Industrial Policy & Trade Monitor· 2663 actions· ✨ 89 recent

On June 8, 2026, the US Department of Defense published its annual update to the Section 1260H Chinese Military Companies (CMIC) list, adding 65 entities (17 new parent companies and 48 subsidiaries), bringing the total to approximately 188–200 designated entities. Major additions span EV and battery manufacturing (BYD, NIO, CATL), consumer internet (Alibaba, Baidu, Tencent), semiconductors (SMIC, YMTC, CXMT), solar (JA Solar, Trina Solar), biotech (BGI Genomics, WuXi AppTec), drones/robotics (DJI, Unitree, RoboSense), and telecoms (TP-Link). Effective June 30, 2026, DoD is prohibited from procuring goods, services, or technology directly from listed entities; effective June 30, 2027, the ban extends to indirect supply-chain procurement through prime contractors and all sub-tiers.

On 3 June 2026 the European Commission adopted a legislative proposal to amend and substantially expand the EU Chips Act (Regulation (EU) 2023/1781), as part of the European Technological Sovereignty Package. The proposal raises the mobilisation target from €43bn to €120bn, introduces new demand-side "Demand Accelerators" to aggregate public procurement, expands "Grand Challenges" to cover AI-optimised chips, caps permitting at 12 months, and widens the Strategic Partnerships on Semiconductors framework. As a Commission legislative proposal it now enters co-decision (European Parliament + Council) before becoming law; the 2023 regulation remains in force during this process.

The European Commission (DG COMP) approved on 20 May 2026 two German State aid measures under the European Chips Act first-pillar 'first-of-a-kind' framework and Article 107(3)(c) TFEU, totalling €288 million. A €222 million grant supports Carl Zeiss SMT GmbH's HNA@SCALE project in Oberkochen (Baden-Württemberg) to industrialise the next generation of High-NA EUV optical columns — the lithography-optic sub-systems integrated by ASML into its High-NA EUV scanners and critical to 2nm-and-below node manufacturing globally. A separate €66 million grant supports Zadient Materials Europe GmbH's SiC-Pro project in Bitterfeld (Saxony-Anhalt) to construct a first-of-a-kind ultra-pure silicon carbide (SiC) source-material manufacturing facility, addressing upstream SiC supply-chain dependence on China (which produces ~80% of global SiC). Both facilities carry cross-border spillover commitments under Chips Act pillar 1.

On 15 April 2026 Japan's Ministry of Economy, Trade and Industry (METI) published the interim summary "Manufacturing Base Strengthening Report" from the Study Group on Strengthening Manufacturing Base in Light of Geopolitical Risks. The report frames Japan's manufacturing base as the source of national power and proposes shifting economic-security support for "autonomy assurance" from "point" measures to "area"-wide measures — expanding the scope of Specified Critical Materials under the 2022 Economic Security Promotion Act (ESPA) beyond narrowly defined inputs to cover foundational petrochemicals (ethylene, propylene, methanol, synthetic rubber) and process-industry technologies (casting, forging), plus components for emerging technologies (humanoid-robot actuators and sensors, lasers for quantum computing). It is the cornerstone framework document operationalising METI's FY2026 strategic-budget package (~¥3.07 trillion overall envelope; ~¥1.23 trillion specifically for semiconductors and AI, including ¥150bn for Rapidus and ¥387.3bn for AI development) as Japan's coordinated response to deepening Chinese export-control pressure on dual-use items, gallium/germanium, graphite, antimony and heavy rare earths.

The Department of Commerce's International Trade Administration published a Federal Register notice on 10 April 2026 (91 FR 18412, doc 2026-06952) opening the inaugural Call for Proposals for the American AI Exports Program established under Executive Order 14320. Proposals are accepted from 1 April 2026 through 5:00 pm EDT on 30 June 2026 from US industry-led "pre-set" consortia offering full-stack American AI export packages — AI-optimised hardware, data pipelines, AI models and systems, security and cybersecurity measures, and sector-specific applications — for presentation by the US government to foreign public- and private-sector buyers. Designated consortia receive priority US-government advocacy, priority consideration for export-control licence engagement, interagency coordination, and federal-financing referrals (EXIM, DFC), with a 14-business-day completeness review and 60-calendar-day designation decision once a proposal is deemed complete.

On 19 March 2026 the German Federal Ministry for Economic Affairs and Energy (BMWE) announced the selection of 38 German projects across 12 federal Länder for the IPCEI Advanced Semiconductor Technologies (IPCEI AST) — the next Important Project of Common European Interest on semiconductors under EU State Aid Article 107(3)(b) TFEU. The federal commitment is EUR 3 billion drawn from the Sondervermögen Infrastruktur und Klimaneutralität (SVIK), the EUR 100 bn special-purpose vehicle enacted via SVIKG in September 2025. The 38 selected projects span AI chips and chiplets, photonic integrated circuits, advanced manufacturing equipment, sensor technologies, and power electronics, with approximately one-third being startups and SMEs. The measure operationalises Germany's Microelectronics Strategy (October 2025) at the project-funding layer and is the first major SVIK semiconductor-tranche deployment.

The Federal Acquisition Regulatory Council (DOD, GSA, and NASA) published a Notice of Proposed Rulemaking on 17 February 2026 (FR Doc 2026-03065, 91 FR 7223) implementing Section 5949(a) of the NDAA FY2023 (Pub. L. 117-263), which bars executive agencies from acquiring electronic products or services containing semiconductor components designed, produced, or provided by SMIC, CXMT, YMTC, or their affiliates. A Part B prohibition extends the restriction to "critical systems" whose subsystems incorporate covered semiconductors regardless of COTS sourcing. The comment period closed 20 April 2026; proposed prohibitions take effect 23 December 2027.

