Industrial Policy & Trade Monitor· 2662 actions· ✨ 89 recent

Türkiye's Ministry of Commerce published Tebliğ No. 2026/16 on 24 May 2026 (Resmî Gazete No. 33263), completing a final sunset review (NGGS) of the existing anti-dumping measure on un-backed aluminium foil sheets and strips of thickness ≤0.2 mm (HS 7607.11, 7607.19) originating from China. The review, initiated on a petition from domestic producer Assan Aluminum Industry and Trade Inc., found that removal of the measure would likely result in continuation or recurrence of dumped imports and material injury to Turkish domestic industry. The existing 22% CIF ad-valorem anti-dumping duty — first imposed in 2014 (Tebliğ 2014/25) and previously extended in 2019/34 — is maintained for a further five years from 24 May 2026.

The Secretaría de Economía (SE), through its Unidad de Prácticas Comerciales Internacionales (UPCI), published a Resolución de Inicio in the Diario Oficial de la Federación on 21 May 2026, formally initiating an antidumping investigation into imports of self-adhesive plastic tapes (cintas plásticas autoadhesivas — BOPP/polypropylene backing with acrylic, rubber, or hot-melt adhesive, in rolls 20 cm wide or less, TIGIE 3919.10.01) originating from the People's Republic of China. The investigation follows a petition filed 16 December 2025 by Industrias Tuk S.A. de C.V. and Navi Lux S.A. de C.V., two Mexican domestic converters that alleged Chinese imports entered Mexico under price-discrimination conditions during the investigation period October 2024-September 2025, materially injuring the Mexican packaging-tape industry. The resolution entered into force on 22 May 2026 (the day following DOF publication).

The US Department of Commerce published its final affirmative determination in the less-than-fair-value (LTFV) antidumping investigation of polypropylene corrugated boxes from Vietnam (Federal Register doc 2026-10109, published 20 May 2026), finding that all Vietnamese producers/exporters constitute a single Vietnam-wide entity subject to a 130.58% AD rate based solely on Adverse Facts Available (AFA) due to non-cooperation. Commerce also issued a final affirmative determination of critical circumstances, triggering retroactive provisional-measures liability on entries made during the 90-day look-back period. The period of investigation covered 1 July 2024 through 31 December 2024; the ITC must issue its final injury determination within 45 days for an AD order to take effect.

The European Commission adopted Commission Implementing Regulation (EU) 2026/801 on 9 April 2026, imposing provisional anti-dumping duties on imports of terephthalic acid (PTA, purity ≥99.5% by weight, CAS 100-21-0, CN code ex 2917 36 00 / TARIC 2917 36 00 11) originating in the Republic of Korea and Mexico, published in the OJ on 10 April 2026 and entering into force the following day. Duty rates are exporter-specific: Korean producers face 6.2% (Samnam Petrochemical, Hanwha Impact) to 13.7% (all other), with Taekwang Industrial Co. found not to be dumping (0%); all Mexican exporting producers face a flat 25.7%. The investigation was opened 13 August 2025 following a complaint by EU producer Ineos Aromatics.

Brazil's Comitê-Executivo de Gestão da Câmara de Comércio Exterior (Gecex/Camex) approved Resolução Gecex Nº 876 on 13 April 2026 (DOU 14/04/2026), applying a definitive five-year antidumping duty on imports of polyethylene (PE) resins — NCM 3901.10.30, 3901.20.29, and 3901.40.00 — originating from the United States and Canada. The DECOM investigation, initiated on 14 November 2024 following a Braskem S.A. petition, found positive dumping margins and material injury to the domestic PE-resin industry; provisional duties were imposed under Resolução Gecex Nº 777 (28 August 2025) for six months. Gecex modulated the definitive rates to match provisional-period levels as a public-interest adjustment to limit additional cost pass-through to downstream packaging, agricultural-film, and container manufacturers.

