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The Union Cabinet chaired by Prime Minister Narendra Modi approved on 5 May 2026 two new semiconductor manufacturing units under the India Semiconductor Mission (ISM) Phase 1: Crystal Matrix Limited (CML) — India's first GaN-based compound-semiconductor and Mini/Micro-LED display fabrication facility (INR 3,068 crore, Dholera, Gujarat) and Suchi Semicon Private Limited (SSPL) — an OSAT facility for discrete semiconductors (INR 868 crore, Surat, Gujarat). Cumulative investment INR 3,936 crore (~USD 400mn); 2,230 skilled jobs at full ramp. This constitutes the 12th and final batch of ISM Phase 1 approvals, closing the first-phase envelope before ISM 2.0 (filed 2026-02-01) takes over.

President Trump signed Executive Order 14387 on 18 February 2026, invoking Section 101 of the Defense Production Act (DPA) to ensure an adequate domestic supply of elemental phosphorus and glyphosate-based herbicides. The order delegates DPA §101 priority-allocation and contract- direction authority to the Secretary of Agriculture, authorises USDA to direct the production and distribution of these inputs for national-defense purposes, and grants legal immunity to domestic producers acting in compliance with USDA directives. The EO is the first DPA invocation specifically targeting the phosphorus supply chain, reflecting the concentration of global white/yellow phosphorus production in China (~75% share) and the existence of only a single operating US producer.

On 7 January 2026 the National Semiconductor and Advanced Electronics Industry Policy Committee (the "Semiconductor Board"), chaired by Deputy Prime Minister and Minister of Finance Ekniti Nitithanprapas, endorsed the Draft National Strategy for the Development of the Semiconductor and Advanced Electronics Industry, prepared by the Board of Investment (BOI) with Roland Berger after a public hearing in October 2025. The 25-year roadmap (2026-2050) targets more than THB 2.5 trillion (~USD 79.6 billion) in investment, training of more than 230,000 highly-skilled engineers, and construction of a complete upstream-to- downstream semiconductor ecosystem with phased milestones for 2030, 2040 and 2050. The strategy prioritises five product groups where Thailand has competitive potential — Power chips, Sensors, Photonics, Analog and Discrete chips — and explicitly aims to move the country beyond OSAT (Outsourced Semiconductor Assembly and Test) into IC design and upstream wafer fabrication ("Made-in-Thailand chips"). Implementation runs through a five-pillar BOI support mechanism: long-term low-interest financing and grants, human-capital development, technology upgrade of the Microelectronics Technology Centre (TMEC), specialised industrial clusters with guaranteed renewable-energy and water security, and streamlined regulatory approvals including a new BOI "FastPass" fast-track facility (16 pilot projects worth THB 170 billion already processed).

On December 9, 2025 in Niamey, Niger's state uranium company TNUC and Uranium One Group JSC (a Rosatom State Corporation subsidiary) signed a Memorandum of Cooperation to jointly obtain permits for new uranium deposits, conduct geological exploration of prospective sites, and establish new uranium mining operations in Niger. The agreement completes Niger's post-coup pivot from French-controlled uranium channels (Orano/SOMAÏR expelled 2024–2025) to Russian-aligned supply, routing future NE yellowcake production through the Rosatom global enrichment network. A companion Rosatom–Niger MoU on peaceful nuclear energy cooperation (NPP feasibility and reactor construction) was signed in the same period.

The Union Cabinet chaired by Prime Minister Narendra Modi approved on 12 August 2025 four new semiconductor manufacturing units under the India Semiconductor Mission (ISM) Phase 1: SiCSem Private Limited (Silicon Carbide compound-semiconductor fab, Odisha, with UK partner Clas-SiC Wafer Fab Ltd.), 3D Glass Solutions Inc. (advanced glass-substrate packaging, Odisha), Continental Device India Private Limited / CDIL (discrete power-semiconductor expansion, Punjab), and Advanced System in Package Technologies / ASIP (OSAT unit with South Korea's APACT Co. Ltd, Andhra Pradesh). Cumulative investment INR 4,600 crore (~USD 525mn); 2,034 skilled jobs at full ramp. This brought total approved ISM Phase 1 projects to 10 across 6 states, with cumulative committed investment of approximately INR 1.60 lakh crore (~USD 18bn).

On 8 August 2025, Ukraine's President signed Decree No. 595/2025, enacting an NSDC decision "On the Application of Personal Special Economic and Other Restrictive Measures (Sanctions)" against Russian state nuclear corporation Rosatom and its international corporate network. Sanctions were applied to 18 individuals and 17 legal entities identified as involved in attempts to integrate the occupied Zaporizhzhia Nuclear Power Plant into Russia's grid, participation in the seizure of the Chornobyl NPP, production and servicing of dual-use nuclear equipment, and export of enriched uranium through Rosatom subsidiaries registered in Switzerland, Cyprus, the Netherlands, and Finland. Named entities include Uranium One Holding N.V. (Netherlands), Rosatom Finance Ltd (Cyprus), and JSC Kirov-Energomash (Russia).

The Union Cabinet, chaired by Prime Minister Narendra Modi, approved the establishment of a sixth semiconductor unit under the India Semiconductor Mission (ISM) on 14 May 2025. The unit is a joint venture between HCL and Foxconn (Hon Hai) and will build an Outsourced Semiconductor Assembly and Test (OSAT) plant near Jewar airport in the Yamuna Expressway Industrial Development Authority (YEIDA) area of Uttar Pradesh, manufacturing display driver chips for mobile phones, laptops, automobiles, PCs and other display-equipped devices. The approved investment is INR 3,700 crore (~USD 435 million), with designed capacity of 20,000 wafers per month and output of 36 million units per month.

