Industrial Policy & Trade Monitor· 2662 actions· ✨ 89 recent

On 3 June 2026 the European Commission adopted a legislative proposal to amend and substantially expand the EU Chips Act (Regulation (EU) 2023/1781), as part of the European Technological Sovereignty Package. The proposal raises the mobilisation target from €43bn to €120bn, introduces new demand-side "Demand Accelerators" to aggregate public procurement, expands "Grand Challenges" to cover AI-optimised chips, caps permitting at 12 months, and widens the Strategic Partnerships on Semiconductors framework. As a Commission legislative proposal it now enters co-decision (European Parliament + Council) before becoming law; the 2023 regulation remains in force during this process.

The Department of Commerce's International Trade Administration published a Federal Register notice on 10 April 2026 (91 FR 18412, doc 2026-06952) opening the inaugural Call for Proposals for the American AI Exports Program established under Executive Order 14320. Proposals are accepted from 1 April 2026 through 5:00 pm EDT on 30 June 2026 from US industry-led "pre-set" consortia offering full-stack American AI export packages — AI-optimised hardware, data pipelines, AI models and systems, security and cybersecurity measures, and sector-specific applications — for presentation by the US government to foreign public- and private-sector buyers. Designated consortia receive priority US-government advocacy, priority consideration for export-control licence engagement, interagency coordination, and federal-financing referrals (EXIM, DFC), with a 14-business-day completeness review and 60-calendar-day designation decision once a proposal is deemed complete.

South Korea's National Assembly passed the "Special Act on Strengthening and Supporting the Competitiveness of the Semiconductor Industry" (반도체산업 경쟁력 강화 및 지원에 관한 특별법) on 29 January 2026 by 199 votes in favour out of 206 members present, after roughly 18 months of inter-party deadlock. The act establishes (i) a Presidential Commission for Enhancing Semiconductor Competitiveness as the central inter-ministerial coordination body, (ii) a statutory five-year master plan with annual implementation plans, (iii) a dedicated semiconductor industry special account ("반도체산업 특별회계") to ring-fence funding for fabs, materials, parts and equipment, and packaging across the full memory + system-LSI + design + manufacturing supply chain, and (iv) authority to designate semiconductor clusters outside the greater Seoul area with relocation incentives. Promulgation by the Cabinet is expected shortly after passage; effectiveness contingent on enforcement-ordinance finalisation, expected Q3 2026. The KRW 2tn anchor envelope of the special account does not begin disbursing until 2027 because companion amendments to the National Finance Act were not enacted in time.

On 7 January 2026 the National Semiconductor and Advanced Electronics Industry Policy Committee (the "Semiconductor Board"), chaired by Deputy Prime Minister and Minister of Finance Ekniti Nitithanprapas, endorsed the Draft National Strategy for the Development of the Semiconductor and Advanced Electronics Industry, prepared by the Board of Investment (BOI) with Roland Berger after a public hearing in October 2025. The 25-year roadmap (2026-2050) targets more than THB 2.5 trillion (~USD 79.6 billion) in investment, training of more than 230,000 highly-skilled engineers, and construction of a complete upstream-to- downstream semiconductor ecosystem with phased milestones for 2030, 2040 and 2050. The strategy prioritises five product groups where Thailand has competitive potential — Power chips, Sensors, Photonics, Analog and Discrete chips — and explicitly aims to move the country beyond OSAT (Outsourced Semiconductor Assembly and Test) into IC design and upstream wafer fabrication ("Made-in-Thailand chips"). Implementation runs through a five-pillar BOI support mechanism: long-term low-interest financing and grants, human-capital development, technology upgrade of the Microelectronics Technology Centre (TMEC), specialised industrial clusters with guaranteed renewable-energy and water security, and streamlined regulatory approvals including a new BOI "FastPass" fast-track facility (16 pilot projects worth THB 170 billion already processed).

Singapore's National Research Foundation (NRF), under the Prime Minister's Office, launched the five-year Research, Innovation and Enterprise 2030 Plan on 5 December 2025, allocating S$37 billion (approximately 1% of GDP) for 2026-2030. The plan succeeds RIE2025 (S$25 billion) and introduces two named RIE Flagships and two RIE Grand Challenges; the first Flagship is in semiconductors and is explicitly aimed at making Singapore a strategically important R&D and manufacturing node in the global semiconductor supply chain. The budget envelope is split 24% foundational research, 20% innovation and enterprise, 17% infrastructure / new programmes ("white space"), 10% talent development.