On 12 February 2026, Ambassador Jamieson Greer of the Office of the United States Trade Representative oversaw the signing of the US-Taiwan Agreement on Reciprocal Trade (ART) in Washington, DC. The instrument was signed under the auspices of the American Institute in Taiwan (AIT) and the Taipei Economic and Cultural Representative Office in the United States (TECRO). Headline terms: (i) US IEEPA reciprocal-tariff rate on Taiwan reduced from 20% to 15% and Section 232 auto-parts/timber/lumber rate cut from 25% to 15%; (ii) Taiwan eliminates or reduces 99% of its tariff barriers on US goods, most immediately and the remainder phased over three years; (iii) Taiwan side commits ~USD 85bn in directed purchases through 2029 (USD 44.4bn LNG/crude, USD 15.2bn civil aircraft and engines, USD 25.2bn power equipment); (iv) sectoral chapters covering tariffs, non-tariff barriers, digital trade, economic security, and high-tech supply-chain resilience. Operationally linked to the 15 January 2026 AIT-TECRO Memorandum of Understanding on investment, under which Taiwan pledges USD 250bn in direct Taiwanese-enterprise investment in the US plus USD 250bn in Taiwan-government credit guarantees (USD 500bn total) to fund US-side industrial parks/clusters in advanced semiconductors, energy, and AI manufacturing. Entry into force is conditional on Taiwan's Legislative Yuan completing its review.

On 1 February 2026 Finance Minister Nirmala Sitharaman, presenting the Union Budget 2026-27, announced the launch of India Semiconductor Mission (ISM) 2.0 — the second-phase national semiconductor industrial-policy framework succeeding ISM 1.0 (2021, INR 76,000 crore). The Budget makes an initial INR 1,000 crore provision for ISM 2.0 in FY 2026-27 and raises the Electronics Components Manufacturing Scheme (ECMS) outlay from INR 22,919 crore to INR 40,000 crore. ISM 2.0's distinct architecture centres on four strategic priorities not in ISM 1.0: (i) indigenous semiconductor equipment, chemicals, gases and materials production, (ii) full-stack Indian semiconductor IP design, (iii) industry-led R&D and skills/training centres, and (iv) domestic and global supply-chain integration. Total mission outlay reported as approximately INR 1-1.2 lakh crore (~USD 12-14bn) is being finalised; Cabinet clearance and the formal scheme launch are expected by mid-2026.

South Korea's National Assembly passed the "Special Act on Strengthening and Supporting the Competitiveness of the Semiconductor Industry" (반도체산업 경쟁력 강화 및 지원에 관한 특별법) on 29 January 2026 by 199 votes in favour out of 206 members present, after roughly 18 months of inter-party deadlock. The act establishes (i) a Presidential Commission for Enhancing Semiconductor Competitiveness as the central inter-ministerial coordination body, (ii) a statutory five-year master plan with annual implementation plans, (iii) a dedicated semiconductor industry special account ("반도체산업 특별회계") to ring-fence funding for fabs, materials, parts and equipment, and packaging across the full memory + system-LSI + design + manufacturing supply chain, and (iv) authority to designate semiconductor clusters outside the greater Seoul area with relocation incentives. Promulgation by the Cabinet is expected shortly after passage; effectiveness contingent on enforcement-ordinance finalisation, expected Q3 2026. The KRW 2tn anchor envelope of the special account does not begin disbursing until 2027 because companion amendments to the National Finance Act were not enacted in time.

On 14 January 2026 President Trump issued a Presidential Proclamation under Section 232 of the Trade Expansion Act of 1962 imposing a 25% ad valorem tariff on imports of certain advanced computing chips and their derivative products, effective 12:01 a.m. EST on 15 January 2026. The measure adopts findings of the Section 232 investigation initiated 1 April 2025 (Department of Commerce report transmitted 22 December 2025) into semiconductors, semiconductor manufacturing equipment, and derivative products. Coverage is narrowly drawn to high-performance AI accelerators meeting specified technical parameters (publicly characterised as covering devices in the NVIDIA H200 / AMD MI325X performance tier), with broad use-based exemptions for chips going into US data centres, US R&D, US repairs, and other uses deemed to strengthen domestic supply chains.

The US Bureau of Industry and Security issued a final rule (RIN 0694-AK43, 91 FR 1684, signed 13 January 2026, effective 15 January 2026) revising the EAR license-review policy for exports of certain advanced-computing integrated circuits to end-users in China and Macau from a presumption of denial to case-by-case review. Eligibility is limited to commodities controlled under ECCN 3A090.a and 3A090.b with a Total Processing Performance (TPP) below 21,000 and total DRAM bandwidth below 6,500 GB/s — the band that covers NVIDIA H200 and AMD MI325X-equivalents and below. To qualify, exporters must certify (i) sufficiency of US supply such that the export will not delay domestic orders or divert foundry capacity, (ii) that aggregate TPP of advanced-node ICs exported to China or Macau will not exceed 50% of domestic shipments, (iii) compliance with end-use and end-user prohibitions, and (iv) prior performance review by a qualified independent third-party testing lab headquartered in the United States. The rule is the first material rollback of the October 2022 / October 2023 / December 2024 advanced-computing export-control architecture and operationalises the Trump-administration policy of trading H200-class chip access against Chinese cooperation on critical minerals, fentanyl precursors and Taiwan-strait restraint.

On 7 January 2026 the National Semiconductor and Advanced Electronics Industry Policy Committee (the "Semiconductor Board"), chaired by Deputy Prime Minister and Minister of Finance Ekniti Nitithanprapas, endorsed the Draft National Strategy for the Development of the Semiconductor and Advanced Electronics Industry, prepared by the Board of Investment (BOI) with Roland Berger after a public hearing in October 2025. The 25-year roadmap (2026-2050) targets more than THB 2.5 trillion (~USD 79.6 billion) in investment, training of more than 230,000 highly-skilled engineers, and construction of a complete upstream-to- downstream semiconductor ecosystem with phased milestones for 2030, 2040 and 2050. The strategy prioritises five product groups where Thailand has competitive potential — Power chips, Sensors, Photonics, Analog and Discrete chips — and explicitly aims to move the country beyond OSAT (Outsourced Semiconductor Assembly and Test) into IC design and upstream wafer fabrication ("Made-in-Thailand chips"). Implementation runs through a five-pillar BOI support mechanism: long-term low-interest financing and grants, human-capital development, technology upgrade of the Microelectronics Technology Centre (TMEC), specialised industrial clusters with guaranteed renewable-energy and water security, and streamlined regulatory approvals including a new BOI "FastPass" fast-track facility (16 pilot projects worth THB 170 billion already processed).

