Industrial Policy & Trade Monitor· 2666 actions· ✨ 90 recent

The Philippine Semiconductor and Electronics Industry (PSEI) Roadmap 2026–2030 was presented at the 4th SEIAC meeting at Malacañang on 23 March 2026 by BOI Executive Director Ma. Corazon Halili-Dichosa and formally rolled out by DTI in April 2026. The Roadmap targets $110 billion in annual exports by 2030 ($70B semiconductors + $40B electronics, approximately doubling the current ~$50B baseline) via value-chain ascent from assembly-test-packaging through IC design toward front-end wafer fabrication, supported by 128,000-worker upskilling over five years and up to three national laboratories in fabrication, R&D, and talent development.

On 19 March 2026 the German Federal Ministry for Economic Affairs and Energy (BMWE) announced the selection of 38 German projects across 12 federal Länder for the IPCEI Advanced Semiconductor Technologies (IPCEI AST) — the next Important Project of Common European Interest on semiconductors under EU State Aid Article 107(3)(b) TFEU. The federal commitment is EUR 3 billion drawn from the Sondervermögen Infrastruktur und Klimaneutralität (SVIK), the EUR 100 bn special-purpose vehicle enacted via SVIKG in September 2025. The 38 selected projects span AI chips and chiplets, photonic integrated circuits, advanced manufacturing equipment, sensor technologies, and power electronics, with approximately one-third being startups and SMEs. The measure operationalises Germany's Microelectronics Strategy (October 2025) at the project-funding layer and is the first major SVIK semiconductor-tranche deployment.

Taiwan's Legislative Yuan passed the Artificial Intelligence Basic Act (人工智慧基本法) on third reading on 23 December 2025, and President Lai Ching-te promulgated the 20-article statute on 14 January 2026, bringing it into force immediately. The Act designates the National Science and Technology Council (NSTC) as the central AI-policy competent authority and codifies seven governance principles — sustainability and well-being, human autonomy, privacy protection and data governance, cybersecurity and safety, transparency and explainability, fairness and non-discrimination, and accountability — that apply to all public-sector AI procurement and high-risk sectoral applications. The statute establishes a statutory foundation for the Taiwan AI Action Plan 2.0, mandates an Executive Yuan National AI Strategy Committee, and provides authority for sector-specific implementing regulations by FSC, NCC, MOHW, and MOTC across finance, telecoms, medical, and autonomous-vehicle AI within a two-year window. As the first national AI governance statute in the Greater China region and the third globally after the EU AI Act and South Korea's AI Basic Act, it frames regulatory expectations for the companies at the heart of the global AI hardware supply chain — TSMC, NVIDIA ODM partners, and advanced-packaging incumbents — that are headquartered or operate substantially in Taiwan.

The Canadian federal government announced a Strategic Response Fund contribution of up to CAD 210 million (~USD 151 million) toward a CAD 662 million project to expand semiconductor advanced-packaging and R&D commercialisation capacity at IBM Canada's Bromont, Quebec facility and the MiQro Innovation Collaborative Centre (C2MI). The federal contribution covers roughly one-third of total project cost. Ministers Mélanie Joly (Industry) and Evan Solomon (AI and Digital Innovation) announced the investment on 2025-11-28, framing it around domestic supply-chain resilience for AI/HPC, aerospace and defence, telecommunications, and automotive end-markets. The project is projected to create 75 new highly-skilled jobs and sustain over 1,000 existing jobs in the Bromont region.

The Union Cabinet chaired by Prime Minister Narendra Modi approved on 12 August 2025 four new semiconductor manufacturing units under the India Semiconductor Mission (ISM) Phase 1: SiCSem Private Limited (Silicon Carbide compound-semiconductor fab, Odisha, with UK partner Clas-SiC Wafer Fab Ltd.), 3D Glass Solutions Inc. (advanced glass-substrate packaging, Odisha), Continental Device India Private Limited / CDIL (discrete power-semiconductor expansion, Punjab), and Advanced System in Package Technologies / ASIP (OSAT unit with South Korea's APACT Co. Ltd, Andhra Pradesh). Cumulative investment INR 4,600 crore (~USD 525mn); 2,034 skilled jobs at full ramp. This brought total approved ISM Phase 1 projects to 10 across 6 states, with cumulative committed investment of approximately INR 1.60 lakh crore (~USD 18bn).

METI certified a Supply Security Plan (供給確保計画) filed by Nitto Boseki Co., Ltd. under Japan's Economic Security Promotion Act, designating low-thermal-expansion glass cloth for cutting-edge logic IC packaging substrates as a "specified critical good" material input. The certification (plan no. 2025-semicon-3-1, approved 7 August 2025) qualifies Nitto Boseki for a grant of up to JPY 2.4 billion (~USD 16 million) toward a JPY 7.2 billion new production line at its Fukushima No. 2 plant, targeting a roughly 200% increase in domestic capacity for this glass-cloth grade with supply starting July 2027 and a committed 10-year production run.