On 15 October 2025 the German Federal Cabinet adopted the Microelectronics Strategy of the Federal Government, jointly presented by the Federal Ministry for Research, Technology and Space (BMFTR) and the Federal Ministry for Economic Affairs and Energy (BMWE). The strategy is the first comprehensive cabinet-adopted German microelectronics policy framework in over a decade and operationalises Germany's contribution to the European Chips Act envelope. It is organised around three pillars — Research, Skilled Labour and Production — and creates a "Chips Office" to coordinate stakeholder interaction and implementation. It establishes a competence centre for chip design and a flagship "supercomputer in the car" project, and is framed as a key implementation instrument under the High-Tech Agenda Germany (HTAD) and as Germany's contribution to the September 29 2025 Semicon Declaration signed by all 27 EU member states calling for a revised EU Chips Act II.

H.R.1, the "One Big Beautiful Bill Act" (Public Law 119-21), was signed into law by President Trump on 4 July 2025. The budget-reconciliation statute is the single largest reversal of the 2022 Inflation Reduction Act (IRA) industrial-policy framework: it accelerates the termination of IRA-era clean- energy tax credits and overlays a new "Foreign Entity of Concern" (FEOC) / "Prohibited Foreign Entity" (PFE) regime on the credits that survive. The §25E used-EV credit, the §30D new clean-vehicle credit, the §45W commercial clean-vehicle credit, and the §30C alternative-fuel-refueling-property credit terminate for vehicles or property placed in service after 30 September 2025. The §25C energy-efficient home improvement credit and the §25D residential clean-energy credit terminate for property placed in service after 31 December 2025. The §45Y clean-electricity production credit and §48E clean-electricity investment credit are eliminated for wind and solar facilities placed in service after 31 December 2027, with a safe harbour for projects whose construction begins on or before 4 July 2026. From 1 January 2026, projects beginning construction must satisfy "material assistance" thresholds limiting the share of components, subcomponents and critical minerals sourced from prohibited foreign entities (PRC, Russia, Iran, DPRK and entities controlled by them). For §45Y/§48E facilities the threshold starts at 40% non-PFE content in 2026 and steps up by 5 percentage points per year through 2030; for §45X advanced manufacturing PTC the analogous schedule begins at 50% in 2026 and rises through the decade. CBO scored the package's energy-credit terminations as generating roughly USD 280bn of revenue (gross), of which USD 77.4bn from §25D termination, USD 21.2bn from §25C, USD 77.8bn from §30D, USD 104.5bn from §45W, and USD 2bn from §30C, partially offsetting the bill's other tax cuts. The bill simultaneously re-authorises and broadens the §48D advanced manufacturing investment tax credit for semiconductor fabs, raising the credit rate from 25% to 35% for property placed in service after 31 December 2025 (preserving the CHIPS Act-aligned semiconductor leg of the IRA-era stack). The OBBBA therefore reshapes the IRA from a broad-based clean-energy + EV + manufacturing pull-through into a narrower, China-decoupling industrial policy concentrated on semiconductors and (residually) §45X battery / critical- mineral processing.

South Korea's National Assembly passed the Special Act on the Expansion of the National Electricity Network (Law No. 20844) on 19 February 2025 as part of the bipartisan "Energy Trifecta Bill," with promulgation on 25 March 2025 and entry into force on 26 September 2025. The act creates an expedited siting, permitting, and compensation framework for trunk transmission-grid construction, consolidating 35 previously separate regulatory approvals into a single streamlined procedure and targeting a >30% reduction in grid-build timelines. It directly addresses the electricity-infrastructure bottleneck constraining semiconductor fab clusters (Yongin, Pyeongtaek, SK Hynix HBM), sovereign AI datacenter build-out, and EV/battery gigafactory load growth — structurally distinct from the K-Chips Act (fiscal incentives) and the Semiconductor Special Act (regulatory framework), as it unblocks the physical power-delivery constraint those programmes depend on.

South Korea's Ministry of Science and ICT (MSIT) committed in its 2025 Work Plan to establish a National AI Computing Center via public-private partnership (PPP), with an anchor envelope of KRW 2 trillion rising to KRW 4 trillion through 2030. In July 2025 MSIT executed the first major tranche: KRW 1.46 trillion (approx. USD 1.1 billion) to procure approximately 13,000 high-performance GPUs (NVIDIA B200 and H200) distributed across three domestic cloud operators — Naver Cloud, NHN Cloud, and Kakao. This is Korea's first PPP-structured sovereign-AI compute procurement instrument, structurally distinct from the AI Basic Act (horizontal regulatory framework) and the Semiconductor Special Act (fab investment incentives), as it directly addresses the compute- infrastructure supply constraint for AI model training and national AI research.

