Industrial Policy & Trade Monitor· 2667 actions· ✨ 89 recent

On 18 September 2025 the Bundestag adopted the Gesetz zur Errichtung eines Sondervermögens "Infrastruktur und Klimaneutralität" (SVIKG), authorising up to EUR 500 bn of additional federal borrowing over a twelve-year horizon outside the constitutional debt brake, on the basis of the new Article 143h Grundgesetz inserted by the March 2025 constitutional amendment. The envelope splits into up to EUR 100 bn for Länder and municipal infrastructure (channelled via the companion Länder- und Kommunal-Infrastrukturfinanzierungsgesetz, LuKIFG, passed 9 October 2025), EUR 100 bn transferred to the Klima- und Trans- formationsfonds (KTF) in annual instalments through 2034, and up to EUR 300 bn for additional federal investments in transport, energy/ heat, hospital, education, digitalisation, civil protection and R&D infrastructure. Investments are eligible retroactively from 1 January 2025 and may be approved through 31 December 2036; loan repayment begins no later than 1 January 2044. SVIKG is the largest single industrial-finance instrument launched by an EU member state in the post-2022 industrial-policy cycle.

On 17 September 2025 the General Office of the Shanghai Municipal People's Government issued Hufubangui [2025] No. 8, a five-year (26 September 2025 - 25 September 2030) state-aid framework to accelerate frontier-technology innovation and cultivate "future industries" across six domains — future manufacturing, future information, future materials, future energy, future space and future health. Targeted technology areas include cell and gene therapy, brain-computer interfaces, biomanufacturing, embodied intelligence (humanoid robotics/AI hardware), fourth-generation semiconductors, silicon photonics, 6G, neuromorphic computing, quantum technology, controlled nuclear fusion and regenerative medicine. Support is disbursed as tiered direct subsidies rather than tax relief, with named ceilings up to CNY 30 million per proof-of-concept/R&D platform and CNY 20 million per high-quality incubator or first-product/batch innovation award.

The Bureau of Industry and Security (BIS) amended the Export Administration Regulations (EAR) to add 32 entities to the Entity List, with the largest bloc — 23 entries — under the destination of China, plus India (1), Iran (1), Singapore (1), Taiwan (1), Turkey (3), and the United Arab Emirates (2). The rule also removed two addresses from one Russian entry (Intertech Rus LLC) and made 27 typographical corrections to existing entries. Several Chinese additions — including Shanghai Fudan Microelectronics, Sino IC Technology, GMC Semiconductor (Wuxi), and Chinese Academy of Sciences units (National Time Service Center; Aerospace Information Research Institute) — were given footnote 4 designations, extending the EAR's foreign-direct-product (FDP) reach to non-US-origin items destined for Russian military end use. Three Turkish entries (Atempo, EB Teknoloji, Dentun Elektronik) and one Indian entry (AR Sales Pvt Ltd) were footnote-3 Russian Procurement Entity designations. The rule is a final rule effective September 12, 2025; all listed parties are subject to a license requirement for all items subject to the EAR with a presumption-of-denial review policy.

On 2025-09-12, Shanghai STAR Market-listed chip-equipment maker Piotech Inc. (拓荆科技, 688072.SH) disclosed a CNY 450 million (~USD 63 million) capital increase into its controlling subsidiary Piotech Jianke (Haining) Semiconductor Equipment Co., Ltd. (拓荆键科(海宁)半导体设备有限公司), which develops 3D-integration/hybrid-bonding equipment. Guotou Jixin (国投集新), a vehicle wholly owned (99.9%) by the National Integrated Circuit Industry Investment Fund Phase III ("Big Fund III"), took a 12.71% stake for roughly CNY 192 million, becoming Piotech Jianke's second-largest shareholder; Piotech's own stake fell to approximately 53.57% post-round. The round valued Piotech Jianke's pre-money equity at CNY 2.5 billion — a roughly 44x premium to its RMB 55.2 million book net-asset value as of 2024-12-31 — reflecting Big Fund III's first disclosed equity deployment since its 2024-05-24 establishment.

The European Investment Bank (EIB) signed a EUR 150 million loan agreement with Soitec SA on 10 September 2025 to finance research, development and innovation (RDI) activities and associated capital expenditure for the next generation of engineered substrates (silicon-on-insulator, SOI) used in the semiconductor industry. The financing covers a first industrial deployment line for the new substrate technology plus a related water-treatment facility, against a total project cost of approximately EUR 358 million. The loan was approved by the EIB Board on 16 July 2025 and carries a two-and-a-half-year grace period followed by a ten-year amortization schedule.

Commission Delegated Regulation (EU) 2025/2003, adopted by the European Commission on 8 September 2025, published in the Official Journal on 14 November 2025 and entering into force on 15 November 2025, amends Annex I of Regulation (EU) 2021/821 to implement the 2024 multilateral decisions of the Wassenaar Arrangement, MTCR, Australia Group, and NSG. The most extensive EU semiconductor-equipment additions since the 2021 framework took effect: ALD, epitaxial deposition, lithography, EUV pellicles/masks/reticles, SEM, and etching equipment, plus tighter controls on quantum computers, advanced FPGAs/ICs for AI training, additive-manufacturing, and cryogenic/superconducting components. The regulation is the EU-side update layer of the Western dual-use export control architecture, structurally aligned with the US BIS advanced- computing/SME packages and the Netherlands DUV-licensing regime.

