Industrial Policy & Trade Monitor· 2663 actions· ✨ 89 recent

The Wisconsin Economic Development Corporation (WEDC) board approved a second contract amendment with Foxconn (Hon Hai Technology Group) on 25 November 2025, authorising up to USD 16 million in additional performance-based tax credits under the state's Electronics, Information Technology, and Manufacturing Zone (EITMZ) programme. The amendment backs a further USD 569 million expansion of Foxconn's Mount Pleasant, Racine County operations, projected to create 1,374 new jobs over four years. It raises Foxconn's cumulative EITMZ credit ceiling to USD 96 million (through 31 December 2029) against a cumulative committed investment of USD 1.2 billion and 2,616 jobs -- up from the 2021 amendment's USD 80 million ceiling tied to a USD 672 million investment and 1,454 jobs by end-2025.

The National Reconstruction Fund Corporation (NRFC), Australia's AUD 15 billion sovereign industrial-financing vehicle, took a AUD 35 million (~USD 23.1 million) equity stake in Morse Micro, announced 23 September 2025. Morse Micro — described by NRFC as Australia's largest semiconductor manufacturer — designs Wi-Fi HaLow chips for long-range, low-power IoT connectivity, with a design and production hub in Picton, regional New South Wales. The investment forms part of Morse Micro's broader AUD 88 million Series C round, led by Japanese semiconductor designer MegaChips and joined by existing investors Blackbird, Main Sequence, and superannuation funds Hostplus, NGS and UniSuper. NRFC frames the deal as strengthening sovereign semiconductor manufacturing capability and supporting skilled jobs in regional NSW.

The Government of Andhra Pradesh issued G.O.Ms.No.30 (ITE&C Promotion Wing, 1 August 2025) establishing the Electronics Components Manufacturing Policy 2025-30, a dedicated sub-national subsidy framework designed as a 100% matching top-up of the central MeitY Electronics Components Manufacturing Scheme (ECMS). The policy targets INR 4,600 crore (~USD 550 million) in state fiscal outlay against a USD 50 billion production target and USD 10 billion investment target, with a goal of 5 lakh (500,000) first-time jobs over the policy period. Priority components span 11 categories including displays, camera modules, multilayer PCBs, lithium-ion cells, magnetics, capacitors, and resistors, channelled into dedicated electronics zones at Sri City, Hindupur, Orvakal, and Kopparthy.

The Union Cabinet, chaired by Prime Minister Narendra Modi, approved the establishment of a sixth semiconductor unit under the India Semiconductor Mission (ISM) on 14 May 2025. The unit is a joint venture between HCL and Foxconn (Hon Hai) and will build an Outsourced Semiconductor Assembly and Test (OSAT) plant near Jewar airport in the Yamuna Expressway Industrial Development Authority (YEIDA) area of Uttar Pradesh, manufacturing display driver chips for mobile phones, laptops, automobiles, PCs and other display-equipped devices. The approved investment is INR 3,700 crore (~USD 435 million), with designed capacity of 20,000 wafers per month and output of 36 million units per month.

Tamil Nadu Chief Minister M K Stalin launched the Tamil Nadu Electronics Components Manufacturing Scheme (TN-ECMS) on 30 April 2025, making Tamil Nadu the first Indian state to introduce a dedicated state-level electronics components manufacturing subsidy designed to stack on top of the central Electronics Components Manufacturing Scheme (ECMS, notified April 2025). The scheme targets ₹30,000 crore (~USD 3.6 bn) in investment and 60,000 jobs over three to five years, supporting 11 high-growth component categories including HDI/MSAP printed circuit boards, lithium-ion cells, display assemblies, camera modules, SMD passive components, multilayer ceramic capacitors, copper-clad laminates, and capital goods for electronics manufacturing. Investment thresholds are ₹50 crore for basic components and up to ₹250 crore for complex sub-assemblies; matching grants mirror the central ECMS subsidy structure with additional state concessions on stamp duty, land, and electricity costs plus workforce-development incentives.

The Union Cabinet approved the Electronics Components Manufacturing Scheme (ECMS) on 28 March 2025, notified by the Ministry of Electronics and Information Technology (MeitY) via Gazette Notification CG-DL-E-08042025-262341 on 8 April 2025. The scheme has an original outlay of Rs 22,919 crore (~USD 2.7bn) over six years (FY26-FY31, with an optional one-year gestation period), raised to Rs 40,000 crore in the Union Budget 2026-27. ECMS targets passive components, multi-layer PCBs, lithium-ion battery cells, camera modules, display assembly, electromechanicals, bare-component sub-assemblies and capital equipment for semiconductor and electronics manufacturing -- the ecosystem feeding the existing large-scale-electronics PLI and the India Semiconductor Mission. The scheme targets investment of Rs 59,350 crore, production of Rs 4,56,500 crore and 91,600 direct jobs.

The Union Cabinet approved the Semicon India Programme on 15 December 2021, establishing the India Semiconductor Mission (ISM) as the nodal agency. The programme offers fiscal support of up to 50% of project cost for silicon semiconductor fabs, compound semiconductor facilities, display fabs, ATMP/OSAT units, and chip design. Total outlay: Rs 76,000 crore (approximately $10.2bn at 2021 exchange rates). By February 2024, the Cabinet had approved three major semiconductor units under ISM: Tata Electronics with PSMC (semiconductor fab, Dholera, Rs 91,526 crore), Tata Electronics OSAT (Morigaon, Assam, Rs 27,120 crore), and CG Power OSAT (Rs 7,584 crore), totalling over Rs 1.26 lakh crore in committed investment from private applicants.

The Union Cabinet approved the Production Linked Incentive (PLI) Scheme for Large Scale Electronics Manufacturing on 21 March 2020, with the scheme notified in the Gazette of India on 1 April 2020. Total outlay: Rs 40,995 crore (~$5.5bn) over five years. The scheme extends incentives of 4% to 6% on incremental sales (over FY 2019-20 base year) to eligible companies manufacturing mobile phones (invoice value >= Rs 15,000) and specified electronic components including ATMP units. Approved beneficiaries include Samsung, Foxconn, Wistron, Pegatron, and Indian firms Dixon, Lava, and Bhagwati (Micromax).