Industrial Policy & Trade Monitor· 2666 actions· ✨ 90 recent

On 3 June 2026 the European Commission adopted a legislative proposal to amend and substantially expand the EU Chips Act (Regulation (EU) 2023/1781), as part of the European Technological Sovereignty Package. The proposal raises the mobilisation target from €43bn to €120bn, introduces new demand-side "Demand Accelerators" to aggregate public procurement, expands "Grand Challenges" to cover AI-optimised chips, caps permitting at 12 months, and widens the Strategic Partnerships on Semiconductors framework. As a Commission legislative proposal it now enters co-decision (European Parliament + Council) before becoming law; the 2023 regulation remains in force during this process.

The European Commission (DG COMP) approved on 20 May 2026 two German State aid measures under the European Chips Act first-pillar 'first-of-a-kind' framework and Article 107(3)(c) TFEU, totalling €288 million. A €222 million grant supports Carl Zeiss SMT GmbH's HNA@SCALE project in Oberkochen (Baden-Württemberg) to industrialise the next generation of High-NA EUV optical columns — the lithography-optic sub-systems integrated by ASML into its High-NA EUV scanners and critical to 2nm-and-below node manufacturing globally. A separate €66 million grant supports Zadient Materials Europe GmbH's SiC-Pro project in Bitterfeld (Saxony-Anhalt) to construct a first-of-a-kind ultra-pure silicon carbide (SiC) source-material manufacturing facility, addressing upstream SiC supply-chain dependence on China (which produces ~80% of global SiC). Both facilities carry cross-border spillover commitments under Chips Act pillar 1.

On 1 February 2026 Finance Minister Nirmala Sitharaman, presenting the Union Budget 2026-27, announced the launch of India Semiconductor Mission (ISM) 2.0 — the second-phase national semiconductor industrial-policy framework succeeding ISM 1.0 (2021, INR 76,000 crore). The Budget makes an initial INR 1,000 crore provision for ISM 2.0 in FY 2026-27 and raises the Electronics Components Manufacturing Scheme (ECMS) outlay from INR 22,919 crore to INR 40,000 crore. ISM 2.0's distinct architecture centres on four strategic priorities not in ISM 1.0: (i) indigenous semiconductor equipment, chemicals, gases and materials production, (ii) full-stack Indian semiconductor IP design, (iii) industry-led R&D and skills/training centres, and (iv) domestic and global supply-chain integration. Total mission outlay reported as approximately INR 1-1.2 lakh crore (~USD 12-14bn) is being finalised; Cabinet clearance and the formal scheme launch are expected by mid-2026.

On 11 December 2025 the Council of the EU presidency, the European Parliament, and the European Commission reached provisional political (trilogue) agreement on the revision of Regulation (EU) 2019/452 establishing a framework for the screening of foreign direct investments into the Union, concluding interinstitutional negotiations on the Commission's proposal of 24 January 2024. The revised regime upgrades the 2019 cooperation-mechanism-only framework into a hybrid harmonised/mandatory regime: all 27 Member States must establish FDI screening mechanisms (replacing the current patchwork in which some Member States have no mechanism at all); mandatory minimum sectoral scope is set EU-wide and covers dual-use items, military equipment, hyper-critical technologies (general-purpose AI with space/defence relevance, quantum technologies, semiconductors), critical raw materials, critical entities in energy/transport/digital infrastructure, electoral infrastructure, and certain financial-system entities; foreign investments routed through EU subsidiaries fall within the perimeter; a shared database prevents Member-State arbitrage; and an optional single electronic-filing portal becomes available if requested by at least nine Member States. Screening decisions remain the exclusive responsibility of the Member State in which the investment is made. Once the Regulation enters into force (after Council and Parliament formal adoption and OJ publication, both pending as of the political-agreement date), the new rules will apply after an 18-month transition period — implementation expected toward the end of 2027.