On 26 December 2025, Japan's Cabinet under Prime Minister Sanae Takaichi approved the FY2026 (Reiwa 8) national budget, which allocates JPY 150 billion (~USD 1bn) to the "Investment Project for Mass Production of Next-Generation Semiconductors" -- a state equity-investment line administered by the Information-technology Promotion Agency (IPA) that funds Rapidus Corporation's 2nm-class logic fab in Chitose, Hokkaido. The FY2026 allocation is 50% larger than the JPY 100 billion IPA equity tranche budgeted for FY2025, taking cumulative government equity in Rapidus to roughly JPY 250 billion. The line sits inside METI's wider AI/semiconductor budget of JPY 1.239 trillion for FY2026 (up roughly 4x year-on-year) under the "AI/Semiconductor Industry Base Strengthening Frame," part of the government's pledge of over JPY 10 trillion in public support for AI and chips through FY2030. The budget takes effect with Japan's fiscal year on 1 April 2026, subject to ordinary Diet passage in early 2026.

On 11 December 2025 the Council of the EU presidency, the European Parliament, and the European Commission reached provisional political (trilogue) agreement on the revision of Regulation (EU) 2019/452 establishing a framework for the screening of foreign direct investments into the Union, concluding interinstitutional negotiations on the Commission's proposal of 24 January 2024. The revised regime upgrades the 2019 cooperation-mechanism-only framework into a hybrid harmonised/mandatory regime: all 27 Member States must establish FDI screening mechanisms (replacing the current patchwork in which some Member States have no mechanism at all); mandatory minimum sectoral scope is set EU-wide and covers dual-use items, military equipment, hyper-critical technologies (general-purpose AI with space/defence relevance, quantum technologies, semiconductors), critical raw materials, critical entities in energy/transport/digital infrastructure, electoral infrastructure, and certain financial-system entities; foreign investments routed through EU subsidiaries fall within the perimeter; a shared database prevents Member-State arbitrage; and an optional single electronic-filing portal becomes available if requested by at least nine Member States. Screening decisions remain the exclusive responsibility of the Member State in which the investment is made. Once the Regulation enters into force (after Council and Parliament formal adoption and OJ publication, both pending as of the political-agreement date), the new rules will apply after an 18-month transition period — implementation expected toward the end of 2027.

Singapore's National Research Foundation (NRF), under the Prime Minister's Office, launched the five-year Research, Innovation and Enterprise 2030 Plan on 5 December 2025, allocating S$37 billion (approximately 1% of GDP) for 2026-2030. The plan succeeds RIE2025 (S$25 billion) and introduces two named RIE Flagships and two RIE Grand Challenges; the first Flagship is in semiconductors and is explicitly aimed at making Singapore a strategically important R&D and manufacturing node in the global semiconductor supply chain. The budget envelope is split 24% foundational research, 20% innovation and enterprise, 17% infrastructure / new programmes ("white space"), 10% talent development.

On 21 November 2025, METI Minister Yoji Akazawa designated Rapidus Corporation as the official next-generation semiconductor manufacturer under Japan's Act on Facilitation of Information Processing (情報処理の促進に関する法律, as amended by the Cabinet-approved partial-amendment bill of 7 February 2025), following a public solicitation run 3 September – 2 October 2025. The designation makes Rapidus eligible for a multi-year METI funding envelope reported at roughly JPY 1tn (~USD 6.4bn), with an initial JPY 100bn equity investment by the Information-technology Promotion Agency (IPA) planned for FY2025; the funds support Rapidus' Hokkaido (Chitose) IIM-1 fab targeting 2nm GAA mass production from April 2027 and successor 1.4nm / 1nm nodes. The action is the first standalone Rapidus entry in the IPTM register and operationalises the supply-chain pillar of the 2022 Economic Security Promotion Act for advanced logic.

On 20 November 2025 the White House and US Department of Commerce / Bureau of Industry and Security (BIS) authorised Abu Dhabi AI holding company G42 to import advanced computing chips — equivalent to approximately 35,000 Nvidia GB300 Blackwell processors — under the UAE-pioneered Regulated Technology Environment (RTE) compliance framework. The RTE is an Emirati-designed technology governance and audit architecture, developed by G42 and approved under BIS guidelines, with binding UAE-side controls to prevent onward diversion to foreign adversary nations. The authorisation accelerates the Stargate UAE project — a 1 GW AI compute cluster being built by G42 for OpenAI in partnership with Oracle, Cisco, NVIDIA, and SoftBank Group — and represents the first concluded major country-level advanced-compute authorisation following the May 2025 rescission of the Biden-era AI Diffusion Rule.

China's Ministry of Commerce (MOFCOM) and General Administration of Customs (GAC) issued Announcement No. 72 (2025) on November 9, 2025, suspending Article 2 of Announcement No. 46 (2024) — the provision that had imposed a categorical export ban on gallium, germanium, antimony, superhard materials, and graphite dual-use items destined for the United States. The suspension is valid until November 27, 2026, reverting these exports to China's standard dual-use licensing framework for that period. Article 1 of Announcement No. 46 — prohibiting re-exports to US military end-users regardless of routing — remains fully in force. The measure followed bilateral US-China trade consultations and signals a conditional de-escalation window within China's established critical-minerals counter-strike posture.

China's Ministry of Commerce (MOFCOM) and General Administration of Customs (GAC) issued Announcement No. 70 (2025) on November 7, 2025, suspending for one year the package of rare-earth export-control measures announced on October 9, 2025 (Announcements Nos. 55, 56, 57, 58, 61, 62). The suspended measures include the licensing regime on medium- and heavy-rare-earth elements, rare-earth processing equipment and technologies, lithium-battery and synthetic-graphite anode materials, superhard materials, and — most significantly — the extraterritorial "0.1% content" rule of Announcement No. 61 that asserted licence jurisdiction over foreign-made products containing Chinese-origin controlled rare earths. The gazette text fixes the window explicitly: "自即日起至2026年11月10日" (from the date of issue until November 10, 2026). This is the rare-earth leg of the post-Busan US-China truce; the dual-use leg (gallium, germanium, antimony, graphite) was suspended two days later by the separate Announcement No. 72 (2025), which runs to November 27, 2026. The two instruments create a two-step expiry cliff in November 2026.

