Industrial Policy & Trade Monitor· 2666 actions· ✨ 89 recent

On 26 December 2025, Japan's Cabinet approved the FY2026 (Reiwa 8) national budget, which the Global Trade Alert database logs as including a "Multi-modal Foundation Model Development Project with a Focus on AI Robots and Physical AI" financial-grant line administered by METI, effective with the fiscal year on 1 April 2026. NEDO -- METI's implementing R&D agency -- operationalised this line through a commissioned-project (100%-funded) solicitation opened 24 March 2026 and closed 22 April 2026, capping funding at up to JPY 383.4 billion (~USD 2.5bn) per adopted proposal for FY2026, with the programme running FY2026 through FY2030 (initial contract period FY2026-FY2027, annual stage-gate reviews thereafter). The goal is a domestically developed multimodal ("VLM/VLA") foundation model that keeps Japanese factory-floor and robotics data onshore while underpinning "physical AI" -- AI systems embedded in robots and industrial equipment -- to address labour shortages and lift manufacturing productivity. NEDO's call for proposals subsequently selected Noetra Inc. and the National Institute of Advanced Industrial Science and Technology (AIST/産総研) as awardees.

On 26 December 2025, Japan's Cabinet under Prime Minister Sanae Takaichi approved the FY2026 (Reiwa 8) national budget, which allocates JPY 150 billion (~USD 1bn) to the "Investment Project for Mass Production of Next-Generation Semiconductors" -- a state equity-investment line administered by the Information-technology Promotion Agency (IPA) that funds Rapidus Corporation's 2nm-class logic fab in Chitose, Hokkaido. The FY2026 allocation is 50% larger than the JPY 100 billion IPA equity tranche budgeted for FY2025, taking cumulative government equity in Rapidus to roughly JPY 250 billion. The line sits inside METI's wider AI/semiconductor budget of JPY 1.239 trillion for FY2026 (up roughly 4x year-on-year) under the "AI/Semiconductor Industry Base Strengthening Frame," part of the government's pledge of over JPY 10 trillion in public support for AI and chips through FY2030. The budget takes effect with Japan's fiscal year on 1 April 2026, subject to ordinary Diet passage in early 2026.

Singapore's National Research Foundation (NRF), under the Prime Minister's Office, launched the five-year Research, Innovation and Enterprise 2030 Plan on 5 December 2025, allocating S$37 billion (approximately 1% of GDP) for 2026-2030. The plan succeeds RIE2025 (S$25 billion) and introduces two named RIE Flagships and two RIE Grand Challenges; the first Flagship is in semiconductors and is explicitly aimed at making Singapore a strategically important R&D and manufacturing node in the global semiconductor supply chain. The budget envelope is split 24% foundational research, 20% innovation and enterprise, 17% infrastructure / new programmes ("white space"), 10% talent development.

On 21 November 2025, METI Minister Yoji Akazawa designated Rapidus Corporation as the official next-generation semiconductor manufacturer under Japan's Act on Facilitation of Information Processing (情報処理の促進に関する法律, as amended by the Cabinet-approved partial-amendment bill of 7 February 2025), following a public solicitation run 3 September – 2 October 2025. The designation makes Rapidus eligible for a multi-year METI funding envelope reported at roughly JPY 1tn (~USD 6.4bn), with an initial JPY 100bn equity investment by the Information-technology Promotion Agency (IPA) planned for FY2025; the funds support Rapidus' Hokkaido (Chitose) IIM-1 fab targeting 2nm GAA mass production from April 2027 and successor 1.4nm / 1nm nodes. The action is the first standalone Rapidus entry in the IPTM register and operationalises the supply-chain pillar of the 2022 Economic Security Promotion Act for advanced logic.

On 20 November 2025 the White House and US Department of Commerce / Bureau of Industry and Security (BIS) authorised Abu Dhabi AI holding company G42 to import advanced computing chips — equivalent to approximately 35,000 Nvidia GB300 Blackwell processors — under the UAE-pioneered Regulated Technology Environment (RTE) compliance framework. The RTE is an Emirati-designed technology governance and audit architecture, developed by G42 and approved under BIS guidelines, with binding UAE-side controls to prevent onward diversion to foreign adversary nations. The authorisation accelerates the Stargate UAE project — a 1 GW AI compute cluster being built by G42 for OpenAI in partnership with Oracle, Cisco, NVIDIA, and SoftBank Group — and represents the first concluded major country-level advanced-compute authorisation following the May 2025 rescission of the Biden-era AI Diffusion Rule.

