Industrial Policy & Trade Monitor· 2662 actions· ✨ 89 recent

China's Ministry of Commerce announced on 3 December 2024 (MOFCOM Announcement No. 46 of 2024) a formal ban on dual-use exports to the United States of gallium, germanium, antimony and superhard materials including diamond and cubic boron nitride. The measure also imposed strict end-use review on graphite exports to the US, with extra scrutiny of military end-uses. It came one day after BIS issued a major export- control package on 2 December 2024 expanding controls on Chinese semiconductor equipment and adding 140 entities to the Entity List, and was framed by MOFCOM as a national- security countermeasure.

The US Bureau of Industry and Security issued its largest single export-control package targeting China's semiconductor industry on 2 December 2024, with three layered measures (final rules published in the Federal Register 5 December 2024). First, controls on high-bandwidth memory (HBM) above set performance thresholds — blocking the memory architecture that is foundational to AI training. Second, additions of 24 semiconductor manufacturing equipment item types to the Commerce Control List, covering deposition, etch, ion- implant, advanced packaging, and metrology categories. Third, Entity List designations for 140+ entities, the bulk Chinese semiconductor companies + equipment makers + investment vehicles, including major Chinese fab tooling firms. The package triggered MOFCOM's same-day-following retaliation (filed: 2024-12-03-china-mofcom-ge-ga-sb-export-ban-us).

South Korea's Ministry of Trade, Industry and Energy (MOTIE), in coordination with the Ministry of Strategy and Finance, announced on 15 November 2024 amendments to the Foreign Exchange Transactions Act and the Industrial Technology Protection Act introducing a notification + review regime for outbound investments by Korean firms in advanced semiconductor manufacturing or critical-component production in "strategic concern" jurisdictions, principally China. The regulation, effective 1 April 2025, requires Korean firms whose technology is designated as a "national core technology" (NCT) to obtain MOTIE approval before establishing or expanding overseas manufacturing facilities using that technology. The list includes Samsung's HBM, SK Hynix's DRAM/NAND advanced-node processes, and certain silicon-wafer technologies.

Premier Li Qiang signed State Council Decree No. 792 on 19 October 2024 promulgating the Regulations of the People's Republic of China on Export Controls for Dual-Use Items, with effect from 1 December 2024. The regulation, organised in six chapters and 50 articles, consolidates the previously fragmented nuclear / biological / chemical / missile dual-use control regimes into a single State Council framework operationalising the 2020 Export Control Law. It introduces a control-list / temporary-control / watchlist architecture, a statutory end-user / end-use commitment regime, transit / transhipment / re-export controls, extraterritorial reach over PRC items downstream, and explicit linkage to the Anti-Foreign Sanctions Law. On 15 November 2024 MOFCOM, MIIT, GAC and SCA jointly issued Announcement No. 51 of 2024 publishing the consolidated Dual-Use Items Export Control List with a unified five-character ECCN-style coding system, also effective 1 December 2024.

On 10 October 2024 the Czech government approved the National Semiconductor Strategy, prepared by the Ministry of Industry and Trade (MPO). The strategy sets five objectives to be reached by end-2029: a 300% increase in semiconductor sector sales versus 2022, a 300% increase in semiconductor component production versus 2022, a 200% increase in exports of semiconductor technologies, growth of the specialist workforce to 9,000 experts, and the build-out of a national competence centre. The strategy is positioned as the Czech implementation track for the EU Chips Act and identifies power electronics, integrated-circuit design and semiconductor manufacturing equipment as the country's competitive niches.

The US Bureau of Industry and Security (BIS) published an interim final rule (89 FR 80064; FR doc 2024-22587) amending the Export Administration Regulations (15 CFR 748.15) to expand the Validated End User (VEU) program with a new "Data Center VEU Authorization" pathway. The rule lets BIS pre-authorize specified data-center operators in third countries to receive advanced computing integrated circuits (ECCNs 3A090, 4A090 and related) and related technology without individual export licenses, conditional on vetted security plans, end-use monitoring, and reporting. Country Group D:5 destinations — China, Russia, Iran, Belarus, Venezuela, Cuba and 17 other arms-embargoed states — are categorically excluded. Eligible destinations include Egypt, Laos, Moldova, Oman, Pakistan, Qatar, Saudi Arabia, Turkmenistan, and the UAE — extending the US chip-equipment perimeter into a managed trusted-data-center channel for Gulf, MENA, and Central Asian AI build-out.