India's Directorate General of Foreign Trade (DGFT) issued Notification No. 31/2025-26 on 23 September 2025, revising Appendix-3 of Schedule-II of the ITC(HS) Export Policy to add a new Category 7 — "Certain Emerging Technologies and related items" — to the SCOMET (Special Chemicals, Organisms, Materials, Equipment and Technologies) list. Category 7 brings under export-licence control: quantum-computing systems (≥34 qubits with controlled error rates), cryogenic CMOS integrated circuits, advanced lithography tools (≤45 nm minimum resolvable feature), additive-manufacturing equipment under vacuum, and related software/technology. The notification took effect 30 days from issuance, on 23 October 2025, and is the first new SCOMET category created since the list's last major restructure, aligning India's strategic-trade-control regime with parallel US BIS, Wassenaar Arrangement, and EU dual-use list updates.

Commission Delegated Regulation (EU) 2025/2003, adopted by the European Commission on 8 September 2025, published in the Official Journal on 14 November 2025 and entering into force on 15 November 2025, amends Annex I of Regulation (EU) 2021/821 to implement the 2024 multilateral decisions of the Wassenaar Arrangement, MTCR, Australia Group, and NSG. The most extensive EU semiconductor-equipment additions since the 2021 framework took effect: ALD, epitaxial deposition, lithography, EUV pellicles/masks/reticles, SEM, and etching equipment, plus tighter controls on quantum computers, advanced FPGAs/ICs for AI training, additive-manufacturing, and cryogenic/superconducting components. The regulation is the EU-side update layer of the Western dual-use export control architecture, structurally aligned with the US BIS advanced- computing/SME packages and the Netherlands DUV-licensing regime.

The 22nd Regulation Amending the Foreign Trade and Payments Ordinance (Zweiundzwanzigste Verordnung zur Änderung der Außenwirtschaftsverordnung), promulgated in Bundesgesetzblatt I 2025 Nr. 261 and entering into force on 1 November 2025, updates Germany's national export-control list (Ausfuhrliste, Annex AL to the AWV) to align with the 2024-cycle decisions of the Wassenaar Arrangement, MTCR, Australia Group, and NSG. It is the German national implementation layer that parallels Commission Delegated Regulation (EU) 2025/2003 — both ingest the same multilateral consensus into the EU+DE dual-use perimeter covering ALD, epitaxial deposition, lithography (EUV pellicles/masks/reticles), SEM and etching equipment, quantum computers, cryogenic components, advanced FPGAs/ICs for AI training, and additive-manufacturing systems. Sets the export-list baseline against which BAFA licence determinations from November 2025 onward are made. Distinct from the parallel AWG Implementing Act (entered into force 2026-02-06) which transposed EU Directive 2024/1226 into German sanctions criminal law.

On 27 July 2025, President Trump and European Commission President Ursula von der Leyen reached political agreement at Turnberry, Scotland, on a Framework Agreement on Reciprocal, Fair and Balanced Trade. The framework was formalised in a Joint Statement published on 21 August 2025 by the White House and DG TRADE. The deal establishes a 15% all-inclusive (MFN + Section 232) US tariff ceiling on the vast majority of EU originating goods — including autos, pharmaceuticals, semiconductors, lumber, and chemicals — replacing the threatened 20-30% reciprocal tariff trajectory under EO 14257 (April 2025). Steel and aluminium are excluded from the 15% ceiling and remain at the 50% Section 232 rate pending negotiation of a quota solution. In return, the EU commits to: (i) eliminate tariffs on all US industrial goods, (ii) preferential market access for a wide range of US agricultural and seafood products, (iii) suspension of its rebalancing countermeasures under Reg 2025/778 (suspension effective 7 August 2025), (iv) expected energy offtake of $750bn (LNG, oil, nuclear) through 2028, (v) at least $40bn in US AI chip purchases, and (vi) facilitation of $600bn in additional EU corporate investment into the US through 2028. Effective from 1 September 2025, the US applies MFN-only treatment (no 15% top-up) to: aircraft and parts, generic pharmaceuticals and ingredients, chemical precursors, cork, and certain unavailable natural resources. The framework is not legally binding but anchors the bilateral architecture; it is the largest-economy ART-programme deal alongside US-UK, US-Japan, US-Korea, US-Taiwan, and US-Indonesia.

