Industrial Policy & Trade Monitor· 2663 actions· ✨ 89 recent

The Philippine Semiconductor and Electronics Industry (PSEI) Roadmap 2026–2030 was presented at the 4th SEIAC meeting at Malacañang on 23 March 2026 by BOI Executive Director Ma. Corazon Halili-Dichosa and formally rolled out by DTI in April 2026. The Roadmap targets $110 billion in annual exports by 2030 ($70B semiconductors + $40B electronics, approximately doubling the current ~$50B baseline) via value-chain ascent from assembly-test-packaging through IC design toward front-end wafer fabrication, supported by 128,000-worker upskilling over five years and up to three national laboratories in fabrication, R&D, and talent development.

President Ferdinand R. Marcos Jr. signed Administrative Order No. 31 s. 2025 on 28 March 2025, establishing the Semiconductor and Electronics Industry Advisory Council (SEIAC) as the President's primary advisory body on semiconductor and electronics industry development, promotion, and competitiveness. The SEIAC is chaired by the Special Assistant to the President for Investment and Economic Affairs, with the DTI Secretary as Vice-Chair, and mandates the Council to provide strategic guidance for implementing the Philippine Semiconductor and Electronics Industry (PSEI) Roadmap, coordinate inter-agency interventions across the value chain, and recommend legislative measures for sectoral competitiveness.

Prime Minister Anwar Ibrahim launched Malaysia's National Semiconductor Strategy (NSS) on 28 May 2024 in his keynote at SEMICON Southeast Asia, with implementation led by MITI. The NSS commits at least RM25 billion (~USD 5.3 billion) in fiscal support over a ten-year horizon and structures the chip industrial policy in three sequential phases: (1) shoring up Malaysia's existing strength in outsourced semiconductor assembly and test (OSAT) and back-end packaging, (2) moving domestic firms into integrated-circuit (IC) design, advanced packaging and advanced manufacturing equipment, and (3) developing Malaysian-owned global champions across the chip value chain under a "Made by Malaysia" framing. Headline targets include developing 10 local design and advanced- packaging companies with revenues between RM1 billion and RM4.7 billion, 100 broader semiconductor-related companies near the RM1 billion revenue mark, and training 60,000 high- skilled engineers. The RM25 billion envelope decomposes into RM5 billion in tax forgone over five years, RM2 billion for existing capital grants, RM1.25 billion for an HRD Fund semiconductor allocation, RM2 billion for a Semiconductor Industrial Park, RM1.59 billion for an Advanced Packaging Centre, plus RM2 billion each for the National Energy Transition Facility and Green Tech Financing Scheme. By June 2025, the government reported RM70.7 billion in announced investments attracted under the NSS umbrella.

On 21 March 2024, Costa Rica's Ministerio de Comercio Exterior (COMEX) launched the Hoja de Ruta para el Fortalecimiento del Ecosistema de Semiconductores — the first national semiconductor roadmap published by any Latin American country — jointly presented with US Secretary of Commerce Gina Raimondo in the context of the CHIPS Act §103 ITSI Fund partnership. President Rodrigo Chaves Robles simultaneously signed an executive decree declaring the semiconductor industry and related industries of "interés público" (public interest) and directing COMEX to lead implementation. The roadmap is organised around four pillars: Talent (Human Talent Training Incentive programme, US$6M initial budget), Incentives (OECD BEPS Pillar Two-aligned fiscal/financial R&D incentives, Free Trade Zone regime strengthening under Law 7210), Investment Attraction (CINDE-led FDI promotion targeting ATP, advanced PCB, and design-house segments), and Regulatory Improvement (customs facilitation, IP reform, export-control alignment). Costa Rica is one of seven declared ITSI-fund partner economies and hosts Intel's largest non-US assembly and test site since 1997, alongside Applied Materials, ON Semiconductor, Coherent, MaxLinear, and Boston Scientific.