At the APEC Busan summit on 30 October 2025, Presidents Trump and Xi reached the "Economic and Trade Arrangement Between the United States and the People's Republic of China," subsequently implemented on the US side by the executive order "Modifying Reciprocal Tariff Rates Consistent with the Economic and Trade Arrangement" (issued 4 November 2025; effective 12:01 am EST on 10 November 2025; published in the Federal Register on 7 November 2025 as 90 FR 50729 / 2025-19826) and on the Chinese side by a series of MOFCOM and State Council Tariff Commission announcements (notably MOFCOM 2025 No. 90 of 8–9 November 2025). The arrangement is structurally parallel to the already-filed US-Japan, US-Korea and US-Taiwan framework deals but uniquely material because it freezes the highest-stakes bilateral tariff and export-control confrontation of the post-2024 reset. Core US commitments: (i) reciprocal-tariff "additional ad valorem rate of duty" on PRC-origin goods reduced from a prior 20% IEEPA-fentanyl + 10% IEEPA-reciprocal stack to a 10% rate (i.e., the prior 24% / 34% scheduled escalation is suspended), extended through 10 November 2026; (ii) US BIS suspends the so-called "affiliates rule" expanding entity-list controls to majority-owned subsidiaries of listed Chinese firms; (iii) USTR pauses Section 301 maritime / shipbuilding / logistics countermeasures against Chinese vessels for one year. Core PRC commitments: (i) MOFCOM suspends for one year (until 10 November 2026) the 9 October 2025 extraterritorial rare-earth export-control package — including controls on REE processing equipment, lithium-battery manufacturing equipment, and superhard materials; (ii) PRC suspends retaliatory tariffs on a broad swath of US agricultural products through 31 December 2026; (iii) commitment to purchase ≥25 million metric tonnes of US soybeans annually in 2026-2028 and to resume sorghum and log imports; (iv) suspension of MOFCOM antitrust and "unreliable-entity" probes against named US semiconductor and chip-equipment companies; (v) cooperation on fentanyl precursor enforcement. The arrangement does not repeal underlying authorities (IEEPA tariffs, MOFCOM export-control list, Entity List) — it is a calibrated mutual freeze with a one-year sunset and quarterly review checkpoints.

On 26 October 2025 in Kuala Lumpur, on the margins of the ASEAN Summit, President Donald J. Trump and Prime Minister Anwar Ibrahim signed two complementary instruments structuring the US-Malaysia economic relationship: (i) a non-binding Memorandum of Understanding Concerning Cooperation to Diversify Global Critical Minerals Supply Chains and Promote Investments, establishing quarterly working-level meetings on bilateral exploration, extraction, processing, refining, manufacturing, and recycling, plus shared commitments on streamlined permitting and protection from non-market policies; and (ii) a legally-binding Agreement on Reciprocal Trade (ART) covering goods (chemicals, machinery, electrical equipment, metals, vehicles, dairy, horticulture, poultry, pork, rice, fuel ethanol), digital trade, services, and investment. Under the ART, the United States maintains a 19% reciprocal tariff on Malaysian imports (with carve-outs for products receiving 0% under EO 14346) while Malaysia commits to refrain from banning or quota-restricting exports of critical minerals or rare earths to the US, ensure no restrictions on rare-earth magnet sales to US firms, and grant extended operating licenses to US partners. The ART enters into force 60 days after exchange of notifications of completed domestic procedures.

On 15 October 2025 the German Federal Cabinet adopted the Microelectronics Strategy of the Federal Government, jointly presented by the Federal Ministry for Research, Technology and Space (BMFTR) and the Federal Ministry for Economic Affairs and Energy (BMWE). The strategy is the first comprehensive cabinet-adopted German microelectronics policy framework in over a decade and operationalises Germany's contribution to the European Chips Act envelope. It is organised around three pillars — Research, Skilled Labour and Production — and creates a "Chips Office" to coordinate stakeholder interaction and implementation. It establishes a competence centre for chip design and a flagship "supercomputer in the car" project, and is framed as a key implementation instrument under the High-Tech Agenda Germany (HTAD) and as Germany's contribution to the September 29 2025 Semicon Declaration signed by all 27 EU member states calling for a revised EU Chips Act II.

On 10 October 2025 Vietnam's Government issued Decree No. 259/2025/NĐ-CP, establishing the country's first comprehensive statutory framework for strategic trade control — covering the export, temporary import for re-export, transshipment, transit, and cross-border trade of strategic goods defined as: (a) WMD-related items, (b) conventional weapons, and (c) dual-use goods spanning nuclear, electronics, telecommunications, sensors, aviation, maritime, aerospace, biochemical, metals, and chemical categories. The decree creates a Ministry of Industry and Trade (MoIT) licensing regime with an ICP (Internal Compliance Programme) fast-track for certified exporters of two or more years' standing, and includes catch-all provisions requiring licensing even for unlisted goods where WMD end-use or a designated end-user is suspected. Structurally, the decree represents Vietnam's transition from ad-hoc export-management provisions under legacy Decree 69/2018/NĐ-CP to a unified strategic-trade-control architecture analytically aligned with the Wassenaar Arrangement, Australia Group, Nuclear Suppliers Group, and MTCR control-list architecture. It positions Vietnam as a compliant strategic-goods manufacturing hub within the US-led friend-shoring supply chain, directly preceding the US announcement in February 2026 of Vietnam's removal from EAR Country Groups D:1–D:3.

China's Ministry of Commerce on 9 October 2025 issued Announcements No. 61 and No. 62, jointly constituting the largest single architectural escalation of PRC export controls to date. No. 61 expands the controlled rare-earth list from 7 to 12 of 17 elements (adding holmium, erbium, thulium, europium, ytterbium) and — for the first time — imposes extraterritorial application via a 0.1% de-minimis rule, a foreign-direct-product (FDP) rule, and a 50%-affiliate rule, directly mirroring US BIS architecture. No. 62 places rare-earth extraction, smelting, separation, magnet manufacturing, and recycling technologies (including IP licensing, investment, and provision to foreign persons) under export licensing. PRC-direct exports were controlled from publication; the de-minimis and FDP offshore-items provisions were due to take effect 1 December 2025. On 7 November 2025 MOFCOM Announcement No. 70 suspended both measures until 10 November 2026 as part of the post-APEC Trump-Xi tariff detente — see amendments block.