On 6 September 2024 the Dutch government announced an expansion of its national export-control measure on advanced semiconductor manufacturing equipment, bringing two additional ASML DUV immersion lithography systems — TWINSCAN NXT:1970i and NXT:1980i — under a Dutch national authorisation requirement for shipments to destinations outside the EU. The measure took effect on 7 September 2024 via a ministerial regulation published in Staatscourant 2024 no. 29008. Until this point those two older system variants were controlled extraterritorially through the US Foreign Direct Product Rule; the change transfers licensing authority from BIS to the Dutch government and aligns the Dutch national list more tightly with the perimeter set by the June-2023 measure on NXT:2000i+. ASML characterised the update as a "technical change" with no expected impact on its 2024 financials or longer-term outlook.

The US Bureau of Industry and Security issued a final rule on 5 September 2024 (effective 6 September 2024, published in the Federal Register on the same day as 89 FR 73285) establishing multilateral export controls on four categories of emerging technologies: (1) quantum computing items including quantum computers, related cryogenic / control / measurement systems, and certain quantum software; (2) gate-all-around field-effect transistor (GAAFET) production technology — the next-node semiconductor architecture beyond FinFET; (3) advanced additive-manufacturing equipment for metals + alloys; (4) certain biotech-related items added in a parallel rule on 12 September 2024. The rule operates without country exceptions for some categories, with multilateral coordination via Wassenaar + Australia Group + Nuclear Suppliers Group frameworks.

President Luis Abinader signed Decreto No. 324-24 on 13 June 2024, declaring the promotion, innovation, and development of the semiconductor industry in the Dominican Republic as "alta prioridad nacional" (high national priority) and directing MICM to formulate a National Strategy for the Promotion of the Semiconductor Industry (ENFIS). The decree was published in the Official Gazette on 28 June 2024, establishing a high-level inter-ministerial coordination mechanism and linking the initiative to the free-trade-zone incentive framework under Law 8-90. ENFIS was formally launched on 19 August 2025 by President Abinader and MICM Minister Víctor Bisonó at the Día Nacional de las Zonas Francas, structuring the strategy across five pillars: Industrial Development, Governance and Policy, Workforce and Human Capital, Investment Attraction, and Innovation and R&D Ecosystem.

Prime Minister Anwar Ibrahim launched Malaysia's National Semiconductor Strategy (NSS) on 28 May 2024 in his keynote at SEMICON Southeast Asia, with implementation led by MITI. The NSS commits at least RM25 billion (~USD 5.3 billion) in fiscal support over a ten-year horizon and structures the chip industrial policy in three sequential phases: (1) shoring up Malaysia's existing strength in outsourced semiconductor assembly and test (OSAT) and back-end packaging, (2) moving domestic firms into integrated-circuit (IC) design, advanced packaging and advanced manufacturing equipment, and (3) developing Malaysian-owned global champions across the chip value chain under a "Made by Malaysia" framing. Headline targets include developing 10 local design and advanced- packaging companies with revenues between RM1 billion and RM4.7 billion, 100 broader semiconductor-related companies near the RM1 billion revenue mark, and training 60,000 high- skilled engineers. The RM25 billion envelope decomposes into RM5 billion in tax forgone over five years, RM2 billion for existing capital grants, RM1.25 billion for an HRD Fund semiconductor allocation, RM2 billion for a Semiconductor Industrial Park, RM1.59 billion for an Advanced Packaging Centre, plus RM2 billion each for the National Energy Transition Facility and Green Tech Financing Scheme. By June 2025, the government reported RM70.7 billion in announced investments attracted under the NSS umbrella.

China registered the National Integrated Circuit Industry Investment Fund III Co., Ltd. ("Big Fund III") in Beijing on 24 May 2024 with RMB 344 billion (~USD 47.5 billion) of registered capital — the largest single capital raise of the three Big Fund phases (Phase I 2014: RMB 138.7bn; Phase II 2019: RMB 204bn). Nineteen state-owned investors contribute, led by the Ministry of Finance (17% / RMB 60bn) and the six largest state-owned commercial banks (ICBC, ABC, BoC, CCB ~6.25% each at RMB 21.5bn; BoCom RMB 20bn; PSBC RMB 8bn). Duration 15 years (24 May 2024 → 23 May 2039). The fund explicitly targets the chokepoints exposed by US BIS October 2022/2023/2024 controls — semiconductor manufacturing equipment, advanced memory (HBM/DRAM), AI accelerators, and third-generation compound semiconductors (SiC, GaN).