The Philippine Semiconductor and Electronics Industry (PSEI) Roadmap 2026–2030 was presented at the 4th SEIAC meeting at Malacañang on 23 March 2026 by BOI Executive Director Ma. Corazon Halili-Dichosa and formally rolled out by DTI in April 2026. The Roadmap targets $110 billion in annual exports by 2030 ($70B semiconductors + $40B electronics, approximately doubling the current ~$50B baseline) via value-chain ascent from assembly-test-packaging through IC design toward front-end wafer fabrication, supported by 128,000-worker upskilling over five years and up to three national laboratories in fabrication, R&D, and talent development.

On 19 March 2026 the German Federal Ministry for Economic Affairs and Energy (BMWE) announced the selection of 38 German projects across 12 federal Länder for the IPCEI Advanced Semiconductor Technologies (IPCEI AST) — the next Important Project of Common European Interest on semiconductors under EU State Aid Article 107(3)(b) TFEU. The federal commitment is EUR 3 billion drawn from the Sondervermögen Infrastruktur und Klimaneutralität (SVIK), the EUR 100 bn special-purpose vehicle enacted via SVIKG in September 2025. The 38 selected projects span AI chips and chiplets, photonic integrated circuits, advanced manufacturing equipment, sensor technologies, and power electronics, with approximately one-third being startups and SMEs. The measure operationalises Germany's Microelectronics Strategy (October 2025) at the project-funding layer and is the first major SVIK semiconductor-tranche deployment.

On 12 March 2026 the UK Cabinet Office (Investment Security Unit) published its Government Response to the consultation on reform of the Notifiable Acquisition Regulations (NARs) under the National Security and Investment Act 2021 — the first major substantive overhaul of the NSI mandatory-notification schedules since the regime took effect on 4 January 2022. The reform splits Critical Minerals out of the existing Advanced Materials schedule into a standalone mandatory schedule covering all 34 minerals on the Critical Minerals Intelligence Centre's latest criticality assessment; splits Semiconductors into its own standalone schedule (capturing advanced packaging and specific chip-design processes); creates a brand-new Water sector schedule covering the 17 regional water and sewerage undertakers in England and Wales; refocuses Artificial Intelligence on entities that create or materially modify AI systems (excluding routine end-use); and refines Communications, Critical Suppliers to Government, Data Infrastructure, Energy and Suppliers to Emergency Services to reduce low-risk capture. An implementing Statutory Instrument is expected later in 2026; the existing NARs remain in force until that SI takes effect.

South Korea's National Assembly passed the "Special Act on Strengthening and Supporting the Competitiveness of the Semiconductor Industry" (반도체산업 경쟁력 강화 및 지원에 관한 특별법) on 29 January 2026 by 199 votes in favour out of 206 members present, after roughly 18 months of inter-party deadlock. The act establishes (i) a Presidential Commission for Enhancing Semiconductor Competitiveness as the central inter-ministerial coordination body, (ii) a statutory five-year master plan with annual implementation plans, (iii) a dedicated semiconductor industry special account ("반도체산업 특별회계") to ring-fence funding for fabs, materials, parts and equipment, and packaging across the full memory + system-LSI + design + manufacturing supply chain, and (iv) authority to designate semiconductor clusters outside the greater Seoul area with relocation incentives. Promulgation by the Cabinet is expected shortly after passage; effectiveness contingent on enforcement-ordinance finalisation, expected Q3 2026. The KRW 2tn anchor envelope of the special account does not begin disbursing until 2027 because companion amendments to the National Finance Act were not enacted in time.

Pakistan's Directorate General of Customs Valuation (Karachi), acting under the Federal Board of Revenue, issued Valuation Ruling No. 2035/2026 on 16 January 2026 under Section 25A of the Customs Act, 1969, fixing revised minimum customs (C&F) values for 62 models of old and used branded mobile phones (Apple, Samsung, Google Pixel, OnePlus) imported in commercial quantity without original packaging or accessories, conditional on the device having been activated at least six months before export. The revision was a downward rationalization — press reporting cites benchmark values ranging from US$25 (iPhone SE, 1st/2nd generation) up to US$460 (iPhone 15 Pro Max) — bringing declared-value floors back in line with a documented decline in global secondary-market prices for older-generation devices. Global Trade Alert logs China as the principal origin affected.

