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On 6 September 2024 the Dutch government announced an expansion of its national export-control measure on advanced semiconductor manufacturing equipment, bringing two additional ASML DUV immersion lithography systems — TWINSCAN NXT:1970i and NXT:1980i — under a Dutch national authorisation requirement for shipments to destinations outside the EU. The measure took effect on 7 September 2024 via a ministerial regulation published in Staatscourant 2024 no. 29008. Until this point those two older system variants were controlled extraterritorially through the US Foreign Direct Product Rule; the change transfers licensing authority from BIS to the Dutch government and aligns the Dutch national list more tightly with the perimeter set by the June-2023 measure on NXT:2000i+. ASML characterised the update as a "technical change" with no expected impact on its 2024 financials or longer-term outlook.

The US Bureau of Industry and Security issued a final rule on 5 September 2024 (effective 6 September 2024, published in the Federal Register on the same day as 89 FR 73285) establishing multilateral export controls on four categories of emerging technologies: (1) quantum computing items including quantum computers, related cryogenic / control / measurement systems, and certain quantum software; (2) gate-all-around field-effect transistor (GAAFET) production technology — the next-node semiconductor architecture beyond FinFET; (3) advanced additive-manufacturing equipment for metals + alloys; (4) certain biotech-related items added in a parallel rule on 12 September 2024. The rule operates without country exceptions for some categories, with multilateral coordination via Wassenaar + Australia Group + Nuclear Suppliers Group frameworks.

The US Bureau of Industry and Security (BIS) final rule (89 FR 68544; FR Doc 2024-19130) added 123 entities under 131 entries to the Entity List with destinations Russia (63), China (42), Iran (11), Turkey (8), and one each in Canada, Cyprus, Kazakhstan, Kyrgyzstan, Crimea Region of Ukraine, Ukraine, and the United Arab Emirates. The dominant rationale is Russia-diversion enforcement: Chinese, Turkish and other third-country firms (e.g., MAK Logistics, Megatek Ltd., Wellgo International, AllChips Limited, Chipgoo Electronics) named for supplying U.S.-origin electronics and dual-use items to Russian industry and military, plus designation of large numbers of Russian military manufacturers (e.g., JSC 75 Arsenal, FSE Aleksinsky Chemical Plant) as military end users. License requirement is "all items subject to the EAR" with policy/presumption of denial; case-by-case for EAR99 food and medicine to certain Russian military end users. Effective on publication 2024-08-27.

The US Bureau of Industry and Security (BIS) final rule (89 FR 55033; FR Doc 2024-14635) added six entries to the Entity List under the destinations of the People's Republic of China (2), South Africa (1), the United Arab Emirates (2), and the United Kingdom (1). The two PRC-based entries (Global Training Solutions Limited; Smartech Future Limited) were added for ties to an existing Entity List party and for training elements of the PRC military. The two UAE-based entries (Mega Fast Cargo LLC; Mega Technique General Trading) were added for repeated dilatory or evasive conduct during BIS end-use checks, including the provision of false, misleading, or incomplete information. The South Africa and United Kingdom entries were added for shipping or attempting to ship US export-controlled items to Russia in violation of EAR controls. License requirement is "all items subject to the EAR" with policy of presumption of denial. The rule is effective on publication, 2024-07-03.

President Luis Abinader signed Decreto No. 324-24 on 13 June 2024, declaring the promotion, innovation, and development of the semiconductor industry in the Dominican Republic as "alta prioridad nacional" (high national priority) and directing MICM to formulate a National Strategy for the Promotion of the Semiconductor Industry (ENFIS). The decree was published in the Official Gazette on 28 June 2024, establishing a high-level inter-ministerial coordination mechanism and linking the initiative to the free-trade-zone incentive framework under Law 8-90. ENFIS was formally launched on 19 August 2025 by President Abinader and MICM Minister Víctor Bisonó at the Día Nacional de las Zonas Francas, structuring the strategy across five pillars: Industrial Development, Governance and Policy, Workforce and Human Capital, Investment Attraction, and Innovation and R&D Ecosystem.