SETT, the operational vehicle of Spain's PERTE Chip programme, announced a EUR 9.5 million public investment in Ideaded, a Viladecans (Barcelona) company developing microchips on alternative substrates to silicon. The funding is earmarked to complete Spain's first pilot plant for silicon-alternative microchips, financed under the Plan de Recuperacion, Transformacion y Resiliencia (NextGenerationEU). Target output is 50 wafers/month (first wafer expected 2026) plus up to 300 million RFID antennas/year, aimed at advanced-computing, AI and defence applications.

At the APEC Busan summit on 30 October 2025, Presidents Trump and Xi reached the "Economic and Trade Arrangement Between the United States and the People's Republic of China," subsequently implemented on the US side by the executive order "Modifying Reciprocal Tariff Rates Consistent with the Economic and Trade Arrangement" (issued 4 November 2025; effective 12:01 am EST on 10 November 2025; published in the Federal Register on 7 November 2025 as 90 FR 50729 / 2025-19826) and on the Chinese side by a series of MOFCOM and State Council Tariff Commission announcements (notably MOFCOM 2025 No. 90 of 8–9 November 2025). The arrangement is structurally parallel to the already-filed US-Japan, US-Korea and US-Taiwan framework deals but uniquely material because it freezes the highest-stakes bilateral tariff and export-control confrontation of the post-2024 reset. Core US commitments: (i) reciprocal-tariff "additional ad valorem rate of duty" on PRC-origin goods reduced from a prior 20% IEEPA-fentanyl + 10% IEEPA-reciprocal stack to a 10% rate (i.e., the prior 24% / 34% scheduled escalation is suspended), extended through 10 November 2026; (ii) US BIS suspends the so-called "affiliates rule" expanding entity-list controls to majority-owned subsidiaries of listed Chinese firms; (iii) USTR pauses Section 301 maritime / shipbuilding / logistics countermeasures against Chinese vessels for one year. Core PRC commitments: (i) MOFCOM suspends for one year (until 10 November 2026) the 9 October 2025 extraterritorial rare-earth export-control package — including controls on REE processing equipment, lithium-battery manufacturing equipment, and superhard materials; (ii) PRC suspends retaliatory tariffs on a broad swath of US agricultural products through 31 December 2026; (iii) commitment to purchase ≥25 million metric tonnes of US soybeans annually in 2026-2028 and to resume sorghum and log imports; (iv) suspension of MOFCOM antitrust and "unreliable-entity" probes against named US semiconductor and chip-equipment companies; (v) cooperation on fentanyl precursor enforcement. The arrangement does not repeal underlying authorities (IEEPA tariffs, MOFCOM export-control list, Entity List) — it is a calibrated mutual freeze with a one-year sunset and quarterly review checkpoints.

On 15 October 2025 the German Federal Cabinet adopted the Microelectronics Strategy of the Federal Government, jointly presented by the Federal Ministry for Research, Technology and Space (BMFTR) and the Federal Ministry for Economic Affairs and Energy (BMWE). The strategy is the first comprehensive cabinet-adopted German microelectronics policy framework in over a decade and operationalises Germany's contribution to the European Chips Act envelope. It is organised around three pillars — Research, Skilled Labour and Production — and creates a "Chips Office" to coordinate stakeholder interaction and implementation. It establishes a competence centre for chip design and a flagship "supercomputer in the car" project, and is framed as a key implementation instrument under the High-Tech Agenda Germany (HTAD) and as Germany's contribution to the September 29 2025 Semicon Declaration signed by all 27 EU member states calling for a revised EU Chips Act II.