Commission Recommendation (EU) 2025/63 of 15 January 2025, published in the Official Journal on 16 January 2025 (CELEX 32025H0063), is the first EU-level instrument operationalising outbound-investment screening. It is a legally non-binding act that asks Member States to designate a Single Contact Point and competent national authorities by 15 March 2025 and to review outbound transactions by EU investors into third countries in three strategic sectors — advanced semiconductors, artificial intelligence, and quantum technologies — covering acquisitions, mergers, joint ventures, greenfield investments, asset/IP transfers, and venture-capital instruments completed since 1 January 2021. Member States must submit an interim update by 15 July 2025 and a comprehensive report on review outcomes and identified risks by 30 June 2026, feeding into the EU's broader Economic Security Strategy and the binding outbound-investment legislative instrument the Commission has signalled for 2026-2027.

The Netherlands extended its national export-control measure under the Besluit Strategische Goederen to a new equipment class: specific optical and e-beam measuring and inspection systems used in advanced semiconductor production (capable of detecting defects at 21 nm and below). A national licence issued by the Dutch government (CDIU / BUZA / EZ joint approval) is now required for exports to all destinations outside the EU. The measure was announced by Minister Klever in the Government Gazette on 15 January 2025 and took effect 1 April 2025, directly affecting ASML's Hermes Microvision (HMI) subsidiary and ASM International (ASMI).

The US Bureau of Industry and Security issued its largest single export-control package targeting China's semiconductor industry on 2 December 2024, with three layered measures (final rules published in the Federal Register 5 December 2024). First, controls on high-bandwidth memory (HBM) above set performance thresholds — blocking the memory architecture that is foundational to AI training. Second, additions of 24 semiconductor manufacturing equipment item types to the Commerce Control List, covering deposition, etch, ion- implant, advanced packaging, and metrology categories. Third, Entity List designations for 140+ entities, the bulk Chinese semiconductor companies + equipment makers + investment vehicles, including major Chinese fab tooling firms. The package triggered MOFCOM's same-day-following retaliation (filed: 2024-12-03-china-mofcom-ge-ga-sb-export-ban-us).

On 6 September 2024 the Dutch government announced an expansion of its national export-control measure on advanced semiconductor manufacturing equipment, bringing two additional ASML DUV immersion lithography systems — TWINSCAN NXT:1970i and NXT:1980i — under a Dutch national authorisation requirement for shipments to destinations outside the EU. The measure took effect on 7 September 2024 via a ministerial regulation published in Staatscourant 2024 no. 29008. Until this point those two older system variants were controlled extraterritorially through the US Foreign Direct Product Rule; the change transfers licensing authority from BIS to the Dutch government and aligns the Dutch national list more tightly with the perimeter set by the June-2023 measure on NXT:2000i+. ASML characterised the update as a "technical change" with no expected impact on its 2024 financials or longer-term outlook.

The US Bureau of Industry and Security issued a final rule on 5 September 2024 (effective 6 September 2024, published in the Federal Register on the same day as 89 FR 73285) establishing multilateral export controls on four categories of emerging technologies: (1) quantum computing items including quantum computers, related cryogenic / control / measurement systems, and certain quantum software; (2) gate-all-around field-effect transistor (GAAFET) production technology — the next-node semiconductor architecture beyond FinFET; (3) advanced additive-manufacturing equipment for metals + alloys; (4) certain biotech-related items added in a parallel rule on 12 September 2024. The rule operates without country exceptions for some categories, with multilateral coordination via Wassenaar + Australia Group + Nuclear Suppliers Group frameworks.

The Dutch Council of Ministers on 28 March 2024 approved Project Beethoven, a EUR 2.51 billion public-investment package for the Brainport-Eindhoven semiconductor ecosystem. The package combines EUR 1.28 billion from the Nationaal Groeifonds, EUR 450 million in additional central- government education/talent spending, and EUR 780 million in regional co-funding from the Province of Noord-Brabant and the Municipality of Eindhoven. Investment pillars cover infrastructure (mobility, road capacity on A2/A58/A67, energy-grid reinforcement), a national semiconductor-talent plan targeting 2,000 master's-programme graduates per year by 2030, 16,000+ new housing units in the Brainport region, and quality-of-life improvements. The Government stated it expects these measures to lead ASML to continue to invest and maintain its statutory and tax domicile in the Netherlands.