The Diet enacted on 31 May 2024 (promulgated 7 June 2024 as Law No. 45 of 2024) the "Act on Partially Amending the Act on Strengthening Industrial Competitiveness and Other Acts to Create New Business and Encourage Investment in Industries". The provisions establishing Japan's first US IRA-style production-and-sales-linked tax credit took effect 2 September 2024 per METI's press release of the same date. Eligible enterprises with a METI-certified business plan can claim tax deductions tied to domestic production-and-sales volume of five designated strategic products: electric vehicles, green steel, green chemicals, sustainable aviation fuel (SAF), and semiconductors. The credit is available for ten years from certification (certifications must be issued by 31 March 2027), with an annual cap of 40% of corporate tax liability (20% for semiconductors) and a 4-year carry-forward. Eligibility is conditional on meeting wage-growth or capital-investment thresholds in each fiscal year.

Prime Minister Anwar Ibrahim launched Malaysia's National Semiconductor Strategy (NSS) on 28 May 2024 in his keynote at SEMICON Southeast Asia, with implementation led by MITI. The NSS commits at least RM25 billion (~USD 5.3 billion) in fiscal support over a ten-year horizon and structures the chip industrial policy in three sequential phases: (1) shoring up Malaysia's existing strength in outsourced semiconductor assembly and test (OSAT) and back-end packaging, (2) moving domestic firms into integrated-circuit (IC) design, advanced packaging and advanced manufacturing equipment, and (3) developing Malaysian-owned global champions across the chip value chain under a "Made by Malaysia" framing. Headline targets include developing 10 local design and advanced- packaging companies with revenues between RM1 billion and RM4.7 billion, 100 broader semiconductor-related companies near the RM1 billion revenue mark, and training 60,000 high- skilled engineers. The RM25 billion envelope decomposes into RM5 billion in tax forgone over five years, RM2 billion for existing capital grants, RM1.25 billion for an HRD Fund semiconductor allocation, RM2 billion for a Semiconductor Industrial Park, RM1.59 billion for an Advanced Packaging Centre, plus RM2 billion each for the National Energy Transition Facility and Green Tech Financing Scheme. By June 2025, the government reported RM70.7 billion in announced investments attracted under the NSS umbrella.

China registered the National Integrated Circuit Industry Investment Fund III Co., Ltd. ("Big Fund III") in Beijing on 24 May 2024 with RMB 344 billion (~USD 47.5 billion) of registered capital — the largest single capital raise of the three Big Fund phases (Phase I 2014: RMB 138.7bn; Phase II 2019: RMB 204bn). Nineteen state-owned investors contribute, led by the Ministry of Finance (17% / RMB 60bn) and the six largest state-owned commercial banks (ICBC, ABC, BoC, CCB ~6.25% each at RMB 21.5bn; BoCom RMB 20bn; PSBC RMB 8bn). Duration 15 years (24 May 2024 → 23 May 2039). The fund explicitly targets the chokepoints exposed by US BIS October 2022/2023/2024 controls — semiconductor manufacturing equipment, advanced memory (HBM/DRAM), AI accelerators, and third-generation compound semiconductors (SiC, GaN).

Japan's National Diet enacted the Act on the Protection and Use of Critical Economic Security Information (重要経済安保情報の保護及び活用に関する法律, Act No. 27 of 2024) on 10 May 2024; it was promulgated on 17 May 2024 and came into full operation on 16 May 2025. The law establishes Japan's first peace-time economic-security clearance regime extending to private-sector employees. It designates "Critical Economic Security Information" (CESI) covering threat-intelligence on critical-infrastructure cyber attacks, regulatory-review information on essential infrastructure, and vulnerability data on critical-product supply chains; mandates Cabinet Office "適性評価" (suitability assessment) for cleared personnel; and imposes criminal penalties of up to five years' imprisonment for unauthorised disclosure. The CESI Act complements the 2022 Economic Security Promotion Act (ESPA), closing the information-protection gap and aligning Japan's framework with Five Eyes and EU partners for joint R&D and dual-use cooperation.

