Industrial Policy & Trade Monitor· 2673 actions· ✨ 90 recent

On June 8, 2026, the US Department of Defense published its annual update to the Section 1260H Chinese Military Companies (CMIC) list, adding 65 entities (17 new parent companies and 48 subsidiaries), bringing the total to approximately 188–200 designated entities. Major additions span EV and battery manufacturing (BYD, NIO, CATL), consumer internet (Alibaba, Baidu, Tencent), semiconductors (SMIC, YMTC, CXMT), solar (JA Solar, Trina Solar), biotech (BGI Genomics, WuXi AppTec), drones/robotics (DJI, Unitree, RoboSense), and telecoms (TP-Link). Effective June 30, 2026, DoD is prohibited from procuring goods, services, or technology directly from listed entities; effective June 30, 2027, the ban extends to indirect supply-chain procurement through prime contractors and all sub-tiers.

Japan's Diet passed the Foreign Exchange and Foreign Trade Act (FEFTA) 2026 Amendment on 29 May 2026; the law was promulgated on 5 June 2026. The amendment represents the most significant overhaul of Japan's inbound FDI screening regime since FEFTA was first applied to national-security transactions in 2019. Three structural additions: (1) indirect-acquisition screening — extends mandatory prior-notification to acquisitions of Japanese sensitive-sector companies effected through intermediate holding structures or offshore parent vehicles, closing the principal gap exploited by Chinese and GCC SWF investors via SPV chains; (2) call-in powers — grants the Minister of Finance authority to open a review up to ten years retroactively where an acquisition was not pre-notified or where circumstances have materially changed since clearance, directly analogous to CFIUS § 721(b)(1)(D) retroactive jurisdiction; (3) cross-ministerial "Japan CFIUS" consultation framework — formally institutionalises a standing inter-agency committee (Finance, METI, MoD, NPA, MIAC) modelled on the US CFIUS committee, replacing the prior ad-hoc inter-ministerial process. Cross-ministerial and indirect-acquisition provisions entered into force immediately on promulgation (5 June 2026); remaining Cabinet-Order-level implementing provisions to follow within one year.

On 15 April 2026 Japan's Ministry of Economy, Trade and Industry (METI) published the interim summary "Manufacturing Base Strengthening Report" from the Study Group on Strengthening Manufacturing Base in Light of Geopolitical Risks. The report frames Japan's manufacturing base as the source of national power and proposes shifting economic-security support for "autonomy assurance" from "point" measures to "area"-wide measures — expanding the scope of Specified Critical Materials under the 2022 Economic Security Promotion Act (ESPA) beyond narrowly defined inputs to cover foundational petrochemicals (ethylene, propylene, methanol, synthetic rubber) and process-industry technologies (casting, forging), plus components for emerging technologies (humanoid-robot actuators and sensors, lasers for quantum computing). It is the cornerstone framework document operationalising METI's FY2026 strategic-budget package (~¥3.07 trillion overall envelope; ~¥1.23 trillion specifically for semiconductors and AI, including ¥150bn for Rapidus and ¥387.3bn for AI development) as Japan's coordinated response to deepening Chinese export-control pressure on dual-use items, gallium/germanium, graphite, antimony and heavy rare earths.

Premier Li Qiang signed State Council Order No. 834 on 31 March 2026 promulgating the "Provisions on Industrial Chain and Supply Chain Security" (18 articles), adopted at the State Council executive meeting on 13 March 2026 and effective on the date of publication. The Provisions are the first dedicated PRC administrative regulation on industrial- and supply-chain security and consolidate authorities drawn from the National Security Law, Foreign Relations Law, Anti-Foreign Sanctions Law, and Foreign Trade Law into a horizontal defensive framework. They establish a cross-agency coordination mechanism spanning roughly 15 central departments (industrial, security, cyberspace, customs and financial regulators) plus provincial governments; create a security-investigation system; and vest broad countermeasure authority over both foreign states (Article 14 — import/export prohibitions and special levies) and foreign organisations and individuals (Article 15 — import/export bans, China-investment bars, transaction prohibitions, entry bars and revocation of work or residence permits, with extension to effectively-controlled subsidiaries). The Provisions also impose compliance, information-sharing, strategic-reserve and emergency-response obligations on PRC organisations and individuals, and authorise requisition, mandated production and directed transportation in the event of supply-chain disruption.

On 31 March 2026 the Government of Vietnam issued Decree 96/2026/ND-CP, the principal implementing decree for the Law on Investment 2025 (Law 143/2025/QH15). It takes effect on its signing date and replaces Decree 31/2021/ND-CP, Decree 19/2025/ND-CP and Decree 239/2025/ND-CP — the first comprehensive overhaul of Vietnam's general FDI-licensing framework since 2021. The decree operationalises the new Special Investment Procedure (a registration-and-commitment fast-track in industrial parks, export-processing zones, hi-tech parks, concentrated digital- technology zones, free-trade zones, international financial centres and economic-zone functional areas) and details the list of 16 specially-incentivised sectors covering semiconductor and chip manufacturing, AI, big data, digital technology and high-tech R&D. It also rewrites foreign-investor market-access conditions, document procedures and dispute / grievance mechanisms.