Presidential Decree No. 1012 of 31 December 2025 amends the standing Decree No. 302 (25 April 2023) list of foreign-owned assets under "temporary management," adding 100 percent of the shares in Can-Pak LLC (owned by Poland's Canpack S.A.) and Can-Pak Packaging Plant LLC (owned by Tapon France) — the two Russian operating subsidiaries of the CANPACK Group's aluminium-beverage-can business — and transferring control to StalElement LLC, a newly formed Russian administrator. The decree entered into force on its date of official publication (13 January 2026) despite being signed two weeks earlier, and covers Can-Pak's Volokolamsk (Moscow region) and Novocherkassk plants, which together hold an estimated 25-35% share of Russia's aluminium-can market. It is one of a running series of company-specific amendments to Decree 302, Russia's mechanism for placing Russian assets of "unfriendly state" companies under state administration in reciprocal response to Western sanctions and asset freezes.

Türkiye's Ministry of Trade published Tebliğ No. 2026/8 ("İthalatta Gözetim Uygulanmasına İlişkin Tebliğ") in the Official Gazette on 31 December 2025 (Sayı 33124, 4th mükerrer), entering into force 30 January 2026 (30 days after publication). It imposes a forward-looking import surveillance regime on staples of iron or steel (GTİP 8305.20.00.21.00 — strip staples of the type used in office, upholstery and packaging staplers). Imports declared at or below a unit customs value of USD 1.70/kg gross weight require a surveillance certificate ("gözetim belgesi") issued electronically by the Ministry's Import Directorate General before customs clearance. Global Trade Alert lists China as the principally affected exporting country.

On 24 December 2025 the Minister of Science and Technology signed Decision No. 4386/QĐ-BKHCN defining the functions, tasks, and organisational structure of the Vietnam National Multi-Project Wafer Coordination Centre (VNMPW/CC). The Centre sits under MOST's Authority of Information Technology Industry and acts as a coordinating hub between domestic chip-design firms, research institutes, and domestic / foreign fabrication and packaging partners. It provides shared EDA software access, IP libraries, technical design verification, performance measurement, training programmes, and pilot-production (MPW shuttle) support — the first concrete institutional node operationalising Vietnam's 2024 semiconductor strategy (Decision 1018/QĐ-TTg).

Taiwan's Legislative Yuan passed the Artificial Intelligence Basic Act (人工智慧基本法) on third reading on 23 December 2025, and President Lai Ching-te promulgated the 20-article statute on 14 January 2026, bringing it into force immediately. The Act designates the National Science and Technology Council (NSTC) as the central AI-policy competent authority and codifies seven governance principles — sustainability and well-being, human autonomy, privacy protection and data governance, cybersecurity and safety, transparency and explainability, fairness and non-discrimination, and accountability — that apply to all public-sector AI procurement and high-risk sectoral applications. The statute establishes a statutory foundation for the Taiwan AI Action Plan 2.0, mandates an Executive Yuan National AI Strategy Committee, and provides authority for sector-specific implementing regulations by FSC, NCC, MOHW, and MOTC across finance, telecoms, medical, and autonomous-vehicle AI within a two-year window. As the first national AI governance statute in the Greater China region and the third globally after the EU AI Act and South Korea's AI Basic Act, it frames regulatory expectations for the companies at the heart of the global AI hardware supply chain — TSMC, NVIDIA ODM partners, and advanced-packaging incumbents — that are headquartered or operate substantially in Taiwan.