The US Bureau of Industry and Security (BIS) final rule (89 FR 41706; FR Doc 2024-10485) added 37 entities under 37 entries to the Entity List, all listed under the destination of the People's Republic of China. BIS designated these parties for one or more of three rationales: (i) shipping US-controlled items to Russia in violation of EAR controls, (ii) attempting to acquire US-origin items to support China's military modernisation or quantum-technology capabilities, and (iii) ties to the PRC high-altitude balloon that overflew the United States in late January–early February 2023. The designations span PRC technology companies (predominantly quantum-computing firms), manufacturing companies, and research institutes. License requirement is "all items subject to the EAR" with a policy of presumption of denial and no license exceptions available. The rule is effective 2024-05-09, with publication in the Federal Register on 2024-05-14.

The US Bureau of Industry and Security (BIS) final rule (89 FR 25503; FR Doc 2024-07760) added 11 entries to the Entity List under China (6), Russia (3), and the United Arab Emirates (2), effective 2024-04-11. The primary rationale for the Russia and UAE tranches — and at least one China entity (Shenzhen Jiasibo Technology) — is procurement of US-controlled dual-use aerospace and UAV components for Iran's Shahed- series UAV programme via the Iran Aircraft Manufacturing Industrial Company (HESA); those drones have been used against oil tankers in the Middle East and deployed by Russia in Ukraine. The remaining five China entities were designated for acquiring US-origin items to support China's military modernisation. The rule also adds one alias to the existing entry for Shanghai Biren Intelligent Technology Co., Ltd. This action was the first Entity List final rule published after BIS implemented the 50 Percent Rule for controlling foreign subsidiaries of listed entities.

On April 4, 2024, the Bureau of Industry and Security published an interim final rule (89 FR 23876) providing corrections, clarifications, and targeted revisions to the October 2023 advanced-computing and semiconductor manufacturing equipment rules. The most substantive change splits the former License Exception NAC (Notified Advanced Computing) into two separate exceptions: NAC (retaining the 25-day prior notification requirement) and a new ACA (Advanced Computing Authorized) exception that permits certain shipments without advance notification. The rule also adds ECCN 4A090.b covering computers and assemblies containing advanced ICs, restores national-security controls to several ECCNs, and addresses various technical drafting errors from the October 2023 rules.

The Dutch Council of Ministers on 28 March 2024 approved Project Beethoven, a EUR 2.51 billion public-investment package for the Brainport-Eindhoven semiconductor ecosystem. The package combines EUR 1.28 billion from the Nationaal Groeifonds, EUR 450 million in additional central- government education/talent spending, and EUR 780 million in regional co-funding from the Province of Noord-Brabant and the Municipality of Eindhoven. Investment pillars cover infrastructure (mobility, road capacity on A2/A58/A67, energy-grid reinforcement), a national semiconductor-talent plan targeting 2,000 master's-programme graduates per year by 2030, 16,000+ new housing units in the Brainport region, and quality-of-life improvements. The Government stated it expects these measures to lead ASML to continue to invest and maintain its statutory and tax domicile in the Netherlands.

BIS amends the Export Administration Regulations (EAR) to clarify controls on radiation hardened integrated circuits (rad-hard ICs) and equipment — including computer and telecommunications devices — that incorporate them. The rule affirms the availability of License Exception GOV for rad-hard ICs acquired pursuant to an official written request or directive from the Department of Defense or Department of Energy. It also expands License Exception GOV to cover microelectronics exports, reexports, and in-country transfers made under U.S. Government contracts that explicitly provide for such transactions, removing export-control obstacles for official government business. Published at 89 FR 18353–59 (FR Doc 2024-05267), effective on publication date.

The US Bureau of Industry and Security (BIS) final rule (89 FR 14385; FR Doc 2024-03969; Docket 240215-0050; RIN 0694-AJ54) added 93 entities under 95 entries to the Entity List, effective 23 February 2024, with destinations Russia (63), Turkey (16), China (8), UAE (4), Kyrgyzstan (2), India (1), and South Korea (1). The dominant rationale is enforcement of Russia-diversion controls: 46 Russian defense manufacturers are designated as military end users acquiring US-origin items for Russia's armed forces, five Chinese entities (including Dennex Enterprises Limited and Shenzhen Speed Industrial Materials Co.) are cited for facilitating diversion of controlled microelectronics to Russia, and 16 Turkish firms are cited as procurement hubs obtaining US-origin items of importance to Russia's war effort. Four UAE entities are designated for transshipment networks serving both Russia and Iran. All entities are subject to a presumption of denial for EAR-controlled items; Russian military end users are additionally subject to the Russia/Belarus FDP rule (15 CFR 734.9(g)).

