Industrial Policy & Trade Monitor· 2665 actions· ✨ 90 recent

On 9 April 2026 the Government of India, exercising powers under section 4(1) of the Special Economic Zones Act 2005, gazetted a 66.166-hectare sector-specific Special Economic Zone at Dholera Special Investment Region, Gujarat for Tata Semiconductor Manufacturing Pvt. Ltd, exclusively for electronic hardware, software and IT/ITES. The notification is the statutory site- enabling instrument for India's first commercial-scale wafer-fab plant — a ~INR 91,000 crore (~USD 11bn) Tata Electronics / PSMC (Powerchip, Taiwan) joint project announced under India Semiconductor Mission (ISM) 1.0 in February 2024 — and follows the Letter of Approval issued on 17 March 2026. The same notification designates the SEZ as an Inland Container Depot under the Customs Act 1962 with effect from 9 April 2026, enabling on-site customs clearance for fab inputs.

India's Department for Promotion of Industry and Internal Trade (DPIIT) issued Press Note 2 of 2026 on March 15, 2026 (following Cabinet approval on March 10, 2026), recalibrating the Press Note 3 (2020) FDI framework for investments from countries sharing a land border with India. Global investors with up to 10% non-controlling Chinese (or other land-border) shareholding can now invest in India under the automatic route across sectors, while entities domiciled in China, Hong Kong, Pakistan, Nepal, Bhutan, Bangladesh, Myanmar and Afghanistan continue to require prior government approval. For 40 designated strategic sub-sectors — including rare earth permanent magnets, polysilicon and ingot-wafer manufacturing, printed circuit boards, electronic capital goods, Li-ion batteries and machine tools — proposals will be decided within a binding 60-day window, with majority Indian ownership and control mandated at all times. Effective from the date of the corresponding amendment to the FEMA Non-Debt Instruments Rules.

On 1 February 2026 Finance Minister Nirmala Sitharaman, presenting the Union Budget 2026-27, announced the launch of India Semiconductor Mission (ISM) 2.0 — the second-phase national semiconductor industrial-policy framework succeeding ISM 1.0 (2021, INR 76,000 crore). The Budget makes an initial INR 1,000 crore provision for ISM 2.0 in FY 2026-27 and raises the Electronics Components Manufacturing Scheme (ECMS) outlay from INR 22,919 crore to INR 40,000 crore. ISM 2.0's distinct architecture centres on four strategic priorities not in ISM 1.0: (i) indigenous semiconductor equipment, chemicals, gases and materials production, (ii) full-stack Indian semiconductor IP design, (iii) industry-led R&D and skills/training centres, and (iv) domestic and global supply-chain integration. Total mission outlay reported as approximately INR 1-1.2 lakh crore (~USD 12-14bn) is being finalised; Cabinet clearance and the formal scheme launch are expected by mid-2026.

Decision No. 582 of 2025 of Egypt's Ministry of Investment and Foreign Trade, published in the Egyptian Official Gazette (Issue 4 bis) on 5 January 2026, carves a narrow, fee-bearing exception into Egypt's standing export ban on raw white silica sand (originally imposed by Prime Ministerial Decree No. 108 of 2022). Shipments of raw white sand destined for production projects established inside Egypt's free zones are now permitted, but only within quantities approved by the General Authority for Investment and Free Zones (GAFI) and subject to a new export duty of US$15 per metric ton (or the EGP equivalent). Outside this free-zone exception, the general export ban on the material remains in force.

The Government of Andhra Pradesh issued G.O.Ms.No.30 (ITE&C Promotion Wing, 1 August 2025) establishing the Electronics Components Manufacturing Policy 2025-30, a dedicated sub-national subsidy framework designed as a 100% matching top-up of the central MeitY Electronics Components Manufacturing Scheme (ECMS). The policy targets INR 4,600 crore (~USD 550 million) in state fiscal outlay against a USD 50 billion production target and USD 10 billion investment target, with a goal of 5 lakh (500,000) first-time jobs over the policy period. Priority components span 11 categories including displays, camera modules, multilayer PCBs, lithium-ion cells, magnetics, capacitors, and resistors, channelled into dedicated electronics zones at Sri City, Hindupur, Orvakal, and Kopparthy.