On 18 September 2025 the Bundestag adopted the Gesetz zur Errichtung eines Sondervermögens "Infrastruktur und Klimaneutralität" (SVIKG), authorising up to EUR 500 bn of additional federal borrowing over a twelve-year horizon outside the constitutional debt brake, on the basis of the new Article 143h Grundgesetz inserted by the March 2025 constitutional amendment. The envelope splits into up to EUR 100 bn for Länder and municipal infrastructure (channelled via the companion Länder- und Kommunal-Infrastrukturfinanzierungsgesetz, LuKIFG, passed 9 October 2025), EUR 100 bn transferred to the Klima- und Trans- formationsfonds (KTF) in annual instalments through 2034, and up to EUR 300 bn for additional federal investments in transport, energy/ heat, hospital, education, digitalisation, civil protection and R&D infrastructure. Investments are eligible retroactively from 1 January 2025 and may be approved through 31 December 2036; loan repayment begins no later than 1 January 2044. SVIKG is the largest single industrial-finance instrument launched by an EU member state in the post-2022 industrial-policy cycle.

Commission Delegated Regulation (EU) 2025/2003, adopted by the European Commission on 8 September 2025, published in the Official Journal on 14 November 2025 and entering into force on 15 November 2025, amends Annex I of Regulation (EU) 2021/821 to implement the 2024 multilateral decisions of the Wassenaar Arrangement, MTCR, Australia Group, and NSG. The most extensive EU semiconductor-equipment additions since the 2021 framework took effect: ALD, epitaxial deposition, lithography, EUV pellicles/masks/reticles, SEM, and etching equipment, plus tighter controls on quantum computers, advanced FPGAs/ICs for AI training, additive-manufacturing, and cryogenic/superconducting components. The regulation is the EU-side update layer of the Western dual-use export control architecture, structurally aligned with the US BIS advanced- computing/SME packages and the Netherlands DUV-licensing regime.

The 22nd Regulation Amending the Foreign Trade and Payments Ordinance (Zweiundzwanzigste Verordnung zur Änderung der Außenwirtschaftsverordnung), promulgated in Bundesgesetzblatt I 2025 Nr. 261 and entering into force on 1 November 2025, updates Germany's national export-control list (Ausfuhrliste, Annex AL to the AWV) to align with the 2024-cycle decisions of the Wassenaar Arrangement, MTCR, Australia Group, and NSG. It is the German national implementation layer that parallels Commission Delegated Regulation (EU) 2025/2003 — both ingest the same multilateral consensus into the EU+DE dual-use perimeter covering ALD, epitaxial deposition, lithography (EUV pellicles/masks/reticles), SEM and etching equipment, quantum computers, cryogenic components, advanced FPGAs/ICs for AI training, and additive-manufacturing systems. Sets the export-list baseline against which BAFA licence determinations from November 2025 onward are made. Distinct from the parallel AWG Implementing Act (entered into force 2026-02-06) which transposed EU Directive 2024/1226 into German sanctions criminal law.

The US Bureau of Industry and Security (BIS) amended the Export Administration Regulations to remove three foreign-owned semiconductor fabs operating in China — Intel Semiconductor (Dalian) Ltd, Samsung China Semiconductor Co. Ltd, and SK hynix Semiconductor (China) Ltd — from the Validated End-User (VEU) Authorizations list (15 CFR Part 748). BIS framed the VEU program as a "loophole" that previously allowed these fabs to receive most US-origin chipmaking equipment, software and technology license-free, a privilege no US-owned fab in China ever had. After the effective date, every restricted shipment to these fabs will require an individual export license, reviewed case-by-case under the existing 2022/2023 advanced- computing controls. The rule is published as Federal Register document 2025-16735 (90 FR 42321), Docket BIS-2025-0555, RIN 0694-AK32.

On 22 August 2025 South Korea's National R&D Program Evaluation Steering Committee, convened by MOTIE, finalized an exemption from the mandatory preliminary feasibility study (예비타당성조사 면제) for the "K-On-Device AI Semiconductor Technology Development" project, clearing the roughly KRW 689.15 billion (approx. USD 496 million) program to proceed toward FY2026 budget allocation without the standard multi-year vetting delay. The project funds full-stack development — custom AI chip design, software, and modules — across four demand-anchored industries: automotive (Hyundai Motor), IoT/home appliances (LG Electronics), machinery/robotics (Doosan Robotics, Daedong), and defense (Korea Aerospace Industries). MOTIE structured the program so end-user demand companies participated directly in project planning, pairing them with domestic fabless design and foundry manufacturing firms to build a domestic on-device AI semiconductor ecosystem, ahead of full budget confirmation and formal program launch.