Singapore issued a package of four companion instruments in 2025 to modernise its strategic-goods control architecture: (i) the Strategic Goods (Control) Order 2025 (SGCO 2025), which revokes and replaces SGCO 2024 (S 641/2024) and expands the Singapore Strategic Goods Control List to align with the 2024 Wassenaar Arrangement Munitions List and 2024 EU List of Dual-Use Items, effective 1 December 2025; (ii) the Strategic Goods (Control) (Brokering) (Amendment) Order 2025 (S 662/2025), published 1 October 2025, updating Singapore's extraterritorial brokering regime for controlled goods; (iii) Singapore Customs Circular 01/2025 of 8 April 2025, amending import/export declaration requirements to mandate disclosure of the final destination country of goods rather than the consignee address on the commercial invoice; and (iv) a 4 April 2025 joint MTI–Singapore Customs advisory explicitly warning Singapore-based businesses and intermediaries that their compliance obligations extend beyond Singapore's own controls — i.e., that Singapore authorities will not condone deliberate circumvention or violation of US, EU, or Japanese export controls by Singapore-domiciled intermediaries. This package constitutes the first Singapore export-control-architecture filing in the IPTM register and is directly framed by the February 2025 Singapore–NVIDIA–Inspur–DeepSeek GPU-diversion case in which three Singapore residents were charged for fraudulent re-export of restricted AI accelerators to PRC end-users.

On 2025-09-12, Shanghai STAR Market-listed chip-equipment maker Piotech Inc. (拓荆科技, 688072.SH) disclosed a CNY 450 million (~USD 63 million) capital increase into its controlling subsidiary Piotech Jianke (Haining) Semiconductor Equipment Co., Ltd. (拓荆键科(海宁)半导体设备有限公司), which develops 3D-integration/hybrid-bonding equipment. Guotou Jixin (国投集新), a vehicle wholly owned (99.9%) by the National Integrated Circuit Industry Investment Fund Phase III ("Big Fund III"), took a 12.71% stake for roughly CNY 192 million, becoming Piotech Jianke's second-largest shareholder; Piotech's own stake fell to approximately 53.57% post-round. The round valued Piotech Jianke's pre-money equity at CNY 2.5 billion — a roughly 44x premium to its RMB 55.2 million book net-asset value as of 2024-12-31 — reflecting Big Fund III's first disclosed equity deployment since its 2024-05-24 establishment.

Commission Delegated Regulation (EU) 2025/2003, adopted by the European Commission on 8 September 2025, published in the Official Journal on 14 November 2025 and entering into force on 15 November 2025, amends Annex I of Regulation (EU) 2021/821 to implement the 2024 multilateral decisions of the Wassenaar Arrangement, MTCR, Australia Group, and NSG. The most extensive EU semiconductor-equipment additions since the 2021 framework took effect: ALD, epitaxial deposition, lithography, EUV pellicles/masks/reticles, SEM, and etching equipment, plus tighter controls on quantum computers, advanced FPGAs/ICs for AI training, additive-manufacturing, and cryogenic/superconducting components. The regulation is the EU-side update layer of the Western dual-use export control architecture, structurally aligned with the US BIS advanced- computing/SME packages and the Netherlands DUV-licensing regime.

The 22nd Regulation Amending the Foreign Trade and Payments Ordinance (Zweiundzwanzigste Verordnung zur Änderung der Außenwirtschaftsverordnung), promulgated in Bundesgesetzblatt I 2025 Nr. 261 and entering into force on 1 November 2025, updates Germany's national export-control list (Ausfuhrliste, Annex AL to the AWV) to align with the 2024-cycle decisions of the Wassenaar Arrangement, MTCR, Australia Group, and NSG. It is the German national implementation layer that parallels Commission Delegated Regulation (EU) 2025/2003 — both ingest the same multilateral consensus into the EU+DE dual-use perimeter covering ALD, epitaxial deposition, lithography (EUV pellicles/masks/reticles), SEM and etching equipment, quantum computers, cryogenic components, advanced FPGAs/ICs for AI training, and additive-manufacturing systems. Sets the export-list baseline against which BAFA licence determinations from November 2025 onward are made. Distinct from the parallel AWG Implementing Act (entered into force 2026-02-06) which transposed EU Directive 2024/1226 into German sanctions criminal law.

The US Bureau of Industry and Security (BIS) amended the Export Administration Regulations to remove three foreign-owned semiconductor fabs operating in China — Intel Semiconductor (Dalian) Ltd, Samsung China Semiconductor Co. Ltd, and SK hynix Semiconductor (China) Ltd — from the Validated End-User (VEU) Authorizations list (15 CFR Part 748). BIS framed the VEU program as a "loophole" that previously allowed these fabs to receive most US-origin chipmaking equipment, software and technology license-free, a privilege no US-owned fab in China ever had. After the effective date, every restricted shipment to these fabs will require an individual export license, reviewed case-by-case under the existing 2022/2023 advanced- computing controls. The rule is published as Federal Register document 2025-16735 (90 FR 42321), Docket BIS-2025-0555, RIN 0694-AK32.

On 22 August 2025 Intel and the Trump administration announced that the US government would acquire a 9.9% equity stake in Intel — 433.3 million common shares at $20.47/share, worth $8.9 billion — funded by converting $5.7 billion in remaining, undisbursed CHIPS and Science Act grants and $3.2 billion from the Department of War's Secure Enclave program into equity rather than paying them as grants. Combined with $2.2 billion already disbursed under Intel's CHIPS award, total federal support reaches $11.1 billion. 274.6 million shares transferred to Commerce at closing on 27 August 2025; the remaining 158.7 million sit in escrow pending Secure Enclave disbursement milestones. The government also received a five-year warrant for an additional 5% of Intel shares at $20/share, exercisable only if Intel's ownership of its foundry business falls below 51%.

Malaysia's Ministry of Investment, Trade and Industry, acting through the Strategic Trade Controller, issued Directive No. 1/2025 on 14 July 2025 invoking Section 12 of the Strategic Trade Act 2010 to declare high-performance US-origin AI chips (GPUs, TPUs, neural processors, AI accelerators meeting the Annex I total-processing-performance and performance-density thresholds) as "unlisted controlled items". With effect from 14 July 2025, any export, transshipment, or transit of those chips through Malaysian territory requires a Strategic Trade Permit, a 30-day prior notification, an export-control classification from the manufacturer, and a re-export licence from the originating country. The directive is the formal Malaysian response to US scrutiny over alleged Nvidia AI-chip flows to China via Malaysian freight forwarders and data-centre operators, and it remains binding even after the US relaxes its own export rules.

