Industrial Policy & Trade Monitor· 2662 actions· ✨ 89 recent

Regulation (EU) 2025/40, published in the Official Journal on 22 January 2025 and entering into force on 11 February 2025, replaces the 1994 Packaging and Packaging Waste Directive 94/62/EC with a directly-applicable Regulation. It mandates binding recycled-content targets for plastic packaging (by polymer and format, reaching 30–65% by 2030 with higher targets by 2040), minimum reusable-packaging shares for beverages and transport, recyclability standards for all packaging placed on the EU market from 2030, deposit-return-scheme obligations for beverage containers from 2029, and bans on specified single-use plastic packaging formats. General application begins 12 August 2026, with staggered compliance windows extending to 2030 and beyond, affecting all non-EU exporters shipping consumer goods, beverages, or e-commerce fulfilment into the EU single market.

The US Bureau of Industry and Security issued its largest single export-control package targeting China's semiconductor industry on 2 December 2024, with three layered measures (final rules published in the Federal Register 5 December 2024). First, controls on high-bandwidth memory (HBM) above set performance thresholds — blocking the memory architecture that is foundational to AI training. Second, additions of 24 semiconductor manufacturing equipment item types to the Commerce Control List, covering deposition, etch, ion- implant, advanced packaging, and metrology categories. Third, Entity List designations for 140+ entities, the bulk Chinese semiconductor companies + equipment makers + investment vehicles, including major Chinese fab tooling firms. The package triggered MOFCOM's same-day-following retaliation (filed: 2024-12-03-china-mofcom-ge-ga-sb-export-ban-us).

Prime Minister Anwar Ibrahim launched Malaysia's National Semiconductor Strategy (NSS) on 28 May 2024 in his keynote at SEMICON Southeast Asia, with implementation led by MITI. The NSS commits at least RM25 billion (~USD 5.3 billion) in fiscal support over a ten-year horizon and structures the chip industrial policy in three sequential phases: (1) shoring up Malaysia's existing strength in outsourced semiconductor assembly and test (OSAT) and back-end packaging, (2) moving domestic firms into integrated-circuit (IC) design, advanced packaging and advanced manufacturing equipment, and (3) developing Malaysian-owned global champions across the chip value chain under a "Made by Malaysia" framing. Headline targets include developing 10 local design and advanced- packaging companies with revenues between RM1 billion and RM4.7 billion, 100 broader semiconductor-related companies near the RM1 billion revenue mark, and training 60,000 high- skilled engineers. The RM25 billion envelope decomposes into RM5 billion in tax forgone over five years, RM2 billion for existing capital grants, RM1.25 billion for an HRD Fund semiconductor allocation, RM2 billion for a Semiconductor Industrial Park, RM1.59 billion for an Advanced Packaging Centre, plus RM2 billion each for the National Energy Transition Facility and Green Tech Financing Scheme. By June 2025, the government reported RM70.7 billion in announced investments attracted under the NSS umbrella.

The Directorate General of Trade Remedies (DGTR) initiated an anti-dumping investigation on 28 March 2024 concerning imports of Titanium Dioxide (TiO₂, pigment grade; HS 3206.11/3206.19) originating in or exported from China PR (file 14/51/2002-DGAD), on application of Indian domestic producers Travancore Titanium Products Ltd, Kerala Minerals & Metals Ltd (KMML), Meghmani Organochem Ltd, and VV Titanium Pigments Pvt Ltd. Final Findings were issued on 12 February 2025 recommending anti-dumping duties on Chinese TiO₂ imports; those findings were subsequently remanded by court order in October 2025, reopening the determination phase. DGTR issued a second Disclosure Statement on 12 May 2026 and extended the remand timeline on 18 May 2026, with revised Final Findings expected in Q3 2026. The investigation sits within a global TiO₂ anti-dumping cluster targeting Chinese producers alongside parallel EU provisional measures (2024) and USITC AD-CVD proceedings.

On 21 March 2024, Costa Rica's Ministerio de Comercio Exterior (COMEX) launched the Hoja de Ruta para el Fortalecimiento del Ecosistema de Semiconductores — the first national semiconductor roadmap published by any Latin American country — jointly presented with US Secretary of Commerce Gina Raimondo in the context of the CHIPS Act §103 ITSI Fund partnership. President Rodrigo Chaves Robles simultaneously signed an executive decree declaring the semiconductor industry and related industries of "interés público" (public interest) and directing COMEX to lead implementation. The roadmap is organised around four pillars: Talent (Human Talent Training Incentive programme, US$6M initial budget), Incentives (OECD BEPS Pillar Two-aligned fiscal/financial R&D incentives, Free Trade Zone regime strengthening under Law 7210), Investment Attraction (CINDE-led FDI promotion targeting ATP, advanced PCB, and design-house segments), and Regulatory Improvement (customs facilitation, IP reform, export-control alignment). Costa Rica is one of seven declared ITSI-fund partner economies and hosts Intel's largest non-US assembly and test site since 1997, alongside Applied Materials, ON Semiconductor, Coherent, MaxLinear, and Boston Scientific.