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TSMC is the world's largest dedicated semiconductor foundry, with the dominant share at every leading-edge logic node (N3 / N4 / N5 and the upcoming N2 / A16 / A14 generations) and a structurally profitable mature-node automotive / industrial franchise running at 12nm / 16nm / 22nm / 28nm.
No controlling shareholder. Taiwan's National Development Fund (Executive Yuan) is the largest single named shareholder at 6.38% — a strategic government stake, not a majority/control position. ~20.5% of shares are held via the NYSE ADR program (depositary of record, not a beneficial owner); the remainder is free-float institutional/retail, ~73.5% foreign-institutional per contemporaneous reporting. GLEIF reports no parent (parent_reported: false), consistent with this. No parent_slug — TSMC is not a subsidiary.
Named counterparties identified by open-source research and written only where a primary source states the relationship — never inferred from sector or co-mention. 1 customer-side. This is a partial view: it covers the relationships we could evidence, not the company's full supply base.
Joint NVIDIA/TSMC announcement of the first NVIDIA Blackwell wafer fabricated at TSMC Arizona, October 2025; NVIDIA's own blog describes a 'three decades' manufacturing partnership with TSMC. No dollar volume or revenue-share figure is disclosed in this release. TSMC's own 20-F discloses customer concentration only by anonymized letter (FY2025: largest customer 19%, second 17%, top-ten 78% of net revenue); analyst reporting (wccftech, CNBC) attributes named percentages to Apple and NVIDIA specifically, but both cited pages returned HTTP 403 to automated re-fetch this tick and were not independently confirmed, so no share_pct is recorded against this named row.
Scope. Absence of a counterparty here is not evidence that none exists — most commercial sourcing is confidential and never becomes public. Rows without a share figure mean no share was disclosed, not that the relationship is small.
14 other tracked dossiers name this company as a counterparty in its own sourced disclosure — this platform never wrote these rows on this company's own page, they are read here inverted from the dossier that disclosed them. This is a partial view: 982 additional named-counterparty rows across the corpus could not be matched to a tracked dossier by name at all (mostly non-Latin legal names), so the true count is higher than what renders here.
Sony Semiconductor Solutions and TSMC signed a binding agreement to form Advanced Vision Semiconductor Manufacturing Corporation, a Kumamoto (Koshi City) joint venture for next-gen smartphone image-sensor manufacturing; Sony is the controlling/majority shareholder (~465bn yen contribution) with TSMC contributing ~282bn yen cash. Distinct from the separate JASM foundry (TSMC-majority, Sony/Denso/Toyota minority). Categorized as supplier because TSMC provides fabrication capacity/technology into Sony's sensor supply chain, not a simple customer purchase — no revenue-share percentage applies.
Same report, FY2024 (fiscal year ended 2025-03-31) column: TSMC JPY 96,158m / 12.3% of net sales, mainly semiconductor-and-component-test-system segment -- first year TSMC crosses the 10%-of-sales disclosure threshold (no FY2023 row disclosed, i.e. below 10% that year). Driven by the HBM/HPC test-system demand surge the dossier's own 'What they do' and segment-review text already describes.
Canon's own newsroom (24 Dec 2025) states TSMC presented Canon with its 2025 Excellent Production Support award, the third such award, for 'timely equipment supply, high-quality service support and the development of new functions' -- confirms TSMC as a lithography-equipment customer. No purchase value or share of Canon's semiconductor-equipment revenue is disclosed.
See Samsung row -- same FY2015 10-K table. Named through the FY2024 10-K; the FY2025 10-K discloses two unnamed customers at ~19%/15% of net revenue, so the current filing no longer names TSMC/Samsung.
FY2024 10-K (filed 2024-12-13) note on customer concentration and Item 1 table: customers at >=10% of net revenue (FY2024/FY2023/FY2022: Samsung 12/15/12%, TSMC 11/19/20%; Intel 10% in FY2022 only). Base labelled 'net revenue' in this filing, 'net sales' in earlier ones.
FY2023 10-K (filed 2023-12-15) Item 1 table: customers at >=10% of net sales (FY2023/FY2022/FY2021: Samsung 15/12/20%, TSMC 19/20/15%). Prior-vintage row for the FY2024 comparison.
