Industrial Policy & Trade Monitor· 2666 actions· ✨ 90 recent

On 19 March 2026 the German Federal Ministry for Economic Affairs and Energy (BMWE) announced the selection of 38 German projects across 12 federal Länder for the IPCEI Advanced Semiconductor Technologies (IPCEI AST) — the next Important Project of Common European Interest on semiconductors under EU State Aid Article 107(3)(b) TFEU. The federal commitment is EUR 3 billion drawn from the Sondervermögen Infrastruktur und Klimaneutralität (SVIK), the EUR 100 bn special-purpose vehicle enacted via SVIKG in September 2025. The 38 selected projects span AI chips and chiplets, photonic integrated circuits, advanced manufacturing equipment, sensor technologies, and power electronics, with approximately one-third being startups and SMEs. The measure operationalises Germany's Microelectronics Strategy (October 2025) at the project-funding layer and is the first major SVIK semiconductor-tranche deployment.

On 2026-01-15, Hong Kong's New Industrialisation Vetting Committee announced it had supported in principle an application from Oriental Materials Hong Kong Limited — a subsidiary of mainland China's Henan Oriental Materials Co. — under the New Industrialisation Acceleration Scheme (NIAS). The project will fund new production lines at Yuen Long InnoPark producing and validating front-end semiconductor manufacturing equipment (furnace systems, etching equipment, chemical vapour deposition systems). Total project investment is over HKD 800 million, with the Hong Kong government providing up to HKD 200 million (roughly one-third, per NIAS's 1:2 government:enterprise matching structure). Construction was slated to begin by end-March 2026, with production targeted around June 2027.

Taiwan's Ministry of Economic Affairs International Trade Administration (MOEA-ITA) published a draft amendment to the Strategic High-Tech Commodities (SHTC) export control lists on 18 November 2025, subject to a 60-day public-preview period, adding 18 items in three new categories — advanced 3D printing equipment (metal-powder-bed- fusion, laser-sintering, electron-beam-melting capable systems), advanced semiconductor equipment (CMOS chips, low-temperature cryogenic cooling, scanning electron microscope equipment, cryogenic wafer probers), and quantum computers (general-purpose programmable quantum computing systems). Exporters must obtain MOEA-ITA prior approval before shipment; permits will be issued only after confirming goods will not be used in weapons-of-mass-destruction programmes.

On 3 November 2025 the US Department of Commerce's CHIPS Program Office (administered via NIST) announced a non-binding preliminary letter of intent to take a $50 million equity stake in Vulcan Elements, a North Carolina-based rare-earth magnet producer. The CHIPS and Science Act funding is earmarked for equipment to separate, metallize and manufacture Neodymium Iron Boron (NdFeB) magnets, targeting up to 10,000 metric tonnes of annual domestic production capacity. Commerce framed the investment around NdFeB magnets' role in the semiconductor equipment supply chain (EUV lithography, CVD, etch and pump systems). The equity stake is conditioned on final negotiation and approval and runs alongside a separately-tracked $620 million Department of War Office of Strategic Capital loan to Vulcan Elements and ReElement Technologies announced the same day.

On 2025-09-12, Shanghai STAR Market-listed chip-equipment maker Piotech Inc. (拓荆科技, 688072.SH) disclosed a CNY 450 million (~USD 63 million) capital increase into its controlling subsidiary Piotech Jianke (Haining) Semiconductor Equipment Co., Ltd. (拓荆键科(海宁)半导体设备有限公司), which develops 3D-integration/hybrid-bonding equipment. Guotou Jixin (国投集新), a vehicle wholly owned (99.9%) by the National Integrated Circuit Industry Investment Fund Phase III ("Big Fund III"), took a 12.71% stake for roughly CNY 192 million, becoming Piotech Jianke's second-largest shareholder; Piotech's own stake fell to approximately 53.57% post-round. The round valued Piotech Jianke's pre-money equity at CNY 2.5 billion — a roughly 44x premium to its RMB 55.2 million book net-asset value as of 2024-12-31 — reflecting Big Fund III's first disclosed equity deployment since its 2024-05-24 establishment.

Commission Delegated Regulation (EU) 2025/2003, adopted by the European Commission on 8 September 2025, published in the Official Journal on 14 November 2025 and entering into force on 15 November 2025, amends Annex I of Regulation (EU) 2021/821 to implement the 2024 multilateral decisions of the Wassenaar Arrangement, MTCR, Australia Group, and NSG. The most extensive EU semiconductor-equipment additions since the 2021 framework took effect: ALD, epitaxial deposition, lithography, EUV pellicles/masks/reticles, SEM, and etching equipment, plus tighter controls on quantum computers, advanced FPGAs/ICs for AI training, additive-manufacturing, and cryogenic/superconducting components. The regulation is the EU-side update layer of the Western dual-use export control architecture, structurally aligned with the US BIS advanced- computing/SME packages and the Netherlands DUV-licensing regime.

On 10 October 2024 the Czech government approved the National Semiconductor Strategy, prepared by the Ministry of Industry and Trade (MPO). The strategy sets five objectives to be reached by end-2029: a 300% increase in semiconductor sector sales versus 2022, a 300% increase in semiconductor component production versus 2022, a 200% increase in exports of semiconductor technologies, growth of the specialist workforce to 9,000 experts, and the build-out of a national competence centre. The strategy is positioned as the Czech implementation track for the EU Chips Act and identifies power electronics, integrated-circuit design and semiconductor manufacturing equipment as the country's competitive niches.

China registered the National Integrated Circuit Industry Investment Fund III Co., Ltd. ("Big Fund III") in Beijing on 24 May 2024 with RMB 344 billion (~USD 47.5 billion) of registered capital — the largest single capital raise of the three Big Fund phases (Phase I 2014: RMB 138.7bn; Phase II 2019: RMB 204bn). Nineteen state-owned investors contribute, led by the Ministry of Finance (17% / RMB 60bn) and the six largest state-owned commercial banks (ICBC, ABC, BoC, CCB ~6.25% each at RMB 21.5bn; BoCom RMB 20bn; PSBC RMB 8bn). Duration 15 years (24 May 2024 → 23 May 2039). The fund explicitly targets the chokepoints exposed by US BIS October 2022/2023/2024 controls — semiconductor manufacturing equipment, advanced memory (HBM/DRAM), AI accelerators, and third-generation compound semiconductors (SiC, GaN).

Canada made SOR/2024-32, Regulations Amending the Special Economic Measures (Russia) Regulations, registered and effective 2024-02-21 on the second anniversary of Russia's invasion of Ukraine. The regulations add 163 persons to Schedule 1 — 10 individuals and 153 entities, predominantly Russian organizations tied to military-industrial production, logistics, insurance and oil-sector support — triggering Canadian dealing/asset bans. A parallel amendment to Schedule 7 adds five new goods categories under the Harmonized System (explosives and pyrotechnics; data-processing units and components; ball and roller bearings; semiconductor manufacturing equipment; optical and navigational instruments), banning their export to Russia or Russian persons.