Gujarat Chief Minister Bhupendra Patel announced the Gujarat Electronics Component Manufacturing Policy 2025 (GECMP-2025) on 22 June 2025, making Gujarat the first Indian state with a dedicated sectoral stack-on-top instrument to the central Electronics Components Manufacturing Scheme (ECMS) notified by MeitY on 28 March 2025. Under GECMP-2025, any project approved by MeitY under ECMS and physically located in Gujarat is eligible for a state-matched fiscal incentive equal to the central incentive (PLI / capex subsidy) disbursed under ECMS, released by the state within 30 days of the central tranche. The policy targets INR 35,000 cr in new investment and covers multi-layer / HDI printed circuit boards, lithium-ion cells, SMD passive components, display modules, camera modules, sub-assemblies and the capital machinery required for their production. A separate R&D track provides up to INR 12.5 cr per Gujarat-based recognised institution to establish Centres of Excellence, Finishing Schools or Applied Research Laboratories. Initial applications closed 31 July 2025.

MOFCOM Announcement No. 25 of 2025 (18 May 2025) issued the final ruling in the anti-dumping investigation into copolyacetal (共聚聚甲醛, polyoxymethylene copolymer/POM copolymer, an engineering plastic used in automotive parts, electronics and precision components) imported from the United States, the EU, Taiwan and Japan, initiated 19 May 2024 (MOFCOM Announcement No. 18 of 2024). MOFCOM found dumping, material injury to the domestic industry and a causal link, and imposed anti-dumping duties effective 19 May 2025 for a five-year term under Article 38 of China's Anti-Dumping Regulations. Rates: 74.9% for US companies; 42.0% for EU companies; 3.8%-32.6% for Taiwan-region companies (named companies at the low end, "other Taiwan companies" at 32.6%); 33.9%-43.7% for Japanese companies (named companies at the low end, "other Japanese companies" at 35.5% per the 2026 succession notice). On 20 August 2026, MOFCOM Announcement No. 36 of 2026 ruled that Daicel Corporation succeeds to Polyplastics Co., Ltd.'s 35.5% rate and Daicel HPP Taiwan Co., Ltd. succeeds to Polyplastics Taiwan Co.'s 3.8% rate, both following corporate reorganizations, effective 21 August 2026 (filed below as an amendment).

The Union Cabinet, chaired by Prime Minister Narendra Modi, approved the establishment of a sixth semiconductor unit under the India Semiconductor Mission (ISM) on 14 May 2025. The unit is a joint venture between HCL and Foxconn (Hon Hai) and will build an Outsourced Semiconductor Assembly and Test (OSAT) plant near Jewar airport in the Yamuna Expressway Industrial Development Authority (YEIDA) area of Uttar Pradesh, manufacturing display driver chips for mobile phones, laptops, automobiles, PCs and other display-equipped devices. The approved investment is INR 3,700 crore (~USD 435 million), with designed capacity of 20,000 wafers per month and output of 36 million units per month.

Tamil Nadu Chief Minister M K Stalin launched the Tamil Nadu Electronics Components Manufacturing Scheme (TN-ECMS) on 30 April 2025, making Tamil Nadu the first Indian state to introduce a dedicated state-level electronics components manufacturing subsidy designed to stack on top of the central Electronics Components Manufacturing Scheme (ECMS, notified April 2025). The scheme targets ₹30,000 crore (~USD 3.6 bn) in investment and 60,000 jobs over three to five years, supporting 11 high-growth component categories including HDI/MSAP printed circuit boards, lithium-ion cells, display assemblies, camera modules, SMD passive components, multilayer ceramic capacitors, copper-clad laminates, and capital goods for electronics manufacturing. Investment thresholds are ₹50 crore for basic components and up to ₹250 crore for complex sub-assemblies; matching grants mirror the central ECMS subsidy structure with additional state concessions on stamp duty, land, and electricity costs plus workforce-development incentives.

The Union Cabinet approved the Electronics Components Manufacturing Scheme (ECMS) on 28 March 2025, notified by the Ministry of Electronics and Information Technology (MeitY) via Gazette Notification CG-DL-E-08042025-262341 on 8 April 2025. The scheme has an original outlay of Rs 22,919 crore (~USD 2.7bn) over six years (FY26-FY31, with an optional one-year gestation period), raised to Rs 40,000 crore in the Union Budget 2026-27. ECMS targets passive components, multi-layer PCBs, lithium-ion battery cells, camera modules, display assembly, electromechanicals, bare-component sub-assemblies and capital equipment for semiconductor and electronics manufacturing -- the ecosystem feeding the existing large-scale-electronics PLI and the India Semiconductor Mission. The scheme targets investment of Rs 59,350 crore, production of Rs 4,56,500 crore and 91,600 direct jobs.