On 8 September 2025, the UK Ministry of Defence published the Defence Industrial Strategy 2025 — "Making Defence an Engine for Growth" (CP 1388) — the first comprehensive cabinet-level UK defence industrial strategy in over a decade and the sector plan for Defence under the UK Modern Industrial Strategy umbrella (IS-8). The strategy was published alongside the Strategic Defence Review 2025 and operationalises the largest sustained defence- spending increase since the Cold War (rising to 2.6% of GDP by 2027 with ambition to 3% in the next Parliament). It defines six priority outcomes (growth, backing UK businesses, defence innovation, resilient industrial base, procurement transformation, enduring partnerships); establishes UK Defence Innovation (UKDI) within the MOD with a ringfenced £400m budget to accelerate dual-use technology; identifies priority defence capabilities (combat air, complex weapons, directed-energy weapons, next- generation land and maritime systems) plus dual-use sub-sectors (quantum, drones/autonomy, space, AI, cyber, engineering biology, advanced connectivity); and flags resilience priorities in steel, construction, energetic materials, batteries, semiconductors and rare earths.

The 22nd Regulation Amending the Foreign Trade and Payments Ordinance (Zweiundzwanzigste Verordnung zur Änderung der Außenwirtschaftsverordnung), promulgated in Bundesgesetzblatt I 2025 Nr. 261 and entering into force on 1 November 2025, updates Germany's national export-control list (Ausfuhrliste, Annex AL to the AWV) to align with the 2024-cycle decisions of the Wassenaar Arrangement, MTCR, Australia Group, and NSG. It is the German national implementation layer that parallels Commission Delegated Regulation (EU) 2025/2003 — both ingest the same multilateral consensus into the EU+DE dual-use perimeter covering ALD, epitaxial deposition, lithography (EUV pellicles/masks/reticles), SEM and etching equipment, quantum computers, cryogenic components, advanced FPGAs/ICs for AI training, and additive-manufacturing systems. Sets the export-list baseline against which BAFA licence determinations from November 2025 onward are made. Distinct from the parallel AWG Implementing Act (entered into force 2026-02-06) which transposed EU Directive 2024/1226 into German sanctions criminal law.

The Yogi Adityanath cabinet approved the Uttar Pradesh Electronics Component Manufacturing Policy 2025 (UP ECMP-2025) on 3 September 2025, designating an effective date retroactive to 1 April 2025 for a six-year policy horizon (sunset 31 March 2031). Administered by UPLC and Invest UP, the policy targets INR 5,000 crore in new investment by layering state-level incentives on top of the central MeitY Electronics Component Manufacturing Scheme (ECMS), covering eleven priority component categories including displays, camera modules, multilayer PCBs, magnetics, lithium-ion cells, capacitors, resistors, semiconductor packaging substrates, sensors, connectors, and oscillators. UP is the fourth major Indian state (after Gujarat, Tamil Nadu, and Andhra Pradesh) to publish a dedicated ECMS-stacking instrument, completing the Big-Four-state cluster for ECMS-anchored greenfield investment.

On 3 September 2025 South Korea's Financial Services Commission announced an expanded KRW 1 trillion (approx. USD 720 million) Corporate Restructuring Fund No.6 (기업구조혁신펀드 6호), scaling up from the KRW 500 billion originally budgeted in the 2025 first supplementary budget. The fund targets marginal ("한계기업") companies in six export-oriented key industries — petrochemicals, steel, automotive, semiconductors, displays and secondary batteries — whose financial position is deteriorating due to recent US tariff actions. KAMCO ran a fund-manager recruitment call from 3-24 September 2025, selecting four operators to run blind funds, with formation targeted for October 2025. At least 60% of raised capital must be invested in the six target industries, and the subordinated (first-loss) capital contribution ratio was raised from 5% to 10% versus prior restructuring funds to attract private co-investment.

On 2 September 2025 the Bureau of Industry and Security (BIS) published a final rule (90 FR 42315; FR Doc 2025-16724) revising the Export Administration Regulations (EAR) to substantially relax export and reexport controls on Syria, consistent with Executive Order 14312 ("Providing for the Revocation of Syria Sanctions", 30 June 2025) and the parallel post-Assad sanctions architecture (PAARSS, OFAC, 25 Sep 2025). The rule (i) revises previously restrictive licence-application review policies for items subject to the EAR to be more favourable, (ii) extends the geographic eligibility of existing license exceptions to Syria, and (iii) adds new license exceptions for Syria including for EAR99 items. The rule is effective on publication; section 6 of EO 14312 had already waived application of section 5(a)(1) of the Syria Accountability Act with respect to items on the Commerce Control List, and section 7 waived CBW Act sections 307(a)(5) and 307(b)(2)(C) restrictions on EAR-subject exports to Syria.

The US Bureau of Industry and Security (BIS) amended the Export Administration Regulations to remove three foreign-owned semiconductor fabs operating in China — Intel Semiconductor (Dalian) Ltd, Samsung China Semiconductor Co. Ltd, and SK hynix Semiconductor (China) Ltd — from the Validated End-User (VEU) Authorizations list (15 CFR Part 748). BIS framed the VEU program as a "loophole" that previously allowed these fabs to receive most US-origin chipmaking equipment, software and technology license-free, a privilege no US-owned fab in China ever had. After the effective date, every restricted shipment to these fabs will require an individual export license, reviewed case-by-case under the existing 2022/2023 advanced- computing controls. The rule is published as Federal Register document 2025-16735 (90 FR 42321), Docket BIS-2025-0555, RIN 0694-AK32.