On 22 August 2025 Intel and the Trump administration announced that the US government would acquire a 9.9% equity stake in Intel — 433.3 million common shares at $20.47/share, worth $8.9 billion — funded by converting $5.7 billion in remaining, undisbursed CHIPS and Science Act grants and $3.2 billion from the Department of War's Secure Enclave program into equity rather than paying them as grants. Combined with $2.2 billion already disbursed under Intel's CHIPS award, total federal support reaches $11.1 billion. 274.6 million shares transferred to Commerce at closing on 27 August 2025; the remaining 158.7 million sit in escrow pending Secure Enclave disbursement milestones. The government also received a five-year warrant for an additional 5% of Intel shares at $20/share, exercisable only if Intel's ownership of its foundry business falls below 51%.

Malaysia's Ministry of Investment, Trade and Industry, acting through the Strategic Trade Controller, issued Directive No. 1/2025 on 14 July 2025 invoking Section 12 of the Strategic Trade Act 2010 to declare high-performance US-origin AI chips (GPUs, TPUs, neural processors, AI accelerators meeting the Annex I total-processing-performance and performance-density thresholds) as "unlisted controlled items". With effect from 14 July 2025, any export, transshipment, or transit of those chips through Malaysian territory requires a Strategic Trade Permit, a 30-day prior notification, an export-control classification from the manufacturer, and a re-export licence from the originating country. The directive is the formal Malaysian response to US scrutiny over alleged Nvidia AI-chip flows to China via Malaysian freight forwarders and data-centre operators, and it remains binding even after the US relaxes its own export rules.

H.R.1, the "One Big Beautiful Bill Act" (Public Law 119-21), was signed into law by President Trump on 4 July 2025. The budget-reconciliation statute is the single largest reversal of the 2022 Inflation Reduction Act (IRA) industrial-policy framework: it accelerates the termination of IRA-era clean- energy tax credits and overlays a new "Foreign Entity of Concern" (FEOC) / "Prohibited Foreign Entity" (PFE) regime on the credits that survive. The §25E used-EV credit, the §30D new clean-vehicle credit, the §45W commercial clean-vehicle credit, and the §30C alternative-fuel-refueling-property credit terminate for vehicles or property placed in service after 30 September 2025. The §25C energy-efficient home improvement credit and the §25D residential clean-energy credit terminate for property placed in service after 31 December 2025. The §45Y clean-electricity production credit and §48E clean-electricity investment credit are eliminated for wind and solar facilities placed in service after 31 December 2027, with a safe harbour for projects whose construction begins on or before 4 July 2026. From 1 January 2026, projects beginning construction must satisfy "material assistance" thresholds limiting the share of components, subcomponents and critical minerals sourced from prohibited foreign entities (PRC, Russia, Iran, DPRK and entities controlled by them). For §45Y/§48E facilities the threshold starts at 40% non-PFE content in 2026 and steps up by 5 percentage points per year through 2030; for §45X advanced manufacturing PTC the analogous schedule begins at 50% in 2026 and rises through the decade. CBO scored the package's energy-credit terminations as generating roughly USD 280bn of revenue (gross), of which USD 77.4bn from §25D termination, USD 21.2bn from §25C, USD 77.8bn from §30D, USD 104.5bn from §45W, and USD 2bn from §30C, partially offsetting the bill's other tax cuts. The bill simultaneously re-authorises and broadens the §48D advanced manufacturing investment tax credit for semiconductor fabs, raising the credit rate from 25% to 35% for property placed in service after 31 December 2025 (preserving the CHIPS Act-aligned semiconductor leg of the IRA-era stack). The OBBBA therefore reshapes the IRA from a broad-based clean-energy + EV + manufacturing pull-through into a narrower, China-decoupling industrial policy concentrated on semiconductors and (residually) §45X battery / critical- mineral processing.

Taiwan's Ministry of Economic Affairs International Trade Administration (MOEA-ITA) amended the Strategic High-Tech Commodities (SHTC) export-control Entity List on 10 June 2025 (announced 15 June 2025) under Article 13 of the Trade Act, adding 601 new entities — including Huawei Technologies Co. Ltd. and Semiconductor Manufacturing International Corp. (SMIC) plus 599 additional entities domiciled in China, Russia, Iran, Pakistan and Myanmar. Taiwanese exporters (TSMC, UMC, ASE, KYEC and downstream suppliers) must obtain pre-export government licences for direct or third-party shipments of any SHTC-listed item to the listed entities; the action expands Taiwan's total entity-list population to ~10,844 entities. Two follow-on amendments tightened the regime further: a +279-entity expansion on 18 September 2025 and an 18-item commodity-list expansion on 18 November 2025 covering advanced 3D printers, semiconductor manufacturing equipment, electron microscopes and quantum-computing hardware.