On 21 March 2024, Costa Rica's Ministerio de Comercio Exterior (COMEX) launched the Hoja de Ruta para el Fortalecimiento del Ecosistema de Semiconductores — the first national semiconductor roadmap published by any Latin American country — jointly presented with US Secretary of Commerce Gina Raimondo in the context of the CHIPS Act §103 ITSI Fund partnership. President Rodrigo Chaves Robles simultaneously signed an executive decree declaring the semiconductor industry and related industries of "interés público" (public interest) and directing COMEX to lead implementation. The roadmap is organised around four pillars: Talent (Human Talent Training Incentive programme, US$6M initial budget), Incentives (OECD BEPS Pillar Two-aligned fiscal/financial R&D incentives, Free Trade Zone regime strengthening under Law 7210), Investment Attraction (CINDE-led FDI promotion targeting ATP, advanced PCB, and design-house segments), and Regulatory Improvement (customs facilitation, IP reform, export-control alignment). Costa Rica is one of seven declared ITSI-fund partner economies and hosts Intel's largest non-US assembly and test site since 1997, alongside Applied Materials, ON Semiconductor, Coherent, MaxLinear, and Boston Scientific.

Uttar Pradesh notified its first dedicated state-level Semiconductor Policy on 12 February 2024 (cabinet-cleared 30 January 2024), making it the fourth Indian state with a sectoral semiconductor incentive regime after Tamil Nadu, Karnataka and Gujarat. The policy stacks a 50% additional state capital subsidy on top of the central India Semiconductor Mission (ISM) 50% subsidy — yielding an effective ~75% capex coverage for qualifying fab, display-fab, compound-semiconductor, ATMP/OSAT, and sensor units approved by ISM. It adds a 75% land rebate on the first 200 acres for ATMP/OSAT (30% on additional land), a 5% interest subsidy (capped at ₹1 cr/year for 7 years) on investments up to ₹200 cr, 100% stamp-duty and registration-fee exemption, and a 10-year electricity-duty exemption. Within months of notification the state attracted ₹40,038 cr in investment proposals (Tarq Semiconductor, Kaynes Semicon, Aditech, Vamasundari) with ~32,000 projected jobs, prompting the cabinet to later approve mega-project incentives for investments ≥ ₹3,000 cr.

The Government of Tamil Nadu released the Tamil Nadu Semiconductor and Advanced Electronics Policy 2024 at the Tamil Nadu Global Investors Meet on 7 January 2024. The policy provides a state top-up equal to 50% of the central India Semiconductor Mission (ISM) incentive for any unit approved under the central semiconductor-fab / display-fab / compound-semiconductor / ATMP / sensor / silicon photonics / discrete semiconductor schemes, plus standalone state incentives (capital subsidy, training subsidy, product testing & prototyping support, land cost concessions, stamp duty refund, electricity tax exemption, quality certification, IP, and interest subsidy). Minimum investment threshold is ₹200 crore with a minimum of 150 jobs for the initial ₹200 crore tranche; the policy is valid for three years from the date of notification and is implemented by Guidance Tamil Nadu, the state's investment-promotion agency.

The Union Cabinet approved the Semicon India Programme on 15 December 2021, establishing the India Semiconductor Mission (ISM) as the nodal agency. The programme offers fiscal support of up to 50% of project cost for silicon semiconductor fabs, compound semiconductor facilities, display fabs, ATMP/OSAT units, and chip design. Total outlay: Rs 76,000 crore (approximately $10.2bn at 2021 exchange rates). By February 2024, the Cabinet had approved three major semiconductor units under ISM: Tata Electronics with PSMC (semiconductor fab, Dholera, Rs 91,526 crore), Tata Electronics OSAT (Morigaon, Assam, Rs 27,120 crore), and CG Power OSAT (Rs 7,584 crore), totalling over Rs 1.26 lakh crore in committed investment from private applicants.

The Union Cabinet approved the Production Linked Incentive (PLI) Scheme for Large Scale Electronics Manufacturing on 21 March 2020, with the scheme notified in the Gazette of India on 1 April 2020. Total outlay: Rs 40,995 crore (~$5.5bn) over five years. The scheme extends incentives of 4% to 6% on incremental sales (over FY 2019-20 base year) to eligible companies manufacturing mobile phones (invoice value >= Rs 15,000) and specified electronic components including ATMP units. Approved beneficiaries include Samsung, Foxconn, Wistron, Pegatron, and Indian firms Dixon, Lava, and Bhagwati (Micromax).