BIS published an interim final rule (FR Doc 2025-00711, 90 FR 4544-publication slot; companion to the AI Diffusion Framework signed three days earlier) revising the EAR to add explicit due-diligence procedures for advanced computing integrated circuits captured by ECCN 3A090. The rule (i) creates an Authorized IC Designer / Approved IC Packager regime so that foundries and OSATs can identify trustworthy customers via lists maintained by BIS, (ii) imposes new front-end-fabricator reporting requirements for any 3A090.a IC produced for an authorized IC designer to give the US government supply-chain visibility, and (iii) adjusts the scope of covered advanced-computing items. Effective 16 January 2025; compliance required from 31 January 2025; comment period extended to 14 March 2025. The rule was immediately followed by the 16 January Entity List additions (Sophgo et al.) targeting circumvention paths and was technically amended on 14 February 2025 to narrow the RS license requirement to ECCN 3A090.a only.

Yacimientos de Litio Bolivianos (YLB), Bolivia's state lithium SOE, signed a contract in September 2024 with Uranium One Group — a subsidiary of Russia's Rosatom state nuclear corporation — for the design, construction, and initial operation of an industrial direct-lithium-extraction (DLE) carbonation plant at Salar de Uyuni, with initial capacity of 14,000 t/yr lithium carbonate (expandable to 25,000–45,000 t/yr), representing a total investment exceeding USD 970 million and a 51%/49% profit-split in Bolivia's favour. The contract was approved by Bolivia's Comisión de Economía Plural in February 2025 amid corruption allegations, then suspended by parliamentary motion on 14 February 2025; a Bolivian court issued a further precautionary suspension order on 27 May 2025 on human-rights, environmental, and Mother Earth rights grounds, while the Arce government continued to insist on legislative ratification through at least 29 May 2025.

Prime Minister Anwar Ibrahim launched Malaysia's National Semiconductor Strategy (NSS) on 28 May 2024 in his keynote at SEMICON Southeast Asia, with implementation led by MITI. The NSS commits at least RM25 billion (~USD 5.3 billion) in fiscal support over a ten-year horizon and structures the chip industrial policy in three sequential phases: (1) shoring up Malaysia's existing strength in outsourced semiconductor assembly and test (OSAT) and back-end packaging, (2) moving domestic firms into integrated-circuit (IC) design, advanced packaging and advanced manufacturing equipment, and (3) developing Malaysian-owned global champions across the chip value chain under a "Made by Malaysia" framing. Headline targets include developing 10 local design and advanced- packaging companies with revenues between RM1 billion and RM4.7 billion, 100 broader semiconductor-related companies near the RM1 billion revenue mark, and training 60,000 high- skilled engineers. The RM25 billion envelope decomposes into RM5 billion in tax forgone over five years, RM2 billion for existing capital grants, RM1.25 billion for an HRD Fund semiconductor allocation, RM2 billion for a Semiconductor Industrial Park, RM1.59 billion for an Advanced Packaging Centre, plus RM2 billion each for the National Energy Transition Facility and Green Tech Financing Scheme. By June 2025, the government reported RM70.7 billion in announced investments attracted under the NSS umbrella.

Uttar Pradesh notified its first dedicated state-level Semiconductor Policy on 12 February 2024 (cabinet-cleared 30 January 2024), making it the fourth Indian state with a sectoral semiconductor incentive regime after Tamil Nadu, Karnataka and Gujarat. The policy stacks a 50% additional state capital subsidy on top of the central India Semiconductor Mission (ISM) 50% subsidy — yielding an effective ~75% capex coverage for qualifying fab, display-fab, compound-semiconductor, ATMP/OSAT, and sensor units approved by ISM. It adds a 75% land rebate on the first 200 acres for ATMP/OSAT (30% on additional land), a 5% interest subsidy (capped at ₹1 cr/year for 7 years) on investments up to ₹200 cr, 100% stamp-duty and registration-fee exemption, and a 10-year electricity-duty exemption. Within months of notification the state attracted ₹40,038 cr in investment proposals (Tarq Semiconductor, Kaynes Semicon, Aditech, Vamasundari) with ~32,000 projected jobs, prompting the cabinet to later approve mega-project incentives for investments ≥ ₹3,000 cr.

On 24 February 2023, the first anniversary of Russia's full-scale invasion of Ukraine, the US Department of State announced a package of sanctions designations under the executive order blocking property of persons engaged in harmful foreign activities of the Russian government (E.O. 14024). The State Department describes designating over 60 individuals and entities, including Russian officials and entities in Russia's advanced-technology sector, three enterprises that develop and operate Russia's nuclear weapons, and three civil nuclear entities within the Rosatom structure. The Treasury Department announced parallel designations, including four entities in the metals and mining sector.

The Union Cabinet approved the Semicon India Programme on 15 December 2021, establishing the India Semiconductor Mission (ISM) as the nodal agency. The programme offers fiscal support of up to 50% of project cost for silicon semiconductor fabs, compound semiconductor facilities, display fabs, ATMP/OSAT units, and chip design. Total outlay: Rs 76,000 crore (approximately $10.2bn at 2021 exchange rates). By February 2024, the Cabinet had approved three major semiconductor units under ISM: Tata Electronics with PSMC (semiconductor fab, Dholera, Rs 91,526 crore), Tata Electronics OSAT (Morigaon, Assam, Rs 27,120 crore), and CG Power OSAT (Rs 7,584 crore), totalling over Rs 1.26 lakh crore in committed investment from private applicants.