On 11 March 2026 USTR Ambassador Jamieson Greer initiated parallel Section 301 investigations into the acts, policies, and practices of 16 economies — China, the European Union, Singapore, Switzerland, Norway, Indonesia, Malaysia, Cambodia, Thailand, Korea, Vietnam, Taiwan, Bangladesh, Mexico, Japan, and India — relating to structural excess capacity and overproduction in manufacturing sectors. The Federal Register notice (FR doc 2026-05214; dockets USTR-2026-0067 and USTR-2026-0068) was published on 17 March 2026. Covered sectors include aluminum, automobiles, batteries, cement, chemicals, electronics, energy goods, glass, machine tools, machinery, paper, plastics, processed food and beverages, robotics, satellites, semiconductors, ships, solar modules, steel, and transportation equipment. Written comments were due by 15 April 2026; USTR held the public hearing beginning 5 May 2026. This is the most sweeping multi-economy Section 301 initiative since the 2018 China investigation and is structurally distinct from the China-only 2024-05-14 §301 tariff hikes and the 2025-07-15 Brazil §301 investigation.

On 12 February 2026, Ambassador Jamieson Greer of the Office of the United States Trade Representative oversaw the signing of the US-Taiwan Agreement on Reciprocal Trade (ART) in Washington, DC. The instrument was signed under the auspices of the American Institute in Taiwan (AIT) and the Taipei Economic and Cultural Representative Office in the United States (TECRO). Headline terms: (i) US IEEPA reciprocal-tariff rate on Taiwan reduced from 20% to 15% and Section 232 auto-parts/timber/lumber rate cut from 25% to 15%; (ii) Taiwan eliminates or reduces 99% of its tariff barriers on US goods, most immediately and the remainder phased over three years; (iii) Taiwan side commits ~USD 85bn in directed purchases through 2029 (USD 44.4bn LNG/crude, USD 15.2bn civil aircraft and engines, USD 25.2bn power equipment); (iv) sectoral chapters covering tariffs, non-tariff barriers, digital trade, economic security, and high-tech supply-chain resilience. Operationally linked to the 15 January 2026 AIT-TECRO Memorandum of Understanding on investment, under which Taiwan pledges USD 250bn in direct Taiwanese-enterprise investment in the US plus USD 250bn in Taiwan-government credit guarantees (USD 500bn total) to fund US-side industrial parks/clusters in advanced semiconductors, energy, and AI manufacturing. Entry into force is conditional on Taiwan's Legislative Yuan completing its review.

On 2 February 2026 the Export-Import Bank of the United States (EXIM) Board approved a Direct Loan of up to USD 10 billion to an independently governed public-private partnership establishing the U.S. Strategic Critical Minerals Reserve ("Project Vault"), alongside nearly USD 2 billion of private-sector investment for an envelope of approximately USD 12 billion. The reserve will physically stockpile the 60 minerals on the USGS 2025 Critical Minerals List across multiple US storage facilities, with participating original equipment manufacturers (Clarios, GE Vernova, Western Digital, Boeing) committing to specific volumes and grades and trading partners (Hartree Partners, Mercuria Americas, Traxys) handling sourcing. EXIM characterises the transaction as the largest single financing in its 92-year history and the first use of EXIM authority as the financing vehicle for a domestic strategic-minerals stockpile rather than for export-credit insurance abroad.

On 1 February 2026 Finance Minister Nirmala Sitharaman, presenting the Union Budget 2026-27, announced the launch of India Semiconductor Mission (ISM) 2.0 — the second-phase national semiconductor industrial-policy framework succeeding ISM 1.0 (2021, INR 76,000 crore). The Budget makes an initial INR 1,000 crore provision for ISM 2.0 in FY 2026-27 and raises the Electronics Components Manufacturing Scheme (ECMS) outlay from INR 22,919 crore to INR 40,000 crore. ISM 2.0's distinct architecture centres on four strategic priorities not in ISM 1.0: (i) indigenous semiconductor equipment, chemicals, gases and materials production, (ii) full-stack Indian semiconductor IP design, (iii) industry-led R&D and skills/training centres, and (iv) domestic and global supply-chain integration. Total mission outlay reported as approximately INR 1-1.2 lakh crore (~USD 12-14bn) is being finalised; Cabinet clearance and the formal scheme launch are expected by mid-2026.