METI committed up to 732 billion yen (~US$4.86 billion) in direct subsidies for Japan Advanced Semiconductor Manufacturing K.K. (JASM) to build a second wafer fab adjacent to the first JASM facility in Kikuyo, Kumamoto Prefecture. Confirmed by METI Minister Ken Saito at the Fab 1 opening ceremony on 24 February 2024, two weeks after TSMC, Sony Semiconductor Solutions, Denso, and Toyota jointly announced the Fab 2 expansion (6 February 2024). Fab 2 will produce 6/7nm and 40nm logic for automotive, industrial, consumer, and HPC end-markets, with combined Fab 1 + Fab 2 capacity exceeding 100,000 12-inch wafers per month. Construction targets year-end 2024; operations target year-end 2027. Combined with the 476 billion yen Fab 1 grant, total JASM subsidies reach ~1.208 trillion yen, the largest single direct manufacturing subsidy in Japanese history. METI conditions require >=10 years of post-startup production and >=50% Japanese-domestic procurement of silicon wafers, materials, and components.

On 25 October 2023 the Bureau of Industry and Security published an interim final rule (88 FR 73424; FR Doc 2023-23055) making substantive revisions to the October 7 2022 advanced-computing IFR, incorporating 43 public comments covering 78 topics. The rule replaced the prior TOPS-based performance metric with a new "Total Processing Performance" (TPP) / performance-density dual-threshold structure for ECCN 3A090, splitting the control into tiers 3A090.a (full licence requirement for highest-capability datacenter AI chips) and 3A090.b (new License Exception NAC with 25-day prior notification for the intermediate tier). Geographic scope was expanded from China-and-Macau to Country Groups D:1/D:4/D:5 to block diversion via third-country intermediaries and offshore datacenters.

The US Bureau of Industry and Security issued an interim final rule on 17 October 2023 that substantially expanded the advanced-computing and semiconductor manufacturing controls first imposed in October 2022. The rule closed the performance-threshold workaround that NVIDIA had used to ship China-specific A800/H800 GPUs, replacing it with a "performance density" metric and adding a new "Notified Advanced Computing" licence category. It expanded controls on chipmaking equipment (additional ECCNs covering deposition, etch, metrology), pulled 21 additional countries (mostly Middle East / Central Asia) into a regional licensing scheme to prevent transshipment, and added 13 Chinese entities to the Entity List including AI-chip designers.

Regulation (EU) 2023/1781, published in the Official Journal on 18 September 2023 and in force from 8 October 2023, establishes the EU Chips Act: a three-pillar framework targeting 20% of global semiconductor production by 2030 (up from approximately 9% in 2022) by mobilising EUR 43bn in public and private investment. Pillar 1 (Chips for Europe Initiative, EUR 3.3bn committed from EU budget) funds R&D, pilot production lines, and design infrastructure. Pillar 2 creates a fast-track permitting regime for "Integrated Production Facilities" (IPFs) and "Open EU Foundries" (OEFs) that qualify as being in the Union's interest. Pillar 3 establishes a supply-chain monitoring mechanism and grants the Commission power to mandate priority orders from designated facilities during a declared semiconductor crisis.

Decree-Law No. 104 of 10 August 2023 ("Decreto Asset" / Omnibus Decree, GU n.186 of 10 Aug 2023, in force 11 Aug 2023) was converted with amendments into Law No. 136 of 9 October 2023 (GU n.236 of 9 Oct 2023). The conversion law materially expanded Italy's "Golden Power" foreign-direct-investment screening regime (DL 21/2012). Two key extensions: (i) intra-group transactions involving entities outside the EU are no longer exempt from the exercise of special powers — only the prior notification carve-out was preserved; (ii) acts, resolutions and operations concerning intellectual-property rights in artificial intelligence, semiconductor production, cybersecurity, aerospace, energy storage, quantum and nuclear technologies, and food production technologies fall within scope when one or more counter-parties sit outside the EU. The Prime Minister also obtained an explicit veto power over transactions creating "exceptional situations" not already covered by sectoral or EU prudential / merger rules, including those touching qualifying holdings in the financial sector.