H.R.1, the "One Big Beautiful Bill Act" (Public Law 119-21), was signed into law by President Trump on 4 July 2025. The budget-reconciliation statute is the single largest reversal of the 2022 Inflation Reduction Act (IRA) industrial-policy framework: it accelerates the termination of IRA-era clean- energy tax credits and overlays a new "Foreign Entity of Concern" (FEOC) / "Prohibited Foreign Entity" (PFE) regime on the credits that survive. The §25E used-EV credit, the §30D new clean-vehicle credit, the §45W commercial clean-vehicle credit, and the §30C alternative-fuel-refueling-property credit terminate for vehicles or property placed in service after 30 September 2025. The §25C energy-efficient home improvement credit and the §25D residential clean-energy credit terminate for property placed in service after 31 December 2025. The §45Y clean-electricity production credit and §48E clean-electricity investment credit are eliminated for wind and solar facilities placed in service after 31 December 2027, with a safe harbour for projects whose construction begins on or before 4 July 2026. From 1 January 2026, projects beginning construction must satisfy "material assistance" thresholds limiting the share of components, subcomponents and critical minerals sourced from prohibited foreign entities (PRC, Russia, Iran, DPRK and entities controlled by them). For §45Y/§48E facilities the threshold starts at 40% non-PFE content in 2026 and steps up by 5 percentage points per year through 2030; for §45X advanced manufacturing PTC the analogous schedule begins at 50% in 2026 and rises through the decade. CBO scored the package's energy-credit terminations as generating roughly USD 280bn of revenue (gross), of which USD 77.4bn from §25D termination, USD 21.2bn from §25C, USD 77.8bn from §30D, USD 104.5bn from §45W, and USD 2bn from §30C, partially offsetting the bill's other tax cuts. The bill simultaneously re-authorises and broadens the §48D advanced manufacturing investment tax credit for semiconductor fabs, raising the credit rate from 25% to 35% for property placed in service after 31 December 2025 (preserving the CHIPS Act-aligned semiconductor leg of the IRA-era stack). The OBBBA therefore reshapes the IRA from a broad-based clean-energy + EV + manufacturing pull-through into a narrower, China-decoupling industrial policy concentrated on semiconductors and (residually) §45X battery / critical- mineral processing.

The Chips Joint Undertaking, via Horizon Europe grant agreement 101213727 signed 19 June 2025, is co-funding "PIXEurope" (Advanced Photonic Integrated Circuits Pilot Line for Europe), the fifth EU Chips Act pilot line. Fundació Institut de Ciències Fotòniques (ICFO, Spain), the project coordinator, receives EUR 10,112,253.51 in net EU contribution — the coordinator's own tranche of the wider 19-entity, multi-country consortium's EUR 176.05m total project cost (EUR 88.03m in EU/Chips JU contribution), running 1 June 2025 to 31 May 2030. This is a distinct beneficiary filing alongside the parallel TNO (Netherlands) tranche of the same grant agreement, which builds a 6-inch indium-phosphide pilot manufacturing line at High Tech Campus Eindhoven.

The Chips Joint Undertaking, via Horizon Europe grant agreement 101213727 signed 19 June 2025, is co-funding "PIXEurope" (Advanced Photonic Integrated Circuits Pilot Line for Europe), the fifth EU Chips Act pilot line, coordinated by Fundació Institut de Ciències Fotòniques (ICFO, Spain) with a 19-entity, multi-country consortium. Total project cost is EUR 176.05m against EUR 88.03m in EU/Chips JU contribution, running 1 June 2025 to 31 May 2030. TNO (Netherlands) is a lead participant, receiving EUR 13.47m in net EU contribution (EUR 26.94m total eligible cost) to build a 6-inch indium-phosphide photonic-chip pilot manufacturing line at High Tech Campus Eindhoven — part of a wider EUR 193m Dutch national co-investment (Ministry of Economic Affairs, Ministry of Defence, Chips JU, TNO, TU Eindhoven, University of Twente) targeting technological independence in photonic chips for telecom/6G, AI, quantum, defence and medical-diagnostics applications. Global Trade Alert logs a EUR 10.1m figure for the TNO tranche as a "red" state-act intervention (financial grant) on competitive-distortion grounds; this filing anchors on the CORDIS-published grant-agreement figures as the authoritative primary-source numbers.

Taiwan's Ministry of Economic Affairs International Trade Administration (MOEA-ITA) amended the Strategic High-Tech Commodities (SHTC) export-control Entity List on 10 June 2025 (announced 15 June 2025) under Article 13 of the Trade Act, adding 601 new entities — including Huawei Technologies Co. Ltd. and Semiconductor Manufacturing International Corp. (SMIC) plus 599 additional entities domiciled in China, Russia, Iran, Pakistan and Myanmar. Taiwanese exporters (TSMC, UMC, ASE, KYEC and downstream suppliers) must obtain pre-export government licences for direct or third-party shipments of any SHTC-listed item to the listed entities; the action expands Taiwan's total entity-list population to ~10,844 entities. Two follow-on amendments tightened the regime further: a +279-entity expansion on 18 September 2025 and an 18-item commodity-list expansion on 18 November 2025 covering advanced 3D printers, semiconductor manufacturing equipment, electron microscopes and quantum-computing hardware.