On 29 January 2026, European Council President António Costa and Vietnamese Prime Minister Phạm Minh Chính signed a Joint Statement in Hanoi upgrading EU-Vietnam bilateral relations to a Comprehensive Strategic Partnership (CSP) — the highest tier in Vietnam's diplomatic hierarchy, placing the EU on the same level as Vietnam's CSPs with China, Russia, India, South Korea, Japan, Australia, France, and the United States. The CSP establishes a reinforced bilateral cooperation framework spanning critical raw materials, semiconductor supply chains, artificial intelligence, trusted 5G infrastructure, climate and energy transition, security and defence (including cyber and maritime), and full implementation of the 2019 EU-Vietnam Free Trade Agreement (EVFTA) tariff-elimination schedule plus ratification of the EU-Vietnam Investment Protection Agreement (EVIPA). It is the EU's eleventh CSP globally and its second in Southeast Asia (after Singapore, 2024), and constitutes the foundational bilateral parent framework for all future EU-Vietnam cooperation under the EU Critical Raw Materials Act (CRMA) Article 13 third-country strategic-project designation pipeline, given Vietnam's approximately 22 Mt rare-earth reserves — the world's second-largest deposit after China.

South Korea's National Assembly passed the "Special Act on Strengthening and Supporting the Competitiveness of the Semiconductor Industry" (반도체산업 경쟁력 강화 및 지원에 관한 특별법) on 29 January 2026 by 199 votes in favour out of 206 members present, after roughly 18 months of inter-party deadlock. The act establishes (i) a Presidential Commission for Enhancing Semiconductor Competitiveness as the central inter-ministerial coordination body, (ii) a statutory five-year master plan with annual implementation plans, (iii) a dedicated semiconductor industry special account ("반도체산업 특별회계") to ring-fence funding for fabs, materials, parts and equipment, and packaging across the full memory + system-LSI + design + manufacturing supply chain, and (iv) authority to designate semiconductor clusters outside the greater Seoul area with relocation incentives. Promulgation by the Cabinet is expected shortly after passage; effectiveness contingent on enforcement-ordinance finalisation, expected Q3 2026. The KRW 2tn anchor envelope of the special account does not begin disbursing until 2027 because companion amendments to the National Finance Act were not enacted in time.

On 14 January 2026 President Trump issued a Presidential Proclamation under Section 232 of the Trade Expansion Act of 1962 imposing a 25% ad valorem tariff on imports of certain advanced computing chips and their derivative products, effective 12:01 a.m. EST on 15 January 2026. The measure adopts findings of the Section 232 investigation initiated 1 April 2025 (Department of Commerce report transmitted 22 December 2025) into semiconductors, semiconductor manufacturing equipment, and derivative products. Coverage is narrowly drawn to high-performance AI accelerators meeting specified technical parameters (publicly characterised as covering devices in the NVIDIA H200 / AMD MI325X performance tier), with broad use-based exemptions for chips going into US data centres, US R&D, US repairs, and other uses deemed to strengthen domestic supply chains.

The US Bureau of Industry and Security issued a final rule (RIN 0694-AK43, 91 FR 1684, signed 13 January 2026, effective 15 January 2026) revising the EAR license-review policy for exports of certain advanced-computing integrated circuits to end-users in China and Macau from a presumption of denial to case-by-case review. Eligibility is limited to commodities controlled under ECCN 3A090.a and 3A090.b with a Total Processing Performance (TPP) below 21,000 and total DRAM bandwidth below 6,500 GB/s — the band that covers NVIDIA H200 and AMD MI325X-equivalents and below. To qualify, exporters must certify (i) sufficiency of US supply such that the export will not delay domestic orders or divert foundry capacity, (ii) that aggregate TPP of advanced-node ICs exported to China or Macau will not exceed 50% of domestic shipments, (iii) compliance with end-use and end-user prohibitions, and (iv) prior performance review by a qualified independent third-party testing lab headquartered in the United States. The rule is the first material rollback of the October 2022 / October 2023 / December 2024 advanced-computing export-control architecture and operationalises the Trump-administration policy of trading H200-class chip access against Chinese cooperation on critical minerals, fentanyl precursors and Taiwan-strait restraint.

On 7 January 2026 the National Semiconductor and Advanced Electronics Industry Policy Committee (the "Semiconductor Board"), chaired by Deputy Prime Minister and Minister of Finance Ekniti Nitithanprapas, endorsed the Draft National Strategy for the Development of the Semiconductor and Advanced Electronics Industry, prepared by the Board of Investment (BOI) with Roland Berger after a public hearing in October 2025. The 25-year roadmap (2026-2050) targets more than THB 2.5 trillion (~USD 79.6 billion) in investment, training of more than 230,000 highly-skilled engineers, and construction of a complete upstream-to- downstream semiconductor ecosystem with phased milestones for 2030, 2040 and 2050. The strategy prioritises five product groups where Thailand has competitive potential — Power chips, Sensors, Photonics, Analog and Discrete chips — and explicitly aims to move the country beyond OSAT (Outsourced Semiconductor Assembly and Test) into IC design and upstream wafer fabrication ("Made-in-Thailand chips"). Implementation runs through a five-pillar BOI support mechanism: long-term low-interest financing and grants, human-capital development, technology upgrade of the Microelectronics Technology Centre (TMEC), specialised industrial clusters with guaranteed renewable-energy and water security, and streamlined regulatory approvals including a new BOI "FastPass" fast-track facility (16 pilot projects worth THB 170 billion already processed).