The Biden administration announced on 14 May 2024 a package of Section 301 tariff increases on Chinese imports following the four-year statutory review of the original 2018-2019 tariffs. The hikes target sectors central to the US-China industrial-policy contest: BEVs went from 25% to 100%, lithium- ion EV batteries 7.5% → 25% (with non-EV battery cells rising in 2026), battery parts 7.5% → 25%, natural graphite + magnets 0% → 25% (phased to 2026), semiconductors 25% → 50% (phased to 2025), solar cells 25% → 50%, steel + aluminum products in selected categories 0-7.5% → 25%, ship-to-shore cranes 0% → 25%, certain medical products 0-7.5% → 50%. USTR issued the final determination on 13 September 2024 with most items effective 27 September 2024.

Japan's National Diet enacted the Act on the Protection and Use of Critical Economic Security Information (重要経済安保情報の保護及び活用に関する法律, Act No. 27 of 2024) on 10 May 2024; it was promulgated on 17 May 2024 and came into full operation on 16 May 2025. The law establishes Japan's first peace-time economic-security clearance regime extending to private-sector employees. It designates "Critical Economic Security Information" (CESI) covering threat-intelligence on critical-infrastructure cyber attacks, regulatory-review information on essential infrastructure, and vulnerability data on critical-product supply chains; mandates Cabinet Office "適性評価" (suitability assessment) for cleared personnel; and imposes criminal penalties of up to five years' imprisonment for unauthorised disclosure. The CESI Act complements the 2022 Economic Security Promotion Act (ESPA), closing the information-protection gap and aligning Japan's framework with Five Eyes and EU partners for joint R&D and dual-use cooperation.

On April 4, 2024, the Bureau of Industry and Security published an interim final rule (89 FR 23876) providing corrections, clarifications, and targeted revisions to the October 2023 advanced-computing and semiconductor manufacturing equipment rules. The most substantive change splits the former License Exception NAC (Notified Advanced Computing) into two separate exceptions: NAC (retaining the 25-day prior notification requirement) and a new ACA (Advanced Computing Authorized) exception that permits certain shipments without advance notification. The rule also adds ECCN 4A090.b covering computers and assemblies containing advanced ICs, restores national-security controls to several ECCNs, and addresses various technical drafting errors from the October 2023 rules.

The Dutch Council of Ministers on 28 March 2024 approved Project Beethoven, a EUR 2.51 billion public-investment package for the Brainport-Eindhoven semiconductor ecosystem. The package combines EUR 1.28 billion from the Nationaal Groeifonds, EUR 450 million in additional central- government education/talent spending, and EUR 780 million in regional co-funding from the Province of Noord-Brabant and the Municipality of Eindhoven. Investment pillars cover infrastructure (mobility, road capacity on A2/A58/A67, energy-grid reinforcement), a national semiconductor-talent plan targeting 2,000 master's-programme graduates per year by 2030, 16,000+ new housing units in the Brainport region, and quality-of-life improvements. The Government stated it expects these measures to lead ASML to continue to invest and maintain its statutory and tax domicile in the Netherlands.

METI committed up to 732 billion yen (~US$4.86 billion) in direct subsidies for Japan Advanced Semiconductor Manufacturing K.K. (JASM) to build a second wafer fab adjacent to the first JASM facility in Kikuyo, Kumamoto Prefecture. Confirmed by METI Minister Ken Saito at the Fab 1 opening ceremony on 24 February 2024, two weeks after TSMC, Sony Semiconductor Solutions, Denso, and Toyota jointly announced the Fab 2 expansion (6 February 2024). Fab 2 will produce 6/7nm and 40nm logic for automotive, industrial, consumer, and HPC end-markets, with combined Fab 1 + Fab 2 capacity exceeding 100,000 12-inch wafers per month. Construction targets year-end 2024; operations target year-end 2027. Combined with the 476 billion yen Fab 1 grant, total JASM subsidies reach ~1.208 trillion yen, the largest single direct manufacturing subsidy in Japanese history. METI conditions require >=10 years of post-startup production and >=50% Japanese-domestic procurement of silicon wafers, materials, and components.