On 9 August 2023 the German Federal Cabinet adopted the government draft Wirtschaftsplan 2024 of the Climate and Transformation Fund (Klima- und Transformationsfonds, KTF) and the accompanying 2024–2027 financial plan. The plan envisaged ca. EUR 211.8 bn of programme spending across 2024–2027 (EUR 57.6 bn in 2024 alone), funded by national and European emissions-trading revenues plus federal grants, with major lines for semiconductor production (~EUR 4.0 bn in 2024), hydrogen industry build-out (~EUR 3.8 bn), building renovation (~EUR 18.9 bn), EEG renewables support (~EUR 12.6 bn) and electric mobility. The KTF is the principal German federal vehicle for co-financing the EU Chips Act state-aid envelope, IPCEI Hydrogen, decarbonisation contracts (Klimaschutzverträge) and other net-zero-aligned industrial-policy subsidies.

President Biden signed Executive Order 14105 on 9 August 2023, "Addressing United States Investments in Certain National Security Technologies and Products in Countries of Concern", establishing the first dedicated US outbound-investment screening regime. The EO directs Treasury to prohibit or require notification of US investments in Chinese (and Hong Kong, Macau) entities engaged in three categories of technology: (1) semiconductors and microelectronics, (2) quantum information technologies, (3) artificial intelligence systems. After a public-comment process, Treasury issued the final rule (31 CFR Part 850) on 28 October 2024, effective 2 January 2025.

The Knesset enacted the Law for Encouragement of Knowledge-Intensive Industry (Temporary Order), 5783-2023 on 25 July 2023; it took effect on publication in Reshumot on 31 July 2023 and is scheduled to remain in force through 31 December 2026. The law — informally the "Angels Law" — packages four tax incentives aimed at sustaining Israel's high-tech sector: a capital-gains-rate-equivalent tax credit for individuals investing in Israeli R&D start-ups, capital-gains deferral on reinvestment of proceeds from Israeli tech-company share sales, five-year amortisation of net acquisition costs when Israeli technological companies acquire other (Israeli or foreign) hi-tech companies, and a withholding-tax exemption on interest paid by Israeli high-tech companies to foreign financial institutions. Beneficiaries are limited to companies with Preferred Technological Enterprise (PTE) status or R&D Company designation under the Israeli Encouragement of Capital Investments Law.

China's Ministry of Commerce and General Administration of Customs jointly announced an export licensing regime covering eight gallium-related items (including gallium metal, gallium arsenide, gallium nitride wafers and ingots) and six germanium- related items (including germanium metal, germanium oxide, germanium tetrachloride). Effective 1 August 2023, exporters must obtain a dual-use-item licence from MOFCOM citing the end-user and end-use, with licences granted at MOFCOM's discretion. The measure was framed as protecting national security and interests, though the timing immediately followed the Dutch ASML DUV controls and US chip-equipment escalations.

The Dutch government announced on 30 June 2023 a new national export-licensing requirement covering specific advanced semiconductor manufacturing equipment, most prominently ASML's TWINSCAN NXT:2000i and subsequent DUV immersion lithography systems used at ≤14/16nm logic, advanced DRAM, and advanced 3D NAND production. Effective from 1 September 2023 via the national Strategic Goods Decree, the rule completes the trilateral US-Japan-Netherlands chip-equipment perimeter initiated by the January 2023 trilateral agreement. Although nominally country-neutral, the BIS Foreign Direct Product Rule means licences for shipments to "countries of concern" — read: China — face a presumption of denial. Subsequent guidance in 2024 expanded coverage to additional TWINSCAN NXT:1970Ci and 1980Di system variants.

Japan's Ministry of Economy, Trade and Industry (METI) announced on 31 March 2023 amendments to the Foreign Exchange and Foreign Trade Act adding 23 categories of advanced semiconductor manufacturing equipment to the export-licensing list. The measure, effective from 23 July 2023, is the Japanese counterpart to the US October 2022 BIS rule (filed: 2022-10-07-us-bis-advanced-ai-chip-controls-china) and the Dutch DUV controls. Items covered span lithography (mostly ArF and KrF), deposition (CVD, ALD, sputtering), etch, and cleaning + advanced inspection — broadly the toolset used at ≤14/16nm logic, advanced DRAM, and advanced 3D NAND. The controls are formally non-discriminatory but in practice capture exports to China; non-China destinations get general licences.