South Korea's National Assembly passed an amendment to the Korea Development Bank (KDB) Act on 2025-08-27 (428th session, 3rd plenary sitting, 164-1 with 164 votes in favour of 165 cast), raising KDB's statutory capital ceiling from KRW 30 trillion to KRW 45 trillion and creating a new "Advanced Strategic Industry Fund" inside KDB. The fund is capitalised at KRW 50 trillion or more over five years via low-rate government-guaranteed bonds and is earmarked for the ten officially designated advanced strategic industries (AI, semiconductors, bio/vaccines, defense, robotics, hydrogen, secondary batteries, displays, future mobility) via cheap loans and equity investment. KDB intends to use the fund as seed capital for a wider "National Growth Fund" that blends in private and pension capital to reach KRW 100 trillion+ in total strategic-industry financing over five years.

On 22 August 2025 South Korea's National R&D Program Evaluation Steering Committee, convened by MOTIE, finalized an exemption from the mandatory preliminary feasibility study (예비타당성조사 면제) for the "K-On-Device AI Semiconductor Technology Development" project, clearing the roughly KRW 689.15 billion (approx. USD 496 million) program to proceed toward FY2026 budget allocation without the standard multi-year vetting delay. The project funds full-stack development — custom AI chip design, software, and modules — across four demand-anchored industries: automotive (Hyundai Motor), IoT/home appliances (LG Electronics), machinery/robotics (Doosan Robotics, Daedong), and defense (Korea Aerospace Industries). MOTIE structured the program so end-user demand companies participated directly in project planning, pairing them with domestic fabless design and foundry manufacturing firms to build a domestic on-device AI semiconductor ecosystem, ahead of full budget confirmation and formal program launch.

On 22 August 2025 Intel and the Trump administration announced that the US government would acquire a 9.9% equity stake in Intel — 433.3 million common shares at $20.47/share, worth $8.9 billion — funded by converting $5.7 billion in remaining, undisbursed CHIPS and Science Act grants and $3.2 billion from the Department of War's Secure Enclave program into equity rather than paying them as grants. Combined with $2.2 billion already disbursed under Intel's CHIPS award, total federal support reaches $11.1 billion. 274.6 million shares transferred to Commerce at closing on 27 August 2025; the remaining 158.7 million sit in escrow pending Secure Enclave disbursement milestones. The government also received a five-year warrant for an additional 5% of Intel shares at $20/share, exercisable only if Intel's ownership of its foundry business falls below 51%.

The Union Cabinet chaired by Prime Minister Narendra Modi approved on 12 August 2025 four new semiconductor manufacturing units under the India Semiconductor Mission (ISM) Phase 1: SiCSem Private Limited (Silicon Carbide compound-semiconductor fab, Odisha, with UK partner Clas-SiC Wafer Fab Ltd.), 3D Glass Solutions Inc. (advanced glass-substrate packaging, Odisha), Continental Device India Private Limited / CDIL (discrete power-semiconductor expansion, Punjab), and Advanced System in Package Technologies / ASIP (OSAT unit with South Korea's APACT Co. Ltd, Andhra Pradesh). Cumulative investment INR 4,600 crore (~USD 525mn); 2,034 skilled jobs at full ramp. This brought total approved ISM Phase 1 projects to 10 across 6 states, with cumulative committed investment of approximately INR 1.60 lakh crore (~USD 18bn).

Banque des Territoires, acting on behalf of the French State under the France 2030 programme, launched a EUR 500 million fund-of-funds called "Global Tech Coté" on 7 August 2025. The vehicle takes minority stakes (EUR 15 million minimum, capped at 10% of a target fund's subscribed capital) in privately-managed investment funds that in turn back publicly-listed French technology companies with strong growth potential, aiming to build up domestic asset-management capacity alongside the state's stated goal of channelling capital into equities. The selection window for management companies runs until 31 December 2026 or until the EUR 500 million envelope is exhausted, whichever comes first.

METI certified a Supply Security Plan (供給確保計画) filed by Nitto Boseki Co., Ltd. under Japan's Economic Security Promotion Act, designating low-thermal-expansion glass cloth for cutting-edge logic IC packaging substrates as a "specified critical good" material input. The certification (plan no. 2025-semicon-3-1, approved 7 August 2025) qualifies Nitto Boseki for a grant of up to JPY 2.4 billion (~USD 16 million) toward a JPY 7.2 billion new production line at its Fukushima No. 2 plant, targeting a roughly 200% increase in domestic capacity for this glass-cloth grade with supply starting July 2027 and a committed 10-year production run.

The Henan Provincial People's Government issued Yuzheng [2025] No. 18 (豫政〔2025〕18号), "Several Policy Measures to Support Enterprises in Reducing Costs and Increasing Efficiency" (河南省支持企业降本增效若干政策 措施), on 2025-08-04, effective on issuance. The package is a horizontal, cross-sector cost-reduction bundle spanning ten cost categories: R&D subsidies of up to 30% of investment (capped at RMB 5-20 million per project depending on program), equipment-renewal loan interest subsidies and technical-transformation grants (15-20% of investment, capped at RMB 5-10 million), labor-cost relief (unemployment-insurance rate held at 1%, workers'-comp rate cut 20%, unemployment-insurance stabilization rebates of 30-60% through end-2025), financing-cost relief (RMB 160 billion 2025 lending target to tech enterprises, up to RMB 4 million in start-up guarantee loans), logistics-cost relief (toll exemptions for hydrogen trucks and 30% toll discounts for electric trucks through 2025-12-31, RMB 10,000-140,000 scrap-and-renew subsidies for aging trucks), and import/export-cost relief (tariff and quick-approval facilitation for integrated-circuit and advanced-equipment imports, up to 70% subsidy on overseas certification costs).