On December 9, 2025, the Canada Border Services Agency (CBSA) made final determinations of dumping (margin of 282.1% of export price) and subsidizing (77.0% of export price, or CNY 10,134.87 per metric tonne) with respect to thermal paper rolls originating in or exported from China, classified primarily under HS 4811.90.00.90. On January 8, 2026, the Canadian International Trade Tribunal (CITT) found that the dumped and subsidized imports caused injury to the domestic industry, making the antidumping and countervailing duties definitive. The CBSA received insufficient cooperation from the Chinese government and exporters/producers, so all Chinese exporters are subject to the combined "all others" rate.

The Canadian federal government announced a Strategic Response Fund contribution of up to CAD 210 million (~USD 151 million) toward a CAD 662 million project to expand semiconductor advanced-packaging and R&D commercialisation capacity at IBM Canada's Bromont, Quebec facility and the MiQro Innovation Collaborative Centre (C2MI). The federal contribution covers roughly one-third of total project cost. Ministers Mélanie Joly (Industry) and Evan Solomon (AI and Digital Innovation) announced the investment on 2025-11-28, framing it around domestic supply-chain resilience for AI/HPC, aerospace and defence, telecommunications, and automotive end-markets. The project is projected to create 75 new highly-skilled jobs and sustain over 1,000 existing jobs in the Bromont region.

Korea's Ministry of Economy and Finance (MOEF) has imposed a provisional anti-dumping duty of 11.92–19.43% on fibreboard (wood- or other ligneous-fibre panels, thickness ≤5mm, used in furniture, interior construction fittings and packaging) imported from Thailand, effective from 28 November 2025, following a Korea Trade Commission (KTC) preliminary determination of dumping and material injury. On 12 February 2026 the KTC's 469th commission meeting issued its final determination confirming injury and voted to recommend a 5-year definitive anti-dumping duty of 15.29–22.44% to the Minister of Economy and Finance. As of this filing MOEF had not yet gazetted the definitive rate; the 11.92–19.43% provisional schedule remains the only legally operative rate. The investigation was opened on a petition by Korean fibreboard producer Unid BT Plus (유니드비티플러스).

Presidential Decree No. 710 of 6 October 2025 amends the standing list of foreign-owned assets under "temporary management" (established by Decree No. 302 of 25 April 2023) to add 100 percent of the shares in Vonorus LLC — the Russian operating subsidiary of Silgan Metal Packaging Mitterdorf GmbH, the Austrian unit of US-listed Silgan Holdings Inc. (NYSE: SLGN) — transferring control of the company to Rosimushchestvo. The decree entered into force on its date of official publication (6 October 2025) and is one of a running series of company-specific amendments to Decree 302, Russia's mechanism for placing Russian assets of "unfriendly state" companies under state administration in reciprocal response to Western sanctions and asset freezes.

The Yogi Adityanath cabinet approved the Uttar Pradesh Electronics Component Manufacturing Policy 2025 (UP ECMP-2025) on 3 September 2025, designating an effective date retroactive to 1 April 2025 for a six-year policy horizon (sunset 31 March 2031). Administered by UPLC and Invest UP, the policy targets INR 5,000 crore in new investment by layering state-level incentives on top of the central MeitY Electronics Component Manufacturing Scheme (ECMS), covering eleven priority component categories including displays, camera modules, multilayer PCBs, magnetics, lithium-ion cells, capacitors, resistors, semiconductor packaging substrates, sensors, connectors, and oscillators. UP is the fourth major Indian state (after Gujarat, Tamil Nadu, and Andhra Pradesh) to publish a dedicated ECMS-stacking instrument, completing the Big-Four-state cluster for ECMS-anchored greenfield investment.

