at roughly JPY 1tn (~USD 6.4bn), with an initial JPY 100bn equity investment by the Information-technology Promotion Agency (IPA) planned for FY2025; the funds support Rapidus' Hokkaido (Chitose) IIM-1 fab targeting 2nm GAA mass production from April 2027 and successor 1.4nm / 1nm nodes. The action is the first standalone Rapidus entry in the IPTM register and operationalises the supply-chain pillar of the 2022 Economic Security Promotion Act for advanced logic.

SETT, the operational vehicle of Spain's PERTE Chip programme, announced a EUR 9.5 million public investment in Ideaded, a Viladecans (Barcelona) company developing microchips on alternative substrates to silicon. The funding is earmarked to complete Spain's first pilot plant for silicon-alternative microchips, financed under the Plan de Recuperacion, Transformacion y Resiliencia (NextGenerationEU). Target output is 50 wafers/month (first wafer expected 2026) plus up to 300 million RFID antennas/year, aimed at advanced-computing, AI and defence applications.

On 18 September 2025 the Bundestag adopted the Gesetz zur Errichtung eines Sondervermögens "Infrastruktur und Klimaneutralität" (SVIKG), authorising up to EUR 500 bn of additional federal borrowing over a twelve-year horizon outside the constitutional debt brake, on the basis of the new Article 143h Grundgesetz inserted by the March 2025 constitutional amendment. The envelope splits into up to EUR 100 bn for Länder and municipal infrastructure (channelled via the companion Länder- und Kommunal-Infrastrukturfinanzierungsgesetz, LuKIFG, passed 9 October 2025), EUR 100 bn transferred to the Klima- und Trans- formationsfonds (KTF) in annual instalments through 2034, and up to EUR 300 bn for additional federal investments in transport, energy/ heat, hospital, education, digitalisation, civil protection and R&D infrastructure. Investments are eligible retroactively from 1 January 2025 and may be approved through 31 December 2036; loan repayment begins no later than 1 January 2044. SVIKG is the largest single industrial-finance instrument launched by an EU member state in the post-2022 industrial-policy cycle.

On 22 August 2025 South Korea's National R&D Program Evaluation Steering Committee, convened by MOTIE, finalized an exemption from the mandatory preliminary feasibility study (예비타당성조사 면제) for the "K-On-Device AI Semiconductor Technology Development" project, clearing the roughly KRW 689.15 billion (approx. USD 496 million) program to proceed toward FY2026 budget allocation without the standard multi-year vetting delay. The project funds full-stack development — custom AI chip design, software, and modules — across four demand-anchored industries: automotive (Hyundai Motor), IoT/home appliances (LG Electronics), machinery/robotics (Doosan Robotics, Daedong), and defense (Korea Aerospace Industries). MOTIE structured the program so end-user demand companies participated directly in project planning, pairing them with domestic fabless design and foundry manufacturing firms to build a domestic on-device AI semiconductor ecosystem, ahead of full budget confirmation and formal program launch.

On 22 August 2025 Intel and the Trump administration announced that the US government would acquire a 9.9% equity stake in Intel — 433.3 million common shares at $20.47/share, worth $8.9 billion — funded by converting $5.7 billion in remaining, undisbursed CHIPS and Science Act grants and $3.2 billion from the Department of War's Secure Enclave program into equity rather than paying them as grants. Combined with $2.2 billion already disbursed under Intel's CHIPS award, total federal support reaches $11.1 billion. 274.6 million shares transferred to Commerce at closing on 27 August 2025; the remaining 158.7 million sit in escrow pending Secure Enclave disbursement milestones. The government also received a five-year warrant for an additional 5% of Intel shares at $20/share, exercisable only if Intel's ownership of its foundry business falls below 51%.

On 27 May 2025 the People's Government Office of Xiaoshan District, Hangzhou (Zhejiang Province) issued Xiao Zhengbanfa [2025] No. 22, "Several Policies to Promote the High-Quality Development of the Integrated Circuit Industry," published 30 May 2025. The notice establishes a district-level subsidy stack covering EDA design, IC design, manufacturing, packaging and testing, and equipment/materials firms operating in Xiaoshan District. Headline instruments include R&D subsidies for enterprises investing over CNY 50m (with a lower CNY 10m tier) in key IC materials and core equipment with realized sales, a wafer tape-out subsidy capped at CNY 20m per enterprise per year, public innovation-platform purchase subsidies of up to CNY 500k, "chip-mould linkage" support up to CNY 3m, and talent-support measures including housing subsidies for IC industry personnel.