The Korean National Assembly passed an amendment to the Restriction of Special Taxation Act (조세특례제한법, Act No. 19234) on 30 March 2023, promulgated 31 March 2023 and retroactive to 1 January 2023. The amendment enhanced the investment tax credit (ITC) for "national strategic technology" (국가전략기술) semiconductor facility investment: large companies receive a 15% ITC on qualifying capital expenditure (up from 8% in the December 2022 base version); small and medium enterprises receive 25%. An additional temporary 10% incremental credit applies for annual investment exceeding the prior 3-year average (effective 2023-2025). Internationally termed the "K-Chips Act," the measure directly mirrors the US CHIPS Act's 25% advanced- manufacturing investment tax credit. Principal beneficiaries are Samsung Electronics (Samsung Foundry plus DRAM/NAND capex of KRW 20-30 trillion per year) and SK Hynix (memory fabs at Icheon and Cheongju, HBM expansion). In the same session the National Assembly passed companion legislation on secondary-battery (EV) investment with equivalent credit rates. The Korean government projected annual tax savings for the semiconductor sector of approximately KRW 1-2 trillion.

BIS amended the Commerce Control List (CCL) under the Export Administration Regulations (EAR) to implement decisions agreed at the December 2021 Wassenaar Arrangement Plenary meeting, revising 16 ECCNs across computing, electronics, lasers, sensors, and aerospace domains. The most operationally significant change raised the Adjusted Peak Performance (APP) threshold for digital computers under ECCN 4A003.b from 29 to 70 Weighted TeraFLOPS (WT), reducing the licensing burden for high-performance computing exports to Wassenaar partner countries while preserving controls to non-partners. Corresponding revisions to License Exception APP (15 CFR Part 740) and License Exception Strategic Trade Authorization (STA) align the broader EAR framework with the updated multilateral thresholds.

BIS published an interim final rule on January 18, 2023 (88 FR 2821, FR Doc 2023-00888) extending to Macau the same advanced computing and semiconductor manufacturing controls originally imposed on China by the October 7, 2022 rule. The extension closes a diversion loophole created by Macau's status as a Special Administrative Region of China, applying equivalent license requirements for advanced computing ICs, equipment used in ≤14 nm logic and advanced NAND/DRAM fabrication, and supercomputer end-use restrictions. The rule also includes entity list modifications and took effect one day before Federal Register publication (January 17, 2023).

The Legislative Yuan of Taiwan (ROC) passed amendments to Articles 10-2 and 72 of the Statute for Industrial Innovation ("產業創新條例") on third reading on 7 January 2023. The amendment, internationally termed the "Taiwan Chips Act," is implemented from 1 January 2023 to 31 December 2029. Article 10-2 grants Taiwan-registered companies that occupy key positions in international supply chains a 25% investment tax credit on qualifying forward-looking innovative R&D expenditure (capped at 30% of the year's profit-seeking enterprise income tax payable), plus a 5% credit on the purchase of brand-new machinery or equipment used in own-account advanced manufacturing processes (also capped at 30%). Eligibility thresholds set by the Ministry of Finance require annual R&D spend of at least NT$6bn, R&D intensity (R&D / net operating revenue) of at least 6%, and an effective tax rate of at least 15% (12% for FY2023 only); the 5% equipment credit additionally requires equipment expenditure of at least NT$10bn. The measure is Taiwan's principal supply- side response to the US CHIPS Act, the EU Chips Act, the K-Chips Act, and Japan's METI subsidy programme, and is designed to retain TSMC, MediaTek, and other leading-edge silicon investment onshore as overseas subsidies pull capacity to Arizona, Kumamoto, Dresden, and elsewhere.

The Bureau of Industry and Security added 36 entities — 35 in China, 1 in Japan — to the Entity List under a presumption of denial for all EAR-controlled items, effective December 16, 2022. The most consequential additions are Yangtze Memory Technologies (YMTC, simultaneously removed from the Unverified List), eight Cambricon AI-chip subsidiaries, and Shanghai Micro Electronics Equipment (SMEE), China's sole domestic lithography producer. Three existing entries were revised: CETC 13 and two affiliates gained a Footnote 3 Russian-military-end-user designation, bringing them under the Russia/Belarus Foreign Direct Product rule with a blanket denial policy.