METI certified a Supply Security Plan (供給確保計画) filed by DIC Corporation under Japan's Economic Security Promotion Act, designating epoxy resin used in semiconductor packaging/encapsulation as a "specified critical good" material input. The certification (plan no. 2025-semicon-2-1, approved 31 July 2025) qualifies DIC for a grant of up to JPY 3 billion (~USD 20.1 million) toward a new epoxy-resin plant at its Chiba (Ichihara) factory, targeting roughly a 59% increase in domestic production capacity for semiconductor-grade epoxy resin, with supply starting July 2029.

On 27 July 2025, President Trump and European Commission President Ursula von der Leyen reached political agreement at Turnberry, Scotland, on a Framework Agreement on Reciprocal, Fair and Balanced Trade. The framework was formalised in a Joint Statement published on 21 August 2025 by the White House and DG TRADE. The deal establishes a 15% all-inclusive (MFN + Section 232) US tariff ceiling on the vast majority of EU originating goods — including autos, pharmaceuticals, semiconductors, lumber, and chemicals — replacing the threatened 20-30% reciprocal tariff trajectory under EO 14257 (April 2025). Steel and aluminium are excluded from the 15% ceiling and remain at the 50% Section 232 rate pending negotiation of a quota solution. In return, the EU commits to: (i) eliminate tariffs on all US industrial goods, (ii) preferential market access for a wide range of US agricultural and seafood products, (iii) suspension of its rebalancing countermeasures under Reg 2025/778 (suspension effective 7 August 2025), (iv) expected energy offtake of $750bn (LNG, oil, nuclear) through 2028, (v) at least $40bn in US AI chip purchases, and (vi) facilitation of $600bn in additional EU corporate investment into the US through 2028. Effective from 1 September 2025, the US applies MFN-only treatment (no 15% top-up) to: aircraft and parts, generic pharmaceuticals and ingredients, chemical precursors, cork, and certain unavailable natural resources. The framework is not legally binding but anchors the bilateral architecture; it is the largest-economy ART-programme deal alongside US-UK, US-Japan, US-Korea, US-Taiwan, and US-Indonesia.

The European Commission approved a EUR 41.5 million Italian direct-grant state aid measure to Ephos Srl, an Italian photonics SME, to help finance "Fab-2," a new manufacturing facility for glass-based photonic integrated circuits used in AI datacentres, high-performance computing and quantum computing. The aid was cleared under the European Chips Act state aid framework (Commission case SA.117987, decision of 25 July 2025) and forms part of a EUR 104.9 million total project investment. Ephos already operates a first facility (Fab-1) in Milan; Fab-2 is intended to be the first EU facility of its kind processing this glass-substrate photonic chip technology at scale.

On 23 July 2025 the General Office of the Shanghai Municipal People's Government issued Hufu Bangui [2025] No. 5, "Several Measures to Support Enterprises in Strengthening Basic Research and Enhancing New Momentum for High-Quality Development," effective 1 August 2025 through 31 July 2030. The measure tiers one-time subsidies of CNY 2m-10m/year to enterprises based on basic-research investment (CNY 10m-50m, 50m-100m, and 100m+ investment bands), reimburses 50% of shared scientific- equipment usage fees (capped CNY 1m/year), and grants a 100% tax deduction for corporate donations to basic research at nonprofits and universities, with integrated circuits, biomedicine and artificial intelligence named as priority participating industries.

METI certified a Supply Security Plan (供給確保計画) filed by JX Metals (JX Nippon Mining & Metals Corporation, now JX Advanced Metals) under Japan's Economic Security Promotion Act, designating copper-based sputtering targets used in semiconductor wiring as a "specified critical good." The certification (plan no. 2025-semicon-1-1, approved 18 July 2025) is the first in the 2025 semiconductor tranche and qualifies JX Metals for a grant of up to JPY 2.2 billion (~USD 14.8 million) toward roughly JPY 6.6 billion of capex expanding sputtering-target production capacity at its Hitachinaka (Ibaraki Prefecture) plant.

The Beijing Economic-Technological Development Zone (BDA / Yizhuang) Management Committee issued Jingjiguanfa [2025] No. 15, "Several Measures on Promoting Quantum Technology and Industry Development in the Beijing Economic-Technological Development Zone," on 2025-07-14, effective immediately and in force through 2027-12-31. The package spans ten support lines covering the full quantum stack (computing hardware/software, communications, sensing): up to RMB 2,000,000 one-off support for disruptive early-stage R&D projects, R&D-investment matching at 20% of an enterprise's prior-year R&D spend capped at RMB 5,000,000, 1:1 matching up to RMB 30,000,000 for enterprises undertaking state/municipal quantum research tasks, RMB 500,000 per product for new-technology/product certifications, up to RMB 100,000 per flagship application-demonstration project, up to RMB 30,000,000/year (three years max) for quantum-computing cloud platforms and compute centers, up to RMB 5,000,000/year (three years max) for operating industry-ecosystem platforms, rent subsidies up to RMB 1.5/sqm/day (max 2,000 sqm, three years), and talent, financing ("patient capital"/future-industry guidance fund), and international- cooperation support. The zone targets an internationally influential quantum industry cluster by 2027.

Malaysia's Ministry of Investment, Trade and Industry, acting through the Strategic Trade Controller, issued Directive No. 1/2025 on 14 July 2025 invoking Section 12 of the Strategic Trade Act 2010 to declare high-performance US-origin AI chips (GPUs, TPUs, neural processors, AI accelerators meeting the Annex I total-processing-performance and performance-density thresholds) as "unlisted controlled items". With effect from 14 July 2025, any export, transshipment, or transit of those chips through Malaysian territory requires a Strategic Trade Permit, a 30-day prior notification, an export-control classification from the manufacturer, and a re-export licence from the originating country. The directive is the formal Malaysian response to US scrutiny over alleged Nvidia AI-chip flows to China via Malaysian freight forwarders and data-centre operators, and it remains binding even after the US relaxes its own export rules.