On 27 May 2025 the People's Government Office of Xiaoshan District, Hangzhou (Zhejiang Province) issued Xiao Zhengbanfa [2025] No. 22, "Several Policies to Promote the High-Quality Development of the Integrated Circuit Industry," published 30 May 2025. The notice establishes a district-level subsidy stack covering EDA design, IC design, manufacturing, packaging and testing, and equipment/materials firms operating in Xiaoshan District. Headline instruments include R&D subsidies for enterprises investing over CNY 50m (with a lower CNY 10m tier) in key IC materials and core equipment with realized sales, a wafer tape-out subsidy capped at CNY 20m per enterprise per year, public innovation-platform purchase subsidies of up to CNY 500k, "chip-mould linkage" support up to CNY 3m, and talent-support measures including housing subsidies for IC industry personnel.

On 10–11 May 2025 in Geneva, US Treasury Secretary Scott Bessent and USTR Jamieson Greer met with PRC Vice Premier He Lifeng and on 12 May 2025 issued the "Joint Statement on US-China Economic and Trade Meeting in Geneva," producing the first bilateral de-escalation of the post-2 April 2025 reciprocal-tariff stand-off. The agreement was implemented on the US side via Executive Order 14298 of 12 May 2025 ("Modifying Reciprocal Tariff Rates To Reflect Discussions With the People's Republic of China," published in the Federal Register 21 May 2025 as 90 FR 21831 / 2025-09297) and on the Chinese side via State Council Tariff Commission Announcement No. 4 of 2025. Effective 12:01 a.m. EDT on 14 May 2025, both sides suspended for 90 days (through 12 August 2025) the 24 percentage points of additional ad valorem duty layered on top of the prior 10% reciprocal rate, while the 10% reciprocal rate itself was retained. On the US side this reduced the headline reciprocal-tariff burden on PRC-origin goods from a 125% scheduled rate (under EOs 14259 and 14266) to 10%; combined with the still-in-force 20% IEEPA-fentanyl tariff under Executive Order 14195 (separately filed: `2025-02-01-us-trump-fentanyl-tariffs-canada-mexico-china`), the effective additional rate on most Chinese imports came down to ~30%. China made a parallel 24pp suspension on US-origin goods (from a 125% retaliatory rate to 10%) and additionally suspended non-tariff countermeasures imposed since 2 April 2025 (export controls, unreliable-entity designations, MOFCOM probes). The truce is structurally a calibrated freeze of the reciprocal-tariff ladder under the April 2025 regime, not a repeal: the underlying EO 14257 / IEEPA framework remains intact and was scheduled to re-engage at the 24pp escalated rate on 12 August 2025 absent further extension. The Geneva agreement is the precursor to the August 2025 Stockholm extension and the October 2025 Busan Economic and Trade Arrangement (separately filed: `2025-10-30-us-china-busan-economic-trade-arrangement`).

The Legislative Yuan of Taiwan (ROC) passed amendments to Article 22 of the Statute for Industrial Innovation (產業創新條例) and added a new Article 67-3 on third reading on 18 April 2025, promulgated by Presidential Decree on 7 May 2025. The package establishes for the first time a Taiwanese OUTBOUND-investment screening regime under the Statute: outbound investments by Taiwanese entities meeting the amount threshold (NTD 1.5bn, or lower as determined) OR involving designated countries/regions OR specific industries or technologies must obtain prior approval from the Ministry of Economic Affairs (MOEA) before implementation. The competent authority may deny approval (in whole or in part) or impose conditional approval where particular circumstances are identified — including risks to national security, harm to economic development or supply-chain resilience, conflict with international treaties, or violation of labour-standards law. The new Article 67-3 establishes enforcement penalties ranging from NTD 50,000 to NTD 1,000,000 for initial non-compliance violations and NTD 500,000 to NTD 10,000,000 per violation for failure to comply with conditions, restrictions, or undertakings imposed by MOEA under Article 22 Paragraph 3. Effective dates of implementing provisions are to be determined by Executive Yuan secondary legislation; the package is structurally novel for Taiwan — the first horizontal outbound-investment-security instrument and the structural parallel to the US Treasury Final Rule on Outbound Investment in Countries of Concern (28 October 2024 / effective 2 January 2025), the EU Commission Recommendation 2025/63, and Korea's MOTIE NCT regime.