The US Bureau of Industry and Security imposed broad new controls on the export of advanced computing chips, chipmaking equipment, and US-person services supporting Chinese semiconductor fabrication. The October 7 2022 rule blocked supply of GPUs above set performance thresholds (initially 600 GB/s interconnect / 4800 TOPS) to China and added end-use restrictions on manufacturing tools used in advanced (≤14/16 nm logic, ≤18 nm DRAM, ≤128-layer NAND) facilities, with a foreign direct product rule extending coverage globally.

The Bureau of Industry and Security (BIS) added 31 Chinese entities — including Yangtze Memory Technologies Co., Ltd. (YMTC), China's largest NAND flash manufacturer — to the Unverified List (UVL), suspending license exceptions and requiring end-user statements for all EAR-controlled items destined to these parties. BIS simultaneously removed nine Chinese entities previously on the UVL after successfully completing end-use checks. The rule also established a new 60-day UVL-to-Entity-List escalation clock and clarified that sustained host-government obstruction of end-use checks constitutes independent grounds for Entity List designation — a structural enforcement change aimed at closing China's pattern of blocking BIS post-shipment verification visits.

The Bureau of Industry and Security (BIS) amended the Commerce Control List (CCL) under the Export Administration Regulations (EAR) to implement four emerging and foundational technology decisions agreed at the December 2021 Wassenaar Arrangement Plenary meeting, pursuant to ECRA Section 1758. The rule adds new export controls on ultra-wide bandgap semiconductor substrates (gallium oxide Ga₂O₃ and diamond), ECAD software for Gate-All- Around Field-Effect Transistor (GAAFET) integrated circuit development, and Pressure Gain Combustion (PGC) technology for advanced gas turbine engines. Controls require a licence for items destined to countries listed in the NS:1 and AT:1 columns of the Commerce Country Chart; ECAD software controls (ECCN 3D006) have a delayed compliance date of October 14, 2022.

The CHIPS and Science Act (Public Law 117-167), signed into law by President Biden on 9 August 2022, appropriated $52.7 billion in direct semiconductor industry support: $39B in manufacturing incentives administered by the Commerce Department, $13.2B for R&D and workforce, and $0.5B for legacy-chip and supply-chain programs. It also created an Advanced Manufacturing Investment Credit (Section 48D) — a 25% refundable investment tax credit on qualified semiconductor manufacturing property. The law included a "guardrails" clause prohibiting recipients from expanding advanced-node capacity in countries of concern (most prominently China) for 10 years following award.

The Spanish Council of Ministers approved on 24 May 2022 the Strategic Project for the Recovery and Economic Transformation of Microelectronics and Semiconductors (PERTE Chip) within the framework of the Plan de Recuperacion, Transformacion y Resiliencia (financed in large part by NextGenerationEU funds). The package commits a public envelope of roughly EUR 12.25bn through 2027 across four lines: scientific R&D capacity (~EUR 1.165bn), chip design including fabless companies (~EUR 1.330bn), manufacturing-plant construction including front-end below-5nm and above-5nm fabs (~EUR 9.350bn), and dynamisation of ICT/electronics manufacturing including a venture fund for semiconductor startups (~EUR 0.400bn). The Sociedad Espanola para la Transformacion Tecnologica (SETT), formally constituted by Real Decreto 676/2024 of 16 July 2024, is the operational vehicle managing more than EUR 10.75bn of the envelope.

The Act on the Promotion of Ensuring National Security through Integrated Implementation of Economic Measures (Law No. 43 of 2022), enacted 18 May 2022, establishes a four-pillar framework: (1) supply-chain resilience for "specified critical products," (2) security of critical infrastructure, (3) state-backed development of "specified critical technologies," and (4) non-disclosure of nationally sensitive patents. A December 2022 Cabinet Order designated 11 product categories as specified critical products, including semiconductors, storage batteries, permanent magnets, cloud programs, LNG, critical minerals, machine tools, and aircraft parts. Competent ministries must publish stable-supply plans, can fund private-sector surveys, and may provide subsidies to qualifying firms.