Japan Bank for International Cooperation (JBIC) signed a loan agreement on 2025-07-11 for approximately USD 46 million with MGC Pure Chemicals America, Inc. (MPCA), the US subsidiary of Mitsubishi Gas Chemical Company. Co-financed alongside Bank of Yokohama, Hachijuni Bank, and Joyo Bank, the total co-financing package reaches USD 77 million. Proceeds fund expansion of MPCA's Arizona production capacity for ultra-pure hydrogen peroxide and ultra-pure ammonium hydroxide — semiconductor-grade chemicals used for silicon-wafer cleaning and etching — as JBIC states, to strengthen Japanese supply-chain resilience and support US semiconductor manufacturing demand. This is MPCA's second JBIC-backed expansion loan, following a USD 36 million (JBIC portion) facility signed in April 2024 for the same production line.

The Beijing Economic-Technological Development Zone (BDA / Yizhuang) Management Committee issued Jingjiguanfa [2025] No. 14, "Several Measures on Accelerating 6G Technology and Industrial Innovation Development in the Beijing Economic-Technological Development Zone," dated 2025-07-08 and effective 2025-07-09. The package funds the 6G stack end to end: up to RMB 5,000,000 start-up funding for provincial/municipal-level 6G laboratories, matching funds up to RMB 30,000,000 for enterprises undertaking national/municipal 6G research tasks, up to RMB 2,000,000 in rewards for accepted 3GPP standard proposals, up to RMB 1,000,000 for standard implementation, up to RMB 30,000,000/year (three-year cap) for test and verification platforms, up to RMB 5,000,000 for "first-order" product support, and testing vouchers of up to RMB 5,000,000 covering 50% of actual testing costs. The zone targets 50+ breakthrough 6G core technologies and standards, 20+ prototype devices, 10+ leading enterprises, 200+ national/municipal high-tech enterprises, and an RMB 50,000,000,000-scale industry cluster by 2030.

H.R.1, the "One Big Beautiful Bill Act" (Public Law 119-21), was signed into law by President Trump on 4 July 2025. The budget-reconciliation statute is the single largest reversal of the 2022 Inflation Reduction Act (IRA) industrial-policy framework: it accelerates the termination of IRA-era clean- energy tax credits and overlays a new "Foreign Entity of Concern" (FEOC) / "Prohibited Foreign Entity" (PFE) regime on the credits that survive. The §25E used-EV credit, the §30D new clean-vehicle credit, the §45W commercial clean-vehicle credit, and the §30C alternative-fuel-refueling-property credit terminate for vehicles or property placed in service after 30 September 2025. The §25C energy-efficient home improvement credit and the §25D residential clean-energy credit terminate for property placed in service after 31 December 2025. The §45Y clean-electricity production credit and §48E clean-electricity investment credit are eliminated for wind and solar facilities placed in service after 31 December 2027, with a safe harbour for projects whose construction begins on or before 4 July 2026. From 1 January 2026, projects beginning construction must satisfy "material assistance" thresholds limiting the share of components, subcomponents and critical minerals sourced from prohibited foreign entities (PRC, Russia, Iran, DPRK and entities controlled by them). For §45Y/§48E facilities the threshold starts at 40% non-PFE content in 2026 and steps up by 5 percentage points per year through 2030; for §45X advanced manufacturing PTC the analogous schedule begins at 50% in 2026 and rises through the decade. CBO scored the package's energy-credit terminations as generating roughly USD 280bn of revenue (gross), of which USD 77.4bn from §25D termination, USD 21.2bn from §25C, USD 77.8bn from §30D, USD 104.5bn from §45W, and USD 2bn from §30C, partially offsetting the bill's other tax cuts. The bill simultaneously re-authorises and broadens the §48D advanced manufacturing investment tax credit for semiconductor fabs, raising the credit rate from 25% to 35% for property placed in service after 31 December 2025 (preserving the CHIPS Act-aligned semiconductor leg of the IRA-era stack). The OBBBA therefore reshapes the IRA from a broad-based clean-energy + EV + manufacturing pull-through into a narrower, China-decoupling industrial policy concentrated on semiconductors and (residually) §45X battery / critical- mineral processing.

On 2025-06-25, Hong Kong's New Industrialisation Vetting Committee announced it had supported an application from J Cube Semiconductor (Hong Kong) Limited under the New Industrialisation Acceleration Scheme (NIAS) — the third project approved under the scheme. The project will establish production facilities for third-generation (silicon carbide, SiC) semiconductor wafers in Hong Kong, classed under the advanced-manufacturing-technology sector. Total project cost is estimated at over HKD 700 million, with expected NIAS government funding of up to HKD 200 million — the scheme's per-project cap. The same announcement introduced an enhancement measure for the related New Industrialisation Funding Scheme (NIFS).

The Chips Joint Undertaking, via Horizon Europe grant agreement 101213727 signed 19 June 2025, is co-funding "PIXEurope" (Advanced Photonic Integrated Circuits Pilot Line for Europe), the fifth EU Chips Act pilot line. Fundació Institut de Ciències Fotòniques (ICFO, Spain), the project coordinator, receives EUR 10,112,253.51 in net EU contribution — the coordinator's own tranche of the wider 19-entity, multi-country consortium's EUR 176.05m total project cost (EUR 88.03m in EU/Chips JU contribution), running 1 June 2025 to 31 May 2030. This is a distinct beneficiary filing alongside the parallel TNO (Netherlands) tranche of the same grant agreement, which builds a 6-inch indium-phosphide pilot manufacturing line at High Tech Campus Eindhoven.