Japan's Ministry of Economy, Trade and Industry (METI) overhauled the catch-all export-control framework under the Foreign Exchange and Foreign Trade Act (FEFTA) — the first comprehensive review of Japan's catch-all controls in 12 years (since 2013). Cabinet decisions were taken on 25 March 2025 and 4 April 2025 with METI's consolidated announcement on 9 April 2025; the amended Cabinet Order entered into force on 9 October 2025. The reform (i) splits catch-all-controlled items into "core items" (high dual-use risk, including certain semiconductors and machine tools) and a general catch-all tier, (ii) adds a new end-user requirement alongside the existing end-use requirement and extends both from UN-arms-embargo countries only to "general countries" (everywhere outside Group A), materially expanding the perimeter of items requiring METI export licences for general-country end-users including China, and (iii) introduces an "informed" condition for exports to Group A countries — once METI notifies an exporter of a defined risk pattern, a Group A export becomes licence-required, addressing transit-export-circumvention to Russia. Structurally distinct from the 23-category equipment-specific 2023 amendment (2023-03-31-japan-meti-semi-equipment-export-controls); this is the underlying horizontal catch-all reform and brings Japan's framework closer to US BIS EAR catch-all controls.

The US Bureau of Industry and Security amended the Export Administration Regulations to add 12 entities to the Entity List under the destinations of China (11) and Taiwan (1) via Final Rule 2025-05427 (90 FR 14046), companion to the larger 70-entity rule (2025-05426) published the same day. Targets fall in three clusters: (i) Beijing Academy of Artificial Intelligence and Beijing Innovation Wisdom Technology — added for acquiring US-origin items in support of China's military modernization, specifically developing large AI models and advanced computing chips for defense; (ii) the Inspur group — Inspur (Beijing) Electronic Information Industry, Inspur Electronic Information Industry, Inspur Electronic Information (Hong Kong), Inspur (HK) Electronics, Inspur Software, and Inspur Taiwan — added as subsidiaries contributing to supercomputers for military end use; and (iii) Henan Dingxin, Nettrix Information Industry, Suma Technology, and Suma-USI Electronics — added for involvement in the development of Chinese exascale supercomputers. License requirements are for all items subject to the EAR; review policy is presumption of denial for the AI cluster and policy of denial for the supercomputer clusters.

South Korea's National Assembly passed the Special Act on the Expansion of the National Electricity Network (Law No. 20844) on 19 February 2025 as part of the bipartisan "Energy Trifecta Bill," with promulgation on 25 March 2025 and entry into force on 26 September 2025. The act creates an expedited siting, permitting, and compensation framework for trunk transmission-grid construction, consolidating 35 previously separate regulatory approvals into a single streamlined procedure and targeting a >30% reduction in grid-build timelines. It directly addresses the electricity-infrastructure bottleneck constraining semiconductor fab clusters (Yongin, Pyeongtaek, SK Hynix HBM), sovereign AI datacenter build-out, and EV/battery gigafactory load growth — structurally distinct from the K-Chips Act (fiscal incentives) and the Semiconductor Special Act (regulatory framework), as it unblocks the physical power-delivery constraint those programmes depend on.

South Korea's Ministry of Science and ICT (MSIT) committed in its 2025 Work Plan to establish a National AI Computing Center via public-private partnership (PPP), with an anchor envelope of KRW 2 trillion rising to KRW 4 trillion through 2030. In July 2025 MSIT executed the first major tranche: KRW 1.46 trillion (approx. USD 1.1 billion) to procure approximately 13,000 high-performance GPUs (NVIDIA B200 and H200) distributed across three domestic cloud operators — Naver Cloud, NHN Cloud, and Kakao. This is Korea's first PPP-structured sovereign-AI compute procurement instrument, structurally distinct from the AI Basic Act (horizontal regulatory framework) and the Semiconductor Special Act (fab investment incentives), as it directly addresses the compute- infrastructure supply constraint for AI model training and national AI research.