On 10–11 May 2025 in Geneva, US Treasury Secretary Scott Bessent and USTR Jamieson Greer met with PRC Vice Premier He Lifeng and on 12 May 2025 issued the "Joint Statement on US-China Economic and Trade Meeting in Geneva," producing the first bilateral de-escalation of the post-2 April 2025 reciprocal-tariff stand-off. The agreement was implemented on the US side via Executive Order 14298 of 12 May 2025 ("Modifying Reciprocal Tariff Rates To Reflect Discussions With the People's Republic of China," published in the Federal Register 21 May 2025 as 90 FR 21831 / 2025-09297) and on the Chinese side via State Council Tariff Commission Announcement No. 4 of 2025. Effective 12:01 a.m. EDT on 14 May 2025, both sides suspended for 90 days (through 12 August 2025) the 24 percentage points of additional ad valorem duty layered on top of the prior 10% reciprocal rate, while the 10% reciprocal rate itself was retained. On the US side this reduced the headline reciprocal-tariff burden on PRC-origin goods from a 125% scheduled rate (under EOs 14259 and 14266) to 10%; combined with the still-in-force 20% IEEPA-fentanyl tariff under Executive Order 14195 (separately filed: `2025-02-01-us-trump-fentanyl-tariffs-canada-mexico-china`), the effective additional rate on most Chinese imports came down to ~30%. China made a parallel 24pp suspension on US-origin goods (from a 125% retaliatory rate to 10%) and additionally suspended non-tariff countermeasures imposed since 2 April 2025 (export controls, unreliable-entity designations, MOFCOM probes). The truce is structurally a calibrated freeze of the reciprocal-tariff ladder under the April 2025 regime, not a repeal: the underlying EO 14257 / IEEPA framework remains intact and was scheduled to re-engage at the 24pp escalated rate on 12 August 2025 absent further extension. The Geneva agreement is the precursor to the August 2025 Stockholm extension and the October 2025 Busan Economic and Trade Arrangement (separately filed: `2025-10-30-us-china-busan-economic-trade-arrangement`).

The Legislative Yuan of Taiwan (ROC) passed amendments to Article 22 of the Statute for Industrial Innovation (產業創新條例) and added a new Article 67-3 on third reading on 18 April 2025, promulgated by Presidential Decree on 7 May 2025. The package establishes for the first time a Taiwanese OUTBOUND-investment screening regime under the Statute: outbound investments by Taiwanese entities meeting the amount threshold (NTD 1.5bn, or lower as determined) OR involving designated countries/regions OR specific industries or technologies must obtain prior approval from the Ministry of Economic Affairs (MOEA) before implementation. The competent authority may deny approval (in whole or in part) or impose conditional approval where particular circumstances are identified — including risks to national security, harm to economic development or supply-chain resilience, conflict with international treaties, or violation of labour-standards law. The new Article 67-3 establishes enforcement penalties ranging from NTD 50,000 to NTD 1,000,000 for initial non-compliance violations and NTD 500,000 to NTD 10,000,000 per violation for failure to comply with conditions, restrictions, or undertakings imposed by MOEA under Article 22 Paragraph 3. Effective dates of implementing provisions are to be determined by Executive Yuan secondary legislation; the package is structurally novel for Taiwan — the first horizontal outbound-investment-security instrument and the structural parallel to the US Treasury Final Rule on Outbound Investment in Countries of Concern (28 October 2024 / effective 2 January 2025), the EU Commission Recommendation 2025/63, and Korea's MOTIE NCT regime.

Japan's Ministry of Economy, Trade and Industry (METI) overhauled the catch-all export-control framework under the Foreign Exchange and Foreign Trade Act (FEFTA) — the first comprehensive review of Japan's catch-all controls in 12 years (since 2013). Cabinet decisions were taken on 25 March 2025 and 4 April 2025 with METI's consolidated announcement on 9 April 2025; the amended Cabinet Order entered into force on 9 October 2025. The reform (i) splits catch-all-controlled items into "core items" (high dual-use risk, including certain semiconductors and machine tools) and a general catch-all tier, (ii) adds a new end-user requirement alongside the existing end-use requirement and extends both from UN-arms-embargo countries only to "general countries" (everywhere outside Group A), materially expanding the perimeter of items requiring METI export licences for general-country end-users including China, and (iii) introduces an "informed" condition for exports to Group A countries — once METI notifies an exporter of a defined risk pattern, a Group A export becomes licence-required, addressing transit-export-circumvention to Russia. Structurally distinct from the 23-category equipment-specific 2023 amendment (2023-03-31-japan-meti-semi-equipment-export-controls); this is the underlying horizontal catch-all reform and brings Japan's framework closer to US BIS EAR catch-all controls.

President Ferdinand R. Marcos Jr. signed Administrative Order No. 31 s. 2025 on 28 March 2025, establishing the Semiconductor and Electronics Industry Advisory Council (SEIAC) as the President's primary advisory body on semiconductor and electronics industry development, promotion, and competitiveness. The SEIAC is chaired by the Special Assistant to the President for Investment and Economic Affairs, with the DTI Secretary as Vice-Chair, and mandates the Council to provide strategic guidance for implementing the Philippine Semiconductor and Electronics Industry (PSEI) Roadmap, coordinate inter-agency interventions across the value chain, and recommend legislative measures for sectoral competitiveness.

The US Bureau of Industry and Security amended the Export Administration Regulations to add 12 entities to the Entity List under the destinations of China (11) and Taiwan (1) via Final Rule 2025-05427 (90 FR 14046), companion to the larger 70-entity rule (2025-05426) published the same day. Targets fall in three clusters: (i) Beijing Academy of Artificial Intelligence and Beijing Innovation Wisdom Technology — added for acquiring US-origin items in support of China's military modernization, specifically developing large AI models and advanced computing chips for defense; (ii) the Inspur group — Inspur (Beijing) Electronic Information Industry, Inspur Electronic Information Industry, Inspur Electronic Information (Hong Kong), Inspur (HK) Electronics, Inspur Software, and Inspur Taiwan — added as subsidiaries contributing to supercomputers for military end use; and (iii) Henan Dingxin, Nettrix Information Industry, Suma Technology, and Suma-USI Electronics — added for involvement in the development of Chinese exascale supercomputers. License requirements are for all items subject to the EAR; review policy is presumption of denial for the AI cluster and policy of denial for the supercomputer clusters.

South Korea's National Assembly passed the Special Act on the Expansion of the National Electricity Network (Law No. 20844) on 19 February 2025 as part of the bipartisan "Energy Trifecta Bill," with promulgation on 25 March 2025 and entry into force on 26 September 2025. The act creates an expedited siting, permitting, and compensation framework for trunk transmission-grid construction, consolidating 35 previously separate regulatory approvals into a single streamlined procedure and targeting a >30% reduction in grid-build timelines. It directly addresses the electricity-infrastructure bottleneck constraining semiconductor fab clusters (Yongin, Pyeongtaek, SK Hynix HBM), sovereign AI datacenter build-out, and EV/battery gigafactory load growth — structurally distinct from the K-Chips Act (fiscal incentives) and the Semiconductor Special Act (regulatory framework), as it unblocks the physical power-delivery constraint those programmes depend on.