The Dutch Council of Ministers on 28 March 2024 approved Project Beethoven, a EUR 2.51 billion public-investment package for the Brainport-Eindhoven semiconductor ecosystem. The package combines EUR 1.28 billion from the Nationaal Groeifonds, EUR 450 million in additional central- government education/talent spending, and EUR 780 million in regional co-funding from the Province of Noord-Brabant and the Municipality of Eindhoven. Investment pillars cover infrastructure (mobility, road capacity on A2/A58/A67, energy-grid reinforcement), a national semiconductor-talent plan targeting 2,000 master's-programme graduates per year by 2030, 16,000+ new housing units in the Brainport region, and quality-of-life improvements. The Government stated it expects these measures to lead ASML to continue to invest and maintain its statutory and tax domicile in the Netherlands.

METI committed up to 732 billion yen (~US$4.86 billion) in direct subsidies for Japan Advanced Semiconductor Manufacturing K.K. (JASM) to build a second wafer fab adjacent to the first JASM facility in Kikuyo, Kumamoto Prefecture. Confirmed by METI Minister Ken Saito at the Fab 1 opening ceremony on 24 February 2024, two weeks after TSMC, Sony Semiconductor Solutions, Denso, and Toyota jointly announced the Fab 2 expansion (6 February 2024). Fab 2 will produce 6/7nm and 40nm logic for automotive, industrial, consumer, and HPC end-markets, with combined Fab 1 + Fab 2 capacity exceeding 100,000 12-inch wafers per month. Construction targets year-end 2024; operations target year-end 2027. Combined with the 476 billion yen Fab 1 grant, total JASM subsidies reach ~1.208 trillion yen, the largest single direct manufacturing subsidy in Japanese history. METI conditions require >=10 years of post-startup production and >=50% Japanese-domestic procurement of silicon wafers, materials, and components.

Regulation (EU) 2023/1781, published in the Official Journal on 18 September 2023 and in force from 8 October 2023, establishes the EU Chips Act: a three-pillar framework targeting 20% of global semiconductor production by 2030 (up from approximately 9% in 2022) by mobilising EUR 43bn in public and private investment. Pillar 1 (Chips for Europe Initiative, EUR 3.3bn committed from EU budget) funds R&D, pilot production lines, and design infrastructure. Pillar 2 creates a fast-track permitting regime for "Integrated Production Facilities" (IPFs) and "Open EU Foundries" (OEFs) that qualify as being in the Union's interest. Pillar 3 establishes a supply-chain monitoring mechanism and grants the Commission power to mandate priority orders from designated facilities during a declared semiconductor crisis.

On 9 August 2023 the German Federal Cabinet adopted the government draft Wirtschaftsplan 2024 of the Climate and Transformation Fund (Klima- und Transformationsfonds, KTF) and the accompanying 2024–2027 financial plan. The plan envisaged ca. EUR 211.8 bn of programme spending across 2024–2027 (EUR 57.6 bn in 2024 alone), funded by national and European emissions-trading revenues plus federal grants, with major lines for semiconductor production (~EUR 4.0 bn in 2024), hydrogen industry build-out (~EUR 3.8 bn), building renovation (~EUR 18.9 bn), EEG renewables support (~EUR 12.6 bn) and electric mobility. The KTF is the principal German federal vehicle for co-financing the EU Chips Act state-aid envelope, IPCEI Hydrogen, decarbonisation contracts (Klimaschutzverträge) and other net-zero-aligned industrial-policy subsidies.