The Wet veiligheidstoets investeringen, fusies en overnames ("Vifo Act") is the Netherlands' cross-sector statutory FDI screening regime. Adopted by the States-General on 18 May 2022 (Stb. 2022, 215) and entered into force on 1 June 2023 together with two implementing decrees (Stb. 2023, 173 — main implementing decree; Stb. 2023, 172 — decree defining the scope of "sensitive technology"), the Act establishes mandatory pre-closing notification and a security review by the Bureau Toetsing Investeringen (BTI, part of the Ministry of Economic Affairs and Climate) for transactions affecting (i) "vital providers" in critical infrastructure sectors — energy, transport, telecoms, port operators, banking infrastructure — and (ii) Dutch undertakings active in "sensitive technology", defined to include EU Reg 2021/821 Annex I dual-use items, military goods, and additional national-security technologies. The regime applies retrospectively to transactions completed after 8 September 2020. It is the foundational instrument under which the Dutch national export-control measures on ASML DUV immersion lithography (filed: 2023-06-30 and 2024-09-07) operate, and the Dutch peer of US CFIUS, EU Regulation 2019/452, the German AWG §§55-62, the French Décret 2014-479 / R. 151-1 et seq., and the UK NSI Act 2021.

METI committed 476 billion yen (~$3.3bn) in direct subsidies covering approximately half the construction cost of Japan Advanced Semiconductor Manufacturing K.K. (JASM), a purpose-built joint venture fab at Kikuyo Town, Kumamoto Prefecture. JASM shareholders are TSMC (86.5%), Sony Semiconductor Solutions (6%), Denso (6%), and Toyota Motor (1.5 %). The fab manufactures 12nm, 16nm, 22nm, and 28nm mature-node chips targeting automotive-grade, industrial, and IoT applications. A groundbreaking ceremony was held on 13 April 2022; the facility officially opened on 24 February 2024 and reached commercial production in December 2024. JASM represents Japan's first new leading-edge wafer fab in decades and the largest single foreign direct investment in Japanese manufacturing history.

BIS amended the Commerce Control List (CCL) under the Export Administration Regulations (EAR) to implement decisions agreed at the December 2019 Wassenaar Arrangement Plenary meeting, revising 22 ECCNs across nine CCL categories — including nuclear and conventional arms-related items, materials, manufacturing equipment, semiconductors, laser/sensor systems, and aerospace. The rule harmonises US controls with those of Wassenaar Participating States, maintaining competitive parity among allied exporters while preserving national-security licensing for non-partner destinations. Separately, the rule eliminated email notification and self-classification reporting obligations for most mass-market encryption products and publicly available encryption source code, reducing associated compliance submissions by an estimated 60–80%.

The Bureau of Industry and Security issued a correcting amendment to its September 11, 2020 Final Rule implementing Wassenaar Arrangement 2018 Plenary decisions, which had inadvertently introduced errors into six Export Control Classification Numbers (ECCNs) on the Commerce Control List (CCL). The correction revises memory-technology terminology in ECCN 3A001 from enumerated chip types (EEPROMs, flash, MRAMs) to the consolidated term "non-volatile memories" (with an added Technical Note), and removes a redundant "Mega Samples Per Second" label from ECCN 3A002 subparagraphs. Errors in ECCNs 3A991, 5A002, 7A005, and 9E003 are also rectified. No new export controls are introduced; the correction restores the policy intent of the parent rule and resolves ambiguities that could affect classification determinations.

BIS published an interim final rule on 5 October 2020 implementing multilateral export controls on six emerging technology categories agreed at the December 2019 Wassenaar Arrangement Plenary meeting, revising Commerce Control List ECCNs 2B001, 3D003, 3E004, 5A004, 5D001, and 9A004. The six technologies are: hybrid additive-manufacturing/CNC machine tools; computational lithography software for extreme-ultraviolet (EUV) mask fabrication; wafer-finishing technology for 5 nm-node production; digital forensics tools that circumvent device authentication to extract raw data; software for monitoring and analysis of communications acquired from a handover interface; and sub-orbital craft. As the first of two US implementing actions for the 2019 Wassenaar Plenary, this rule elevated nascent commercial technologies into permanent CCL classifications enforceable against all non-EAR99 destinations.