President Luis Abinader signed Decreto No. 324-24 on 13 June 2024, declaring the promotion, innovation, and development of the semiconductor industry in the Dominican Republic as "alta prioridad nacional" (high national priority) and directing MICM to formulate a National Strategy for the Promotion of the Semiconductor Industry (ENFIS). The decree was published in the Official Gazette on 28 June 2024, establishing a high-level inter-ministerial coordination mechanism and linking the initiative to the free-trade-zone incentive framework under Law 8-90. ENFIS was formally launched on 19 August 2025 by President Abinader and MICM Minister Víctor Bisonó at the Día Nacional de las Zonas Francas, structuring the strategy across five pillars: Industrial Development, Governance and Policy, Workforce and Human Capital, Investment Attraction, and Innovation and R&D Ecosystem.

Prime Minister Anwar Ibrahim launched Malaysia's National Semiconductor Strategy (NSS) on 28 May 2024 in his keynote at SEMICON Southeast Asia, with implementation led by MITI. The NSS commits at least RM25 billion (~USD 5.3 billion) in fiscal support over a ten-year horizon and structures the chip industrial policy in three sequential phases: (1) shoring up Malaysia's existing strength in outsourced semiconductor assembly and test (OSAT) and back-end packaging, (2) moving domestic firms into integrated-circuit (IC) design, advanced packaging and advanced manufacturing equipment, and (3) developing Malaysian-owned global champions across the chip value chain under a "Made by Malaysia" framing. Headline targets include developing 10 local design and advanced- packaging companies with revenues between RM1 billion and RM4.7 billion, 100 broader semiconductor-related companies near the RM1 billion revenue mark, and training 60,000 high- skilled engineers. The RM25 billion envelope decomposes into RM5 billion in tax forgone over five years, RM2 billion for existing capital grants, RM1.25 billion for an HRD Fund semiconductor allocation, RM2 billion for a Semiconductor Industrial Park, RM1.59 billion for an Advanced Packaging Centre, plus RM2 billion each for the National Energy Transition Facility and Green Tech Financing Scheme. By June 2025, the government reported RM70.7 billion in announced investments attracted under the NSS umbrella.

China registered the National Integrated Circuit Industry Investment Fund III Co., Ltd. ("Big Fund III") in Beijing on 24 May 2024 with RMB 344 billion (~USD 47.5 billion) of registered capital — the largest single capital raise of the three Big Fund phases (Phase I 2014: RMB 138.7bn; Phase II 2019: RMB 204bn). Nineteen state-owned investors contribute, led by the Ministry of Finance (17% / RMB 60bn) and the six largest state-owned commercial banks (ICBC, ABC, BoC, CCB ~6.25% each at RMB 21.5bn; BoCom RMB 20bn; PSBC RMB 8bn). Duration 15 years (24 May 2024 → 23 May 2039). The fund explicitly targets the chokepoints exposed by US BIS October 2022/2023/2024 controls — semiconductor manufacturing equipment, advanced memory (HBM/DRAM), AI accelerators, and third-generation compound semiconductors (SiC, GaN).

The UK government published its National Semiconductor Strategy on 19 May 2023, under Secretary of State Michelle Donelan at the newly established Department for Science, Innovation and Technology (DSIT). The strategy commits GBP 1 billion in long-run support to the UK semiconductor sector, explicitly focusing on the UK's identified strengths: chip design (Arm, Imagination Technologies, Dialog), compound and wide-bandgap semiconductors (III-V, SiC, GaN -- centred on the Cardiff/Newport cluster and IQE plc), and upstream academic R&D. Unlike the US CHIPS Act or EU Chips Act, the strategy explicitly declined to fund advanced silicon wafer fabrication at scale, acknowledging the prohibitive capital cost and the UK's lack of existing fab infrastructure at leading nodes. A UK Semiconductor Advisory Panel was established to guide delivery and assess emerging requirements. The strategy is enabled by the UK Subsidy Control Act 2022 (in force January 2023), which freed UK public authorities to grant large technology subsidies without prior EU Commission approval.

The Act on the Promotion of Ensuring National Security through Integrated Implementation of Economic Measures (Law No. 43 of 2022), enacted 18 May 2022, establishes a four-pillar framework: (1) supply-chain resilience for "specified critical products," (2) security of critical infrastructure, (3) state-backed development of "specified critical technologies," and (4) non-disclosure of nationally sensitive patents. A December 2022 Cabinet Order designated 11 product categories as specified critical products, including semiconductors, storage batteries, permanent magnets, cloud programs, LNG, critical minerals, machine tools, and aircraft parts. Competent ministries must publish stable-supply plans, can fund private-sector surveys, and may provide subsidies to qualifying firms.