METI certified a Supply Security Plan (供給確保計画) filed by DIC Corporation under Japan's Economic Security Promotion Act, designating epoxy resin used in semiconductor packaging/encapsulation as a "specified critical good" material input. The certification (plan no. 2025-semicon-2-1, approved 31 July 2025) qualifies DIC for a grant of up to JPY 3 billion (~USD 20.1 million) toward a new epoxy-resin plant at its Chiba (Ichihara) factory, targeting roughly a 59% increase in domestic production capacity for semiconductor-grade epoxy resin, with supply starting July 2029.

The Legislative Yuan of Taiwan (ROC) passed amendments to Article 22 of the Statute for Industrial Innovation (產業創新條例) and added a new Article 67-3 on third reading on 18 April 2025, promulgated by Presidential Decree on 7 May 2025. The package establishes for the first time a Taiwanese OUTBOUND-investment screening regime under the Statute: outbound investments by Taiwanese entities meeting the amount threshold (NTD 1.5bn, or lower as determined) OR involving designated countries/regions OR specific industries or technologies must obtain prior approval from the Ministry of Economic Affairs (MOEA) before implementation. The competent authority may deny approval (in whole or in part) or impose conditional approval where particular circumstances are identified — including risks to national security, harm to economic development or supply-chain resilience, conflict with international treaties, or violation of labour-standards law. The new Article 67-3 establishes enforcement penalties ranging from NTD 50,000 to NTD 1,000,000 for initial non-compliance violations and NTD 500,000 to NTD 10,000,000 per violation for failure to comply with conditions, restrictions, or undertakings imposed by MOEA under Article 22 Paragraph 3. Effective dates of implementing provisions are to be determined by Executive Yuan secondary legislation; the package is structurally novel for Taiwan — the first horizontal outbound-investment-security instrument and the structural parallel to the US Treasury Final Rule on Outbound Investment in Countries of Concern (28 October 2024 / effective 2 January 2025), the EU Commission Recommendation 2025/63, and Korea's MOTIE NCT regime.

President Ferdinand R. Marcos Jr. signed Administrative Order No. 31 s. 2025 on 28 March 2025, establishing the Semiconductor and Electronics Industry Advisory Council (SEIAC) as the President's primary advisory body on semiconductor and electronics industry development, promotion, and competitiveness. The SEIAC is chaired by the Special Assistant to the President for Investment and Economic Affairs, with the DTI Secretary as Vice-Chair, and mandates the Council to provide strategic guidance for implementing the Philippine Semiconductor and Electronics Industry (PSEI) Roadmap, coordinate inter-agency interventions across the value chain, and recommend legislative measures for sectoral competitiveness.

Prime Minister Anwar Ibrahim launched Malaysia's National Semiconductor Strategy (NSS) on 28 May 2024 in his keynote at SEMICON Southeast Asia, with implementation led by MITI. The NSS commits at least RM25 billion (~USD 5.3 billion) in fiscal support over a ten-year horizon and structures the chip industrial policy in three sequential phases: (1) shoring up Malaysia's existing strength in outsourced semiconductor assembly and test (OSAT) and back-end packaging, (2) moving domestic firms into integrated-circuit (IC) design, advanced packaging and advanced manufacturing equipment, and (3) developing Malaysian-owned global champions across the chip value chain under a "Made by Malaysia" framing. Headline targets include developing 10 local design and advanced- packaging companies with revenues between RM1 billion and RM4.7 billion, 100 broader semiconductor-related companies near the RM1 billion revenue mark, and training 60,000 high- skilled engineers. The RM25 billion envelope decomposes into RM5 billion in tax forgone over five years, RM2 billion for existing capital grants, RM1.25 billion for an HRD Fund semiconductor allocation, RM2 billion for a Semiconductor Industrial Park, RM1.59 billion for an Advanced Packaging Centre, plus RM2 billion each for the National Energy Transition Facility and Green Tech Financing Scheme. By June 2025, the government reported RM70.7 billion in announced investments attracted under the NSS umbrella.

On 21 March 2024, Costa Rica's Ministerio de Comercio Exterior (COMEX) launched the Hoja de Ruta para el Fortalecimiento del Ecosistema de Semiconductores — the first national semiconductor roadmap published by any Latin American country — jointly presented with US Secretary of Commerce Gina Raimondo in the context of the CHIPS Act §103 ITSI Fund partnership. President Rodrigo Chaves Robles simultaneously signed an executive decree declaring the semiconductor industry and related industries of "interés público" (public interest) and directing COMEX to lead implementation. The roadmap is organised around four pillars: Talent (Human Talent Training Incentive programme, US$6M initial budget), Incentives (OECD BEPS Pillar Two-aligned fiscal/financial R&D incentives, Free Trade Zone regime strengthening under Law 7210), Investment Attraction (CINDE-led FDI promotion targeting ATP, advanced PCB, and design-house segments), and Regulatory Improvement (customs facilitation, IP reform, export-control alignment). Costa Rica is one of seven declared ITSI-fund partner economies and hosts Intel's largest non-US assembly and test site since 1997, alongside Applied Materials, ON Semiconductor, Coherent, MaxLinear, and Boston Scientific.