On 25 October 2023 the Bureau of Industry and Security published an interim final rule (88 FR 73424; FR Doc 2023-23055) making substantive revisions to the October 7 2022 advanced-computing IFR, incorporating 43 public comments covering 78 topics. The rule replaced the prior TOPS-based performance metric with a new "Total Processing Performance" (TPP) / performance-density dual-threshold structure for ECCN 3A090, splitting the control into tiers 3A090.a (full licence requirement for highest-capability datacenter AI chips) and 3A090.b (new License Exception NAC with 25-day prior notification for the intermediate tier). Geographic scope was expanded from China-and-Macau to Country Groups D:1/D:4/D:5 to block diversion via third-country intermediaries and offshore datacenters.

The US Bureau of Industry and Security issued an interim final rule on 17 October 2023 that substantially expanded the advanced-computing and semiconductor manufacturing controls first imposed in October 2022. The rule closed the performance-threshold workaround that NVIDIA had used to ship China-specific A800/H800 GPUs, replacing it with a "performance density" metric and adding a new "Notified Advanced Computing" licence category. It expanded controls on chipmaking equipment (additional ECCNs covering deposition, etch, metrology), pulled 21 additional countries (mostly Middle East / Central Asia) into a regional licensing scheme to prevent transshipment, and added 13 Chinese entities to the Entity List including AI-chip designers.

Regulation (EU) 2023/1781, published in the Official Journal on 18 September 2023 and in force from 8 October 2023, establishes the EU Chips Act: a three-pillar framework targeting 20% of global semiconductor production by 2030 (up from approximately 9% in 2022) by mobilising EUR 43bn in public and private investment. Pillar 1 (Chips for Europe Initiative, EUR 3.3bn committed from EU budget) funds R&D, pilot production lines, and design infrastructure. Pillar 2 creates a fast-track permitting regime for "Integrated Production Facilities" (IPFs) and "Open EU Foundries" (OEFs) that qualify as being in the Union's interest. Pillar 3 establishes a supply-chain monitoring mechanism and grants the Commission power to mandate priority orders from designated facilities during a declared semiconductor crisis.

The Dutch government announced on 30 June 2023 a new national export-licensing requirement covering specific advanced semiconductor manufacturing equipment, most prominently ASML's TWINSCAN NXT:2000i and subsequent DUV immersion lithography systems used at ≤14/16nm logic, advanced DRAM, and advanced 3D NAND production. Effective from 1 September 2023 via the national Strategic Goods Decree, the rule completes the trilateral US-Japan-Netherlands chip-equipment perimeter initiated by the January 2023 trilateral agreement. Although nominally country-neutral, the BIS Foreign Direct Product Rule means licences for shipments to "countries of concern" — read: China — face a presumption of denial. Subsequent guidance in 2024 expanded coverage to additional TWINSCAN NXT:1970Ci and 1980Di system variants.

The Korean National Assembly passed an amendment to the Restriction of Special Taxation Act (조세특례제한법, Act No. 19234) on 30 March 2023, promulgated 31 March 2023 and retroactive to 1 January 2023. The amendment enhanced the investment tax credit (ITC) for "national strategic technology" (국가전략기술) semiconductor facility investment: large companies receive a 15% ITC on qualifying capital expenditure (up from 8% in the December 2022 base version); small and medium enterprises receive 25%. An additional temporary 10% incremental credit applies for annual investment exceeding the prior 3-year average (effective 2023-2025). Internationally termed the "K-Chips Act," the measure directly mirrors the US CHIPS Act's 25% advanced- manufacturing investment tax credit. Principal beneficiaries are Samsung Electronics (Samsung Foundry plus DRAM/NAND capex of KRW 20-30 trillion per year) and SK Hynix (memory fabs at Icheon and Cheongju, HBM expansion). In the same session the National Assembly passed companion legislation on secondary-battery (EV) investment with equivalent credit rates. The Korean government projected annual tax savings for the semiconductor sector of approximately KRW 1-2 trillion.