AMD FY2025 10-K (filed 2025-12-27), Manufacturing Arrangements section: 'We utilize Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of wafers for our HPC, FPGA and adaptive SoC products.' GLOBALFOUNDRIES is separately named for 12nm/14nm nodes. No wafer-volume or spend percentage disclosed.
Amkor and TSMC press releases (both companies): TSMC will contract turnkey advanced packaging/test services from Amkor's planned Peoria, Arizona facility to serve customers of TSMC's Phoenix-area fabs, using TSMC's InFO/CoWoS packaging technologies. Firms up an October 2024 MOU. No dollar value or volume share disclosed by either party.
ASM's own press release (GlobeNewswire 2993475, 2024-12-09; regulatory mirror on Investegate, as asm.com renders the body client-side) on receiving TSMC's 2024 Excellent Performance Award (4th consecutive year), quoting ASM CEO: 'TSMC is a highly valued strategic partner for ASM as we collaborate to drive the next technological breakthroughs.' Confirms an ongoing supplier relationship but discloses no volume or revenue-share figure.
KLA FY2025 10-K discloses TSMC accounted for more than 10% of total revenue in FY2025, FY2024, and FY2023, primarily in the Semiconductor Process Control segment; exact percentage not disclosed.
Qualcomm FY2025 Form 10-K: "The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries." Named as a foundry supplier; no volume or share is disclosed and none is implied here. Re-fetched and re-quoted 2026-09-17, unchanged since 2026-06-24 — still the live FY2025 10-K (fiscal year ended 2025-09-28).
Linde builds/owns/operates on-site air-separation and specialty-gas plants supplying TSMC's Phoenix, Arizona fab complex under a long-term take-or-pay agreement. Linde's own 2021/2026 press releases on this deal (linde.com) describe the customer only generically ('one of the world's largest semiconductor manufacturers'); TSMC is named by trade press (Arizona Technology Council, gasworld) rather than by Linde itself, so treated as secondary rather than company-disclosure.
NVIDIA's own corporate blog names TSMC as its wafer-fabrication partner of 'three decades' and jointly announces the first NVIDIA Blackwell wafer produced on US soil, fabricated at TSMC Arizona, October 2025 (quote attributed to TSMC Arizona CEO Ray Chuang). No purchase share or dollar volume is disclosed in this release; NVIDIA's 10-K risk factors describe TSMC dependency only in qualitative terms without a percentage.
ASML/TSMC joint press release (2026-09-08): TSMC intends to use ASML's High-NA EUV technology in high-volume manufacturing for advanced nodes starting in 2030, and the two companies announced a joint initiative to transition to 12-inch photomasks for High-NA EUV (pilot line targeted 2031, advanced-node production 2033). TSMC and Samsung were reported in contemporaneous press coverage as the second and third High-NA EUV adopters after Intel, but this press release itself names only TSMC -- Samsung's commitment is not independently confirmed to this primary source, so no Samsung row was added.
Scope. This section is inverted evidence: each linked dossier wrote the original row about itself, describing its own relationship to this company. It is never a claim this company itself disclosed. Absence here is not evidence of no relationship — most of the corpus has no named-counterparty block at all yet.
Every exposure is read as a buyer dependency; the top 3 are its binding chokepoints. If this company actually produces one of these materials rather than buying it, that would be misclassified here — no producer-classifier entry exists for 3 of them.
Dossier discloses a neodymium exposure with no Dy/Tb/Sm tag and a sector where doping is not the rule — whether this company's magnets are Dy/Tb-doped is not on record. Resolved by a disclosed magnet grade, or a named magnet supplier in named_counterparties.
A61's suspension (Announcement 70) lapses 10 Nov 2026 — on the plain text, controls revive automatically. The US DoD CN/RU/IR/KP sourcing bar follows 1 Jan 2027. See the underlying extraterritorial export-control action. We supply the provenance file; we never compute your ratio for you.
As a buyer, policy pressure across its consumed materials is rising.
Descriptive trend in official policy actions on this company’s materials — a policy-pressure trend, not a price or trading signal. No forward probability is implied. Direction is measured on actions we have discovered, and discovery lags events: where the recent window is too thin to support a calm reading, the row says coverage-limited instead of easing.
🇺🇸 US accounts for 27% of severity-weighted pressure. Regulatory focus shifted from 🇺🇸 US to 🇨🇳 CN in 2026Q3.