The Chips Joint Undertaking, via Horizon Europe grant agreement 101213727 signed 19 June 2025, is co-funding "PIXEurope" (Advanced Photonic Integrated Circuits Pilot Line for Europe), the fifth EU Chips Act pilot line, coordinated by Fundació Institut de Ciències Fotòniques (ICFO, Spain) with a 19-entity, multi-country consortium. Total project cost is EUR 176.05m against EUR 88.03m in EU/Chips JU contribution, running 1 June 2025 to 31 May 2030. TNO (Netherlands) is a lead participant, receiving EUR 13.47m in net EU contribution (EUR 26.94m total eligible cost) to build a 6-inch indium-phosphide photonic-chip pilot manufacturing line at High Tech Campus Eindhoven — part of a wider EUR 193m Dutch national co-investment (Ministry of Economic Affairs, Ministry of Defence, Chips JU, TNO, TU Eindhoven, University of Twente) targeting technological independence in photonic chips for telecom/6G, AI, quantum, defence and medical-diagnostics applications. Global Trade Alert logs a EUR 10.1m figure for the TNO tranche as a "red" state-act intervention (financial grant) on competitive-distortion grounds; this filing anchors on the CORDIS-published grant-agreement figures as the authoritative primary-source numbers.

Taiwan's Ministry of Economic Affairs International Trade Administration (MOEA-ITA) amended the Strategic High-Tech Commodities (SHTC) export-control Entity List on 10 June 2025 (announced 15 June 2025) under Article 13 of the Trade Act, adding 601 new entities — including Huawei Technologies Co. Ltd. and Semiconductor Manufacturing International Corp. (SMIC) plus 599 additional entities domiciled in China, Russia, Iran, Pakistan and Myanmar. Taiwanese exporters (TSMC, UMC, ASE, KYEC and downstream suppliers) must obtain pre-export government licences for direct or third-party shipments of any SHTC-listed item to the listed entities; the action expands Taiwan's total entity-list population to ~10,844 entities. Two follow-on amendments tightened the regime further: a +279-entity expansion on 18 September 2025 and an 18-item commodity-list expansion on 18 November 2025 covering advanced 3D printers, semiconductor manufacturing equipment, electron microscopes and quantum-computing hardware.

On 14 June 2025 Vietnam's 15th National Assembly adopted Law No. 71/2025/QH15 on the Digital Technology Industry (DTI Law) at its 9th session. The Law enters into force on 1 January 2026 (with certain provisions phased) and is the world's first standalone primary statute dedicated to the digital technology industry, covering digital-tech production and services, semiconductor manufacturing, artificial-intelligence systems, digital assets (legally recognised as property under the Civil Code), and Concentrated Digital Technology Zones. It codifies sector-specific incentives — multi-year corporate income tax reductions, R&D-cost deductions, preferential public procurement, five-year personal income tax exemption for high-quality digital professionals, five-year visa and work-permit exemptions for foreign experts, and 50% subsidy for SME advanced-technology acquisition — and sets headline targets of 150,000 digital-tech enterprises and USD 74bn digital-economy contribution by 2030/2035 (with USD 43bn / USD 74bn variants in different government summaries).

Wisconsin Governor Tony Evers and the Wisconsin Economic Development Corporation (WEDC) announced on 13 June 2025 a package of up to $18 million in performance-based Enterprise Zone state tax credits to support Yaskawa America Inc.'s $180 million relocation and expansion of its North American headquarters to Franklin, Wisconsin. The project consolidates Yaskawa's existing Illinois and Wisconsin operations into a single 800,000-square-foot campus housing headquarters, training, manufacturing, and robotics/semiconductor production functions, and is projected to create more than 700 new jobs. The actual credit amount is contingent on Yaskawa meeting job-creation and capital-investment performance milestones.

The Shandong Provincial Department of Finance issued Lu Cai Ban Fa [2025] No. 8 (鲁财办发〔2025〕8号), "Several Fiscal Policies to Further Support the High-Quality Development of the Private Economy" (进一步 支持民营经济高质量发展若干财政政策), on 2025-06-09 (published 2025-06-11), effective on issuance through 2027. The package bundles 50 numbered measures across ten categories — technology innovation, digital/smart transformation, industrial upgrading, services, foreign trade, talent attraction, financing channels, government-procurement fairness, overdue-payment relief, and policy-delivery efficiency — targeted at private enterprises operating in Shandong.

Japan's first standalone AI statute (Law No. 53) was promulgated 4 June 2025 and became fully effective 1 September 2025, when chapters establishing the Artificial Intelligence Strategic Headquarters — chaired by the Prime Minister with all Cabinet ministers as members — entered into force. The Act adopts an innovation-first, non-punitive framework: it imposes no monetary penalties and relies on cooperative and reputational compliance mechanisms rather than mandatory requirements. An AI Basic Plan, adopted by Cabinet decision on 23 December 2025, translates the statutory mandate into cross-ministry R&D and deployment targets.

On 27 May 2025 the People's Government Office of Xiaoshan District, Hangzhou (Zhejiang Province) issued Xiao Zhengbanfa [2025] No. 22, "Several Policies to Promote the High-Quality Development of the Integrated Circuit Industry," published 30 May 2025. The notice establishes a district-level subsidy stack covering EDA design, IC design, manufacturing, packaging and testing, and equipment/materials firms operating in Xiaoshan District. Headline instruments include R&D subsidies for enterprises investing over CNY 50m (with a lower CNY 10m tier) in key IC materials and core equipment with realized sales, a wafer tape-out subsidy capped at CNY 20m per enterprise per year, public innovation-platform purchase subsidies of up to CNY 500k, "chip-mould linkage" support up to CNY 3m, and talent-support measures including housing subsidies for IC industry personnel.