The US Bureau of Industry and Security imposed broad new controls on the export of advanced computing chips, chipmaking equipment, and US-person services supporting Chinese semiconductor fabrication. The October 7 2022 rule blocked supply of GPUs above set performance thresholds (initially 600 GB/s interconnect / 4800 TOPS) to China and added end-use restrictions on manufacturing tools used in advanced (≤14/16 nm logic, ≤18 nm DRAM, ≤128-layer NAND) facilities, with a foreign direct product rule extending coverage globally.

The Spanish Council of Ministers approved on 24 May 2022 the Strategic Project for the Recovery and Economic Transformation of Microelectronics and Semiconductors (PERTE Chip) within the framework of the Plan de Recuperacion, Transformacion y Resiliencia (financed in large part by NextGenerationEU funds). The package commits a public envelope of roughly EUR 12.25bn through 2027 across four lines: scientific R&D capacity (~EUR 1.165bn), chip design including fabless companies (~EUR 1.330bn), manufacturing-plant construction including front-end below-5nm and above-5nm fabs (~EUR 9.350bn), and dynamisation of ICT/electronics manufacturing including a venture fund for semiconductor startups (~EUR 0.400bn). The Sociedad Espanola para la Transformacion Tecnologica (SETT), formally constituted by Real Decreto 676/2024 of 16 July 2024, is the operational vehicle managing more than EUR 10.75bn of the envelope.

The Wet veiligheidstoets investeringen, fusies en overnames ("Vifo Act") is the Netherlands' cross-sector statutory FDI screening regime. Adopted by the States-General on 18 May 2022 (Stb. 2022, 215) and entered into force on 1 June 2023 together with two implementing decrees (Stb. 2023, 173 — main implementing decree; Stb. 2023, 172 — decree defining the scope of "sensitive technology"), the Act establishes mandatory pre-closing notification and a security review by the Bureau Toetsing Investeringen (BTI, part of the Ministry of Economic Affairs and Climate) for transactions affecting (i) "vital providers" in critical infrastructure sectors — energy, transport, telecoms, port operators, banking infrastructure — and (ii) Dutch undertakings active in "sensitive technology", defined to include EU Reg 2021/821 Annex I dual-use items, military goods, and additional national-security technologies. The regime applies retrospectively to transactions completed after 8 September 2020. It is the foundational instrument under which the Dutch national export-control measures on ASML DUV immersion lithography (filed: 2023-06-30 and 2024-09-07) operate, and the Dutch peer of US CFIUS, EU Regulation 2019/452, the German AWG §§55-62, the French Décret 2014-479 / R. 151-1 et seq., and the UK NSI Act 2021.

Regulation (EU) 2021/821, adopted 20 May 2021 and applied from 9 September 2021, establishes the Union regime for controlling exports, brokering, technical assistance, transit, and transfer of dual-use items, repealing Regulation (EC) No 428/2009. Annex I lists controlled items implementing internationally agreed dual-use controls under the Wassenaar Arrangement, MTCR, Australia Group, NSG, and Chemical Weapons Convention. The regulation introduces a new catch-all control on cyber-surveillance technologies that could facilitate human-rights violations (Art. 5 and Annex IV), and strengthens cooperation between Member States and the European Commission, placing specific obligations on exporters. It serves as the statutory anchor for all EU export licences, every multilateral-regime transposition into EU law, and coordination mechanisms with US BIS, UK ECJU, JP METI, and KR MOTIE export-control regimes.

The Bureau of Industry and Security added 77 entities (under 78 entries) to the Entity List via a December 22, 2020 final rule (FR Doc 2020-28031). The headline designation is Semiconductor Manufacturing International Corporation (SMIC) — China's largest contract chipmaker — for activities related to military-civil fusion (MCF), with a presumption of denial applied to all items uniquely required to produce chips at advanced nodes of 10 nanometers or below. The batch also covers entities that supported PRC militarisation of artificial islands in the South China Sea and entities implicated in human rights abuses against Uyghurs and other minorities in Xinjiang.