South Korea's Ministry of Science and ICT (MSIT) committed in its 2025 Work Plan to establish a National AI Computing Center via public-private partnership (PPP), with an anchor envelope of KRW 2 trillion rising to KRW 4 trillion through 2030. In July 2025 MSIT executed the first major tranche: KRW 1.46 trillion (approx. USD 1.1 billion) to procure approximately 13,000 high-performance GPUs (NVIDIA B200 and H200) distributed across three domestic cloud operators — Naver Cloud, NHN Cloud, and Kakao. This is Korea's first PPP-structured sovereign-AI compute procurement instrument, structurally distinct from the AI Basic Act (horizontal regulatory framework) and the Semiconductor Special Act (fab investment incentives), as it directly addresses the compute- infrastructure supply constraint for AI model training and national AI research.

Commission Recommendation (EU) 2025/63 of 15 January 2025, published in the Official Journal on 16 January 2025 (CELEX 32025H0063), is the first EU-level instrument operationalising outbound-investment screening. It is a legally non-binding act that asks Member States to designate a Single Contact Point and competent national authorities by 15 March 2025 and to review outbound transactions by EU investors into third countries in three strategic sectors — advanced semiconductors, artificial intelligence, and quantum technologies — covering acquisitions, mergers, joint ventures, greenfield investments, asset/IP transfers, and venture-capital instruments completed since 1 January 2021. Member States must submit an interim update by 15 July 2025 and a comprehensive report on review outcomes and identified risks by 30 June 2026, feeding into the EU's broader Economic Security Strategy and the binding outbound-investment legislative instrument the Commission has signalled for 2026-2027.

China's Ministry of Commerce announced on 3 December 2024 (MOFCOM Announcement No. 46 of 2024) a formal ban on dual-use exports to the United States of gallium, germanium, antimony and superhard materials including diamond and cubic boron nitride. The measure also imposed strict end-use review on graphite exports to the US, with extra scrutiny of military end-uses. It came one day after BIS issued a major export- control package on 2 December 2024 expanding controls on Chinese semiconductor equipment and adding 140 entities to the Entity List, and was framed by MOFCOM as a national- security countermeasure.

The US Bureau of Industry and Security issued its largest single export-control package targeting China's semiconductor industry on 2 December 2024, with three layered measures (final rules published in the Federal Register 5 December 2024). First, controls on high-bandwidth memory (HBM) above set performance thresholds — blocking the memory architecture that is foundational to AI training. Second, additions of 24 semiconductor manufacturing equipment item types to the Commerce Control List, covering deposition, etch, ion- implant, advanced packaging, and metrology categories. Third, Entity List designations for 140+ entities, the bulk Chinese semiconductor companies + equipment makers + investment vehicles, including major Chinese fab tooling firms. The package triggered MOFCOM's same-day-following retaliation (filed: 2024-12-03-china-mofcom-ge-ga-sb-export-ban-us).

South Korea's Ministry of Trade, Industry and Energy (MOTIE), in coordination with the Ministry of Strategy and Finance, announced on 15 November 2024 amendments to the Foreign Exchange Transactions Act and the Industrial Technology Protection Act introducing a notification + review regime for outbound investments by Korean firms in advanced semiconductor manufacturing or critical-component production in "strategic concern" jurisdictions, principally China. The regulation, effective 1 April 2025, requires Korean firms whose technology is designated as a "national core technology" (NCT) to obtain MOTIE approval before establishing or expanding overseas manufacturing facilities using that technology. The list includes Samsung's HBM, SK Hynix's DRAM/NAND advanced-node processes, and certain silicon-wafer technologies.

Premier Li Qiang signed State Council Decree No. 792 on 19 October 2024 promulgating the Regulations of the People's Republic of China on Export Controls for Dual-Use Items, with effect from 1 December 2024. The regulation, organised in six chapters and 50 articles, consolidates the previously fragmented nuclear / biological / chemical / missile dual-use control regimes into a single State Council framework operationalising the 2020 Export Control Law. It introduces a control-list / temporary-control / watchlist architecture, a statutory end-user / end-use commitment regime, transit / transhipment / re-export controls, extraterritorial reach over PRC items downstream, and explicit linkage to the Anti-Foreign Sanctions Law. On 15 November 2024 MOFCOM, MIIT, GAC and SCA jointly issued Announcement No. 51 of 2024 publishing the consolidated Dual-Use Items Export Control List with a unified five-character ECCN-style coding system, also effective 1 December 2024.

On 10 October 2024 the Czech government approved the National Semiconductor Strategy, prepared by the Ministry of Industry and Trade (MPO). The strategy sets five objectives to be reached by end-2029: a 300% increase in semiconductor sector sales versus 2022, a 300% increase in semiconductor component production versus 2022, a 200% increase in exports of semiconductor technologies, growth of the specialist workforce to 9,000 experts, and the build-out of a national competence centre. The strategy is positioned as the Czech implementation track for the EU Chips Act and identifies power electronics, integrated-circuit design and semiconductor manufacturing equipment as the country's competitive niches.

The US Bureau of Industry and Security (BIS) published an interim final rule (89 FR 80064; FR doc 2024-22587) amending the Export Administration Regulations (15 CFR 748.15) to expand the Validated End User (VEU) program with a new "Data Center VEU Authorization" pathway. The rule lets BIS pre-authorize specified data-center operators in third countries to receive advanced computing integrated circuits (ECCNs 3A090, 4A090 and related) and related technology without individual export licenses, conditional on vetted security plans, end-use monitoring, and reporting. Country Group D:5 destinations — China, Russia, Iran, Belarus, Venezuela, Cuba and 17 other arms-embargoed states — are categorically excluded. Eligible destinations include Egypt, Laos, Moldova, Oman, Pakistan, Qatar, Saudi Arabia, Turkmenistan, and the UAE — extending the US chip-equipment perimeter into a managed trusted-data-center channel for Gulf, MENA, and Central Asian AI build-out.