On 23 May 2025 the Bureau of Industry and Security notified major electronic design automation (EDA) suppliers — Cadence Design Systems, Synopsys, and Siemens EDA — by letter that a license is now required for any export, re-export, or in-country transfer of EDA software and technology classified under ECCNs 3D991 and 3E991 where a party to the transaction is located in China or is a Chinese "military end user" wherever located. BIS determined the shipments posed an unacceptable risk of diversion to Chinese military end use. The action was not published as a Federal Register rule; it surfaced publicly only through the affected companies' SEC 8-K disclosures. Synopsys suspended its FY2025 financial guidance in response. BIS rescinded the requirement effective 2 July 2025 (see amendments) amid the broader US-China trade truce, and the three vendors restored access for affected customers.

The Union Cabinet, chaired by Prime Minister Narendra Modi, approved the establishment of a sixth semiconductor unit under the India Semiconductor Mission (ISM) on 14 May 2025. The unit is a joint venture between HCL and Foxconn (Hon Hai) and will build an Outsourced Semiconductor Assembly and Test (OSAT) plant near Jewar airport in the Yamuna Expressway Industrial Development Authority (YEIDA) area of Uttar Pradesh, manufacturing display driver chips for mobile phones, laptops, automobiles, PCs and other display-equipped devices. The approved investment is INR 3,700 crore (~USD 435 million), with designed capacity of 20,000 wafers per month and output of 36 million units per month.

Shenzhen (Guangdong Province) established the Shenzhen Semiconductor and Integrated Circuit Industry Investment Fund (深圳市半导体与集成电路 产业投资基金, "Saimi Industrial Private Fund" / 赛米产业私募基金) with a total scale of CNY 5 billion. The fund completed business registration around 13 May 2025 following establishment on 29 April 2025, and was formally unveiled at a public ceremony on 16 October 2025. It is co-managed by Futian Hongshi (a wholly-owned subsidiary of Shenzhen Capital Group, 深创投) and Zhongzhi Investment Capital (a wholly-owned subsidiary of Shenzhen Major Industry Investment Group, 深重投), and operates under Shenzhen's "20+8" strategic-industry fund framework. It targets general/specialised computing chips, new-architecture storage, optoelectronic/sensor chips, and critical manufacturing equipment, components, materials, and advanced packaging/testing.

On 13 May 2025, two days before the AI Diffusion Rule's primary 15 May 2025 compliance date, the Trump administration's BIS announced it would rescind the Biden-era Framework for AI Diffusion (90 FR 4544) and simultaneously issued three guidance documents that re-routed US AI export policy through existing EAR authorities. The package comprises (1) GP10 guidance asserting that all ECCN 3A090 ICs designed by PRC-headquartered firms are presumptively EAR-violative, with Huawei Ascend 910B/910C/910D processors named explicitly — making US- and non-US-person use, transfer, financing, or servicing of those chips anywhere in the world a presumptive General Prohibition 10 violation; (2) a policy statement warning industry that supplying US advanced computing ICs for training or inference of Chinese AI models risks EAR enforcement; and (3) industry guidance on diversion-prevention diligence. BIS stated a formal Federal Register rescission and replacement rule would follow.

On 30 April 2025 the General Office of the Guangdong Provincial People's Government issued Yue Fu Ban [2025] No. 11, "Several Measures of Guangdong Province to Further Stimulate Market Entity Vitality and Accelerate the Construction of a Modern Industrial System," effective immediately through 31 December 2027. The package subsidizes bank-loan interest for manufacturing and high-tech enterprises at up to 35% of the loan rate, capped at RMB 2 billion in total annual subsidy volume and RMB 20 million per enterprise per year, alongside an expansion of government-backed financing-guarantee coverage to over RMB 10 billion annually. It also funds foreign-invested R&D centers (up to RMB 1 million, or RMB 5 million for multinational global R&D centers) and offers headquarters-relocation bonuses of up to RMB 8 million, with priority given to semiconductors, AI, robotics, biotechnology, quantum technology, commercial aerospace, and new-energy vehicles.

Prime Minister Anthony Albanese announced the Critical Minerals Strategic Reserve (CMSR) on 24 April 2025 as a A$1.2bn election commitment in the 2025-26 Budget. The Department of Industry, Science and Resources released the design package on 12 January 2026, prioritising antimony, gallium, and rare earth elements as the initial focus minerals (A$1bn for offtake transactions drawn from an expanded A$5bn Critical Minerals Facility, plus A$185m for physical stockpiling and implementation). The Export Finance and Insurance Corporation Amendment (Strategic Reserve) Act 2026 passed Parliament on 31 March 2026 with effect 1 April 2026, giving Export Finance Australia (EFA) statutory power to enter offtake agreements, contracts for difference, forward contracts, and physical stockpiles for fuel and critical minerals. CMSR becomes operational in second half 2026.