The Korean National Assembly passed an amendment to the Restriction of Special Taxation Act (조세특례제한법, Act No. 19234) on 30 March 2023, promulgated 31 March 2023 and retroactive to 1 January 2023. The amendment enhanced the investment tax credit (ITC) for "national strategic technology" (국가전략기술) semiconductor facility investment: large companies receive a 15% ITC on qualifying capital expenditure (up from 8% in the December 2022 base version); small and medium enterprises receive 25%. An additional temporary 10% incremental credit applies for annual investment exceeding the prior 3-year average (effective 2023-2025). Internationally termed the "K-Chips Act," the measure directly mirrors the US CHIPS Act's 25% advanced- manufacturing investment tax credit. Principal beneficiaries are Samsung Electronics (Samsung Foundry plus DRAM/NAND capex of KRW 20-30 trillion per year) and SK Hynix (memory fabs at Icheon and Cheongju, HBM expansion). In the same session the National Assembly passed companion legislation on secondary-battery (EV) investment with equivalent credit rates. The Korean government projected annual tax savings for the semiconductor sector of approximately KRW 1-2 trillion.

The Legislative Yuan of Taiwan (ROC) passed amendments to Articles 10-2 and 72 of the Statute for Industrial Innovation ("產業創新條例") on third reading on 7 January 2023. The amendment, internationally termed the "Taiwan Chips Act," is implemented from 1 January 2023 to 31 December 2029. Article 10-2 grants Taiwan-registered companies that occupy key positions in international supply chains a 25% investment tax credit on qualifying forward-looking innovative R&D expenditure (capped at 30% of the year's profit-seeking enterprise income tax payable), plus a 5% credit on the purchase of brand-new machinery or equipment used in own-account advanced manufacturing processes (also capped at 30%). Eligibility thresholds set by the Ministry of Finance require annual R&D spend of at least NT$6bn, R&D intensity (R&D / net operating revenue) of at least 6%, and an effective tax rate of at least 15% (12% for FY2023 only); the 5% equipment credit additionally requires equipment expenditure of at least NT$10bn. The measure is Taiwan's principal supply- side response to the US CHIPS Act, the EU Chips Act, the K-Chips Act, and Japan's METI subsidy programme, and is designed to retain TSMC, MediaTek, and other leading-edge silicon investment onshore as overseas subsidies pull capacity to Arizona, Kumamoto, Dresden, and elsewhere.

The CHIPS and Science Act (Public Law 117-167), signed into law by President Biden on 9 August 2022, appropriated $52.7 billion in direct semiconductor industry support: $39B in manufacturing incentives administered by the Commerce Department, $13.2B for R&D and workforce, and $0.5B for legacy-chip and supply-chain programs. It also created an Advanced Manufacturing Investment Credit (Section 48D) — a 25% refundable investment tax credit on qualified semiconductor manufacturing property. The law included a "guardrails" clause prohibiting recipients from expanding advanced-node capacity in countries of concern (most prominently China) for 10 years following award.

The Spanish Council of Ministers approved on 24 May 2022 the Strategic Project for the Recovery and Economic Transformation of Microelectronics and Semiconductors (PERTE Chip) within the framework of the Plan de Recuperacion, Transformacion y Resiliencia (financed in large part by NextGenerationEU funds). The package commits a public envelope of roughly EUR 12.25bn through 2027 across four lines: scientific R&D capacity (~EUR 1.165bn), chip design including fabless companies (~EUR 1.330bn), manufacturing-plant construction including front-end below-5nm and above-5nm fabs (~EUR 9.350bn), and dynamisation of ICT/electronics manufacturing including a venture fund for semiconductor startups (~EUR 0.400bn). The Sociedad Espanola para la Transformacion Tecnologica (SETT), formally constituted by Real Decreto 676/2024 of 16 July 2024, is the operational vehicle managing more than EUR 10.75bn of the envelope.

METI committed 476 billion yen (~$3.3bn) in direct subsidies covering approximately half the construction cost of Japan Advanced Semiconductor Manufacturing K.K. (JASM), a purpose-built joint venture fab at Kikuyo Town, Kumamoto Prefecture. JASM shareholders are TSMC (86.5%), Sony Semiconductor Solutions (6%), Denso (6%), and Toyota Motor (1.5 %). The fab manufactures 12nm, 16nm, 22nm, and 28nm mature-node chips targeting automotive-grade, industrial, and IoT applications. A groundbreaking ceremony was held on 13 April 2022; the facility officially opened on 24 February 2024 and reached commercial production in December 2024. JASM represents Japan's first new leading-edge wafer fab in decades and the largest single foreign direct investment in Japanese manufacturing history.