On 2025-08-30 the Russian government adopted Resolution No. 1341, amending the standing "unfriendly states" import-duty schedule (Resolution No. 2240 of 2022-12-07) to raise customs duty rates on selected oils, fats and bottled drinking water originating from states Russia designates as "unfriendly." Coconut oil and palm kernel oil rose to 25% of customs value (palm kernel oil subject to a EUR 0.56/kg floor); margarine rose from 15% (min EUR 0.12/kg) to 25% (min EUR 0.90/kg); non-carbonated natural mineral water rose to 20% of customs value (EUR 0.11-0.18/litre floor depending on packaging). The resolution entered into force on 2025-09-09.

India's DGFT issued Notification No. 26/2025-26 on 22 August 2025, amending the import policy condition under Chapter 48 of ITC (HS) 2022, Schedule-I for Virgin Multi-layer Paper Board (VPB, HS codes 48059100, 48059200, 48059300, 48109200 and 48109900). Imports remain "Free" but are now subject to compulsory registration under the Paper Import Monitoring System (PIMS) and a Minimum Import Price (MIP) of INR 67,220 per metric tonne on CIF value; consignments declared below that floor are reclassified as "Restricted" and require a DGFT authorisation before Customs clearance. Global Trade Alert records China, Brazil and Chile among the affected exporters. The measure was originally set to lapse 31 March 2026 but has since been extended twice, most recently to 30 September 2026.

The Union Cabinet chaired by Prime Minister Narendra Modi approved on 12 August 2025 four new semiconductor manufacturing units under the India Semiconductor Mission (ISM) Phase 1: SiCSem Private Limited (Silicon Carbide compound-semiconductor fab, Odisha, with UK partner Clas-SiC Wafer Fab Ltd.), 3D Glass Solutions Inc. (advanced glass-substrate packaging, Odisha), Continental Device India Private Limited / CDIL (discrete power-semiconductor expansion, Punjab), and Advanced System in Package Technologies / ASIP (OSAT unit with South Korea's APACT Co. Ltd, Andhra Pradesh). Cumulative investment INR 4,600 crore (~USD 525mn); 2,034 skilled jobs at full ramp. This brought total approved ISM Phase 1 projects to 10 across 6 states, with cumulative committed investment of approximately INR 1.60 lakh crore (~USD 18bn).

At its 32nd regular session on 10 August 2025, chaired by Prime Minister Mohammed Shia' Al-Sudani, Iraq's Council of Ministers approved two additional customs duties on imports from all countries of origin: a 75% additional duty on the unit measure of imported paper napkins/tissues, and a 30% additional duty on the unit measure of white polystyrene plates and food-storage containers. Both duties run for four years without reduction, with domestic-market monitoring during the application period, and took effect 120 days after issuance (10 December 2025). Global Trade Alert logs China, Saudi Arabia and Turkiye as the principal supplier origins affected, though the measure itself is non-discriminatory (applies to all origins).

METI certified a Supply Security Plan (供給確保計画) filed by Nitto Boseki Co., Ltd. under Japan's Economic Security Promotion Act, designating low-thermal-expansion glass cloth for cutting-edge logic IC packaging substrates as a "specified critical good" material input. The certification (plan no. 2025-semicon-3-1, approved 7 August 2025) qualifies Nitto Boseki for a grant of up to JPY 2.4 billion (~USD 16 million) toward a JPY 7.2 billion new production line at its Fukushima No. 2 plant, targeting a roughly 200% increase in domestic capacity for this glass-cloth grade with supply starting July 2027 and a committed 10-year production run.

METI certified a Supply Security Plan (供給確保計画) filed by DIC Corporation under Japan's Economic Security Promotion Act, designating epoxy resin used in semiconductor packaging/encapsulation as a "specified critical good" material input. The certification (plan no. 2025-semicon-2-1, approved 31 July 2025) qualifies DIC for a grant of up to JPY 3 billion (~USD 20.1 million) toward a new epoxy-resin plant at its Chiba (Ichihara) factory, targeting roughly a 59% increase in domestic production capacity for semiconductor-grade epoxy resin, with supply starting July 2029.

Presidential Decree No. 464 of 9 July 2025 amends the standing Decree No. 302 (25 April 2023) list of foreign-owned assets under "temporary management," adding 100 percent of the shares in JSC PETRUS — owned by Cyprus-registered Pet.Rus Plastic Holdings Ltd — and transferring control to SafPet Aktiv LLC, a Kazan-based entity wholly owned by Tatneft. PETRUS produces PET preforms, polymer caps and BOPET film, with its flagship plant in Noginsk, Moscow region. The transfer follows a Vakhitovsky District Court (Kazan) order arresting PETRUS's assets in a criminal case against Ukrainian businessman Igor Kolomoisky, whom investigators identify as the company's beneficial owner.

On 27 May 2025 the People's Government Office of Xiaoshan District, Hangzhou (Zhejiang Province) issued Xiao Zhengbanfa [2025] No. 22, "Several Policies to Promote the High-Quality Development of the Integrated Circuit Industry," published 30 May 2025. The notice establishes a district-level subsidy stack covering EDA design, IC design, manufacturing, packaging and testing, and equipment/materials firms operating in Xiaoshan District. Headline instruments include R&D subsidies for enterprises investing over CNY 50m (with a lower CNY 10m tier) in key IC materials and core equipment with realized sales, a wafer tape-out subsidy capped at CNY 20m per enterprise per year, public innovation-platform purchase subsidies of up to CNY 500k, "chip-mould linkage" support up to CNY 3m, and talent-support measures including housing subsidies for IC industry personnel.

Pakistan's National Tariff Commission (NTC) issued its final determination in anti-dumping case ADC-66, imposing a definitive 26.76% ad valorem duty on imports of biaxially oriented polypropylene (BOPP) self-adhesive tapes in jumbo rolls (PCT 3919.9010 / 3919.9090) originating from China, effective for five years from January 31, 2025. The investigation, initiated on the petition of domestic manufacturer M/s Universal Coating Films (Pvt.) Limited, found that Chinese-origin BOPP tapes were being dumped into Pakistan at injuriously low prices, causing material injury to the domestic packaging-tape industry. The measure supersedes the provisional 14.99% duty imposed in January 2025 and was announced in the final determination report published on 24 May 2025.

On 21 May 2025, Brazil's national development bank BNDES approved a BRL 71.4 million (~USD 12.6 million) loan to BO Paper Brasil Indústria de Papéis, financed through the Novo Fundo Clima (New Climate Fund), to adapt its Jaguariaíva (Paraná) packaging-paper plant to run on a 50% virgin / 50% recycled fiber input mix. The plant is Latin America's largest packaging-paper producer. Total project investment is approximately BRL 93.2 million, targeting 160,000 tons of installed capacity and a claimed ~16.6 thousand tons/year reduction in CO2e emissions (~48.9% versus the counterfactual all-virgin-fiber process).

Shenzhen (Guangdong Province) established the Shenzhen Semiconductor and Integrated Circuit Industry Investment Fund (深圳市半导体与集成电路 产业投资基金, "Saimi Industrial Private Fund" / 赛米产业私募基金) with a total scale of CNY 5 billion. The fund completed business registration around 13 May 2025 following establishment on 29 April 2025, and was formally unveiled at a public ceremony on 16 October 2025. It is co-managed by Futian Hongshi (a wholly-owned subsidiary of Shenzhen Capital Group, 深创投) and Zhongzhi Investment Capital (a wholly-owned subsidiary of Shenzhen Major Industry Investment Group, 深重投), and operates under Shenzhen's "20+8" strategic-industry fund framework. It targets general/specialised computing chips, new-architecture storage, optoelectronic/sensor chips, and critical manufacturing equipment, components, materials, and advanced packaging/testing.

The Legislative Yuan of Taiwan (ROC) passed amendments to Article 22 of the Statute for Industrial Innovation (產業創新條例) and added a new Article 67-3 on third reading on 18 April 2025, promulgated by Presidential Decree on 7 May 2025. The package establishes for the first time a Taiwanese OUTBOUND-investment screening regime under the Statute: outbound investments by Taiwanese entities meeting the amount threshold (NTD 1.5bn, or lower as determined) OR involving designated countries/regions OR specific industries or technologies must obtain prior approval from the Ministry of Economic Affairs (MOEA) before implementation. The competent authority may deny approval (in whole or in part) or impose conditional approval where particular circumstances are identified — including risks to national security, harm to economic development or supply-chain resilience, conflict with international treaties, or violation of labour-standards law. The new Article 67-3 establishes enforcement penalties ranging from NTD 50,000 to NTD 1,000,000 for initial non-compliance violations and NTD 500,000 to NTD 10,000,000 per violation for failure to comply with conditions, restrictions, or undertakings imposed by MOEA under Article 22 Paragraph 3. Effective dates of implementing provisions are to be determined by Executive Yuan secondary legislation; the package is structurally novel for Taiwan — the first horizontal outbound-investment-security instrument and the structural parallel to the US Treasury Final Rule on Outbound Investment in Countries of Concern (28 October 2024 / effective 2 January 2025), the EU Commission Recommendation 2025/63, and Korea's MOTIE NCT regime.

President Ferdinand R. Marcos Jr. signed Administrative Order No. 31 s. 2025 on 28 March 2025, establishing the Semiconductor and Electronics Industry Advisory Council (SEIAC) as the President's primary advisory body on semiconductor and electronics industry development, promotion, and competitiveness. The SEIAC is chaired by the Special Assistant to the President for Investment and Economic Affairs, with the DTI Secretary as Vice-Chair, and mandates the Council to provide strategic guidance for implementing the Philippine Semiconductor and Electronics Industry (PSEI) Roadmap, coordinate inter-agency interventions across the value chain, and recommend legislative measures for sectoral competitiveness.

Poland's Ministry of Digital Affairs published the final "Polska w grze o przyszłość — polityka dla sektora półprzewodników 2025+" (Poland in the Game for the Future — Semiconductor Sector Policy 2025+) in mid-June 2025 following public consultations (6 February – 4 March 2025, 38 entities, 356 proposals reviewed). The seven-pillar national strategic framework targets 2–3 large industrial semiconductor investments by 2030 with added value €300–600 M each, focused on back-end production (assembly, test, packaging) and materials. Three specialised semiconductor parks are proposed: Mazovia (chip design), Lower Silesia (materials manufacturing), and Pomerania (sensor technologies). The policy operationalises Poland's positioning as a back-end semiconductor destination and materials-supply hub within the EU Chips Act ecosystem, sitting inside the broader "National Framework for Supporting Strategic Semiconductor Investments" programme (>PLN 7 bn through 2026, adopted December 2023).

Regulation (EU) 2025/40, published in the Official Journal on 22 January 2025 and entering into force on 11 February 2025, replaces the 1994 Packaging and Packaging Waste Directive 94/62/EC with a directly-applicable Regulation. It mandates binding recycled-content targets for plastic packaging (by polymer and format, reaching 30–65% by 2030 with higher targets by 2040), minimum reusable-packaging shares for beverages and transport, recyclability standards for all packaging placed on the EU market from 2030, deposit-return-scheme obligations for beverage containers from 2029, and bans on specified single-use plastic packaging formats. General application begins 12 August 2026, with staggered compliance windows extending to 2030 and beyond, affecting all non-EU exporters shipping consumer goods, beverages, or e-commerce fulfilment into the EU single market.

The US Bureau of Industry and Security issued its largest single export-control package targeting China's semiconductor industry on 2 December 2024, with three layered measures (final rules published in the Federal Register 5 December 2024). First, controls on high-bandwidth memory (HBM) above set performance thresholds — blocking the memory architecture that is foundational to AI training. Second, additions of 24 semiconductor manufacturing equipment item types to the Commerce Control List, covering deposition, etch, ion- implant, advanced packaging, and metrology categories. Third, Entity List designations for 140+ entities, the bulk Chinese semiconductor companies + equipment makers + investment vehicles, including major Chinese fab tooling firms. The package triggered MOFCOM's same-day-following retaliation (filed: 2024-12-03-china-mofcom-ge-ga-sb-export-ban-us).

Prime Minister Anwar Ibrahim launched Malaysia's National Semiconductor Strategy (NSS) on 28 May 2024 in his keynote at SEMICON Southeast Asia, with implementation led by MITI. The NSS commits at least RM25 billion (~USD 5.3 billion) in fiscal support over a ten-year horizon and structures the chip industrial policy in three sequential phases: (1) shoring up Malaysia's existing strength in outsourced semiconductor assembly and test (OSAT) and back-end packaging, (2) moving domestic firms into integrated-circuit (IC) design, advanced packaging and advanced manufacturing equipment, and (3) developing Malaysian-owned global champions across the chip value chain under a "Made by Malaysia" framing. Headline targets include developing 10 local design and advanced- packaging companies with revenues between RM1 billion and RM4.7 billion, 100 broader semiconductor-related companies near the RM1 billion revenue mark, and training 60,000 high- skilled engineers. The RM25 billion envelope decomposes into RM5 billion in tax forgone over five years, RM2 billion for existing capital grants, RM1.25 billion for an HRD Fund semiconductor allocation, RM2 billion for a Semiconductor Industrial Park, RM1.59 billion for an Advanced Packaging Centre, plus RM2 billion each for the National Energy Transition Facility and Green Tech Financing Scheme. By June 2025, the government reported RM70.7 billion in announced investments attracted under the NSS umbrella.

The Directorate General of Trade Remedies (DGTR) initiated an anti-dumping investigation on 28 March 2024 concerning imports of Titanium Dioxide (TiO₂, pigment grade; HS 3206.11/3206.19) originating in or exported from China PR (file 14/51/2002-DGAD), on application of Indian domestic producers Travancore Titanium Products Ltd, Kerala Minerals & Metals Ltd (KMML), Meghmani Organochem Ltd, and VV Titanium Pigments Pvt Ltd. Final Findings were issued on 12 February 2025 recommending anti-dumping duties on Chinese TiO₂ imports; those findings were subsequently remanded by court order in October 2025, reopening the determination phase. DGTR issued a second Disclosure Statement on 12 May 2026 and extended the remand timeline on 18 May 2026, with revised Final Findings expected in Q3 2026. The investigation sits within a global TiO₂ anti-dumping cluster targeting Chinese producers alongside parallel EU provisional measures (2024) and USITC AD-CVD proceedings.

On 21 March 2024, Costa Rica's Ministerio de Comercio Exterior (COMEX) launched the Hoja de Ruta para el Fortalecimiento del Ecosistema de Semiconductores — the first national semiconductor roadmap published by any Latin American country — jointly presented with US Secretary of Commerce Gina Raimondo in the context of the CHIPS Act §103 ITSI Fund partnership. President Rodrigo Chaves Robles simultaneously signed an executive decree declaring the semiconductor industry and related industries of "interés público" (public interest) and directing COMEX to lead implementation. The roadmap is organised around four pillars: Talent (Human Talent Training Incentive programme, US$6M initial budget), Incentives (OECD BEPS Pillar Two-aligned fiscal/financial R&D incentives, Free Trade Zone regime strengthening under Law 7210), Investment Attraction (CINDE-led FDI promotion targeting ATP, advanced PCB, and design-house segments), and Regulatory Improvement (customs facilitation, IP reform, export-control alignment). Costa Rica is one of seven declared ITSI-fund partner economies and hosts Intel's largest non-US assembly and test site since 1997, alongside Applied Materials, ON Semiconductor, Coherent, MaxLinear, and Boston Scientific.