The Legislative Yuan of Taiwan (ROC) passed amendments to Article 22 of the Statute for Industrial Innovation (產業創新條例) and added a new Article 67-3 on third reading on 18 April 2025, promulgated by Presidential Decree on 7 May 2025. The package establishes for the first time a Taiwanese OUTBOUND-investment screening regime under the Statute: outbound investments by Taiwanese entities meeting the amount threshold (NTD 1.5bn, or lower as determined) OR involving designated countries/regions OR specific industries or technologies must obtain prior approval from the Ministry of Economic Affairs (MOEA) before implementation. The competent authority may deny approval (in whole or in part) or impose conditional approval where particular circumstances are identified — including risks to national security, harm to economic development or supply-chain resilience, conflict with international treaties, or violation of labour-standards law. The new Article 67-3 establishes enforcement penalties ranging from NTD 50,000 to NTD 1,000,000 for initial non-compliance violations and NTD 500,000 to NTD 10,000,000 per violation for failure to comply with conditions, restrictions, or undertakings imposed by MOEA under Article 22 Paragraph 3. Effective dates of implementing provisions are to be determined by Executive Yuan secondary legislation; the package is structurally novel for Taiwan — the first horizontal outbound-investment-security instrument and the structural parallel to the US Treasury Final Rule on Outbound Investment in Countries of Concern (28 October 2024 / effective 2 January 2025), the EU Commission Recommendation 2025/63, and Korea's MOTIE NCT regime.

Hungary's Government Decree 81/2025 (IV. 17.), published in Magyar Közlöny 2025/45 and effective 18 April 2025, materially rewrites Government Decree 210/2014 (VIII. 27.) — the statutory framework for Hungary's flagship VIP cash-grant programme awarded through individual government decisions ("Egyedi Kormánydöntés", EKD). The amendment reduces minimum investment thresholds in Southern Hungarian counties and smaller countryside locations, refines the asset-based incentive scheme, abolishes the renewable-energy production-investment subsidy, and introduces a new R&D-centre subsidy for medium and large enterprises (≥50 employees, ≥10 new R&D jobs, mandatory formal cooperation agreement with a Hungarian university). EKD is the vehicle through which CATL Debrecen, BYD Szeged, Samsung SDI, and EVE Power received Hungarian state-aid packages — making this decree the framing instrument for the largest single channel of Chinese EV/battery FDI into the European Union.

On 9 April 2025 the European Commission adopted Communication COM(2025)165, the AI Continent Action Plan, setting out a five-pillar strategy to make the EU a global AI leader. The pillars are (1) computing infrastructure, (2) data for AI, (3) strategic AI innovation and adoption, (4) AI skills and talent, and (5) regulatory simplification. Headline commitments include mobilising approximately €200bn of public+private investment via the InvestAI initiative announced at the AI Action Summit in Paris (11 February 2025), deploying 13 AI Factories (HPC-anchored shared compute facilities) plus regional antennas, building 5 AI Gigafactories powered by >100,000 advanced AI processors with €20bn earmarked from InvestAI, launching the Apply AI Strategy and Data Union Strategy, and proposing a Cloud and AI Development Act with a public consultation closing 4 June 2025. The one-year progress report (9 April 2026) confirmed 19 AI Factories deployed across EU supercomputers with 13 Antennas providing regional access, and €1bn in Apply AI funding calls earmarked.

Japan's Ministry of Economy, Trade and Industry (METI) overhauled the catch-all export-control framework under the Foreign Exchange and Foreign Trade Act (FEFTA) — the first comprehensive review of Japan's catch-all controls in 12 years (since 2013). Cabinet decisions were taken on 25 March 2025 and 4 April 2025 with METI's consolidated announcement on 9 April 2025; the amended Cabinet Order entered into force on 9 October 2025. The reform (i) splits catch-all-controlled items into "core items" (high dual-use risk, including certain semiconductors and machine tools) and a general catch-all tier, (ii) adds a new end-user requirement alongside the existing end-use requirement and extends both from UN-arms-embargo countries only to "general countries" (everywhere outside Group A), materially expanding the perimeter of items requiring METI export licences for general-country end-users including China, and (iii) introduces an "informed" condition for exports to Group A countries — once METI notifies an exporter of a defined risk pattern, a Group A export becomes licence-required, addressing transit-export-circumvention to Russia. Structurally distinct from the 23-category equipment-specific 2023 amendment (2023-03-31-japan-meti-semi-equipment-export-controls); this is the underlying horizontal catch-all reform and brings Japan's framework closer to US BIS EAR catch-all controls.

Japan's Cabinet approved an amendment to the Cabinet Order on Inward Direct Investment under the Foreign Exchange and Foreign Trade Act (FEFTA) on 1 April 2025; the order was promulgated 4 April 2025 and entered into force 19 May 2025. The amendment introduces two new investor categories — Type-A (investors legally or contractually obligated to share information with foreign governments) and Type-B (investors effectively in a comparable position without formal legal obligation) — and eliminates or narrows exemptions from mandatory prior-notification screening for both categories. The primary driver is concern over minority-stake acquisitions by Chinese investors in Japanese listed companies operating in sensitive sectors including cloud computing, telecommunications infrastructure, semiconductor equipment, and advanced electronics. The reform is structurally distinct from the outbound FEFTA catch-all controls overhaul (2025-10-09) and from the Economic Security Promotion Act (2022-05-18); it is the inbound FDI-screening complement to that framework.

The Union Cabinet approved the Electronics Components Manufacturing Scheme (ECMS) on 28 March 2025, notified by the Ministry of Electronics and Information Technology (MeitY) via Gazette Notification CG-DL-E-08042025-262341 on 8 April 2025. The scheme has an original outlay of Rs 22,919 crore (~USD 2.7bn) over six years (FY26-FY31, with an optional one-year gestation period), raised to Rs 40,000 crore in the Union Budget 2026-27. ECMS targets passive components, multi-layer PCBs, lithium-ion battery cells, camera modules, display assembly, electromechanicals, bare-component sub-assemblies and capital equipment for semiconductor and electronics manufacturing -- the ecosystem feeding the existing large-scale-electronics PLI and the India Semiconductor Mission. The scheme targets investment of Rs 59,350 crore, production of Rs 4,56,500